公开(公告)号：US20210050336A1

公开(公告)日：2021-02-18

申请号：US16992004

申请日：2020-08-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jamyeong KOO ,  Sungyong MIN ,  Byunghoon LEE ,  Changjoon LEE ,  Changkyu CHUNG ,  Youngkyong JO

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075

Abstract: A micro LED display manufacturing method according to various embodiments may include: a first operation of bonding an anisotropic conductive film including a plurality of conductive particles onto one surface of a prepared substrate, the one surface including a circuit part; a second operation of forming a bonding layer on the anisotropic conductive film; a third operation of positioning a plurality of micro LED chips above the bonding layer, the micro LED chips being arranged on a carrier substrate while being spaced a first distance apart from the substrate; a fourth operation of attaching the plurality of micro LED chips onto the bonding layer by means of laser transfer; and a fifth operation of forming a conductive structure for electrically connecting a connection pad to the circuit part through the conductive particles by means of heating and pressurizing.

公开(公告)号：US20250081688A1

公开(公告)日：2025-03-06

申请号：US18951127

申请日：2024-11-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mingyu LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Jamyeong KOO ,  Sera KWON ,  Byunghoon LEE ,  Yoonsuk LEE ,  Changkyu CHUNG

IPC: H01L33/56 ,  H01L25/075 ,  H01L33/62

Abstract: A display module includes a plurality of inorganic light-emitting elements, a substrate including a mounting surface on which the plurality of inorganic light-emitting elements are mounted, and a non-conductive film (NCF) disposed on the substrate and configured to bond the plurality of inorganic light-emitting elements to the substrate. The NCF may have a black-based color.

公开(公告)号：US20210066243A1

公开(公告)日：2021-03-04

申请号：US17010231

申请日：2020-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byunghoon LEE ,  Sungyong MIN ,  Changjoon LEE ,  Jamyeong KOO

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075

Abstract: A method for manufacturing a micro light emitting diode (LED) display is provided. The method includes a first operation of applying a light-to-heat conversion layer to a first surface of a carrier substrate, a second operation of forming a first adhesive layer on the light-to-heat conversion layer a third operation of aligning a plurality of micro LED chips on the first adhesive layer, a fourth operation of positioning the plurality of micro LED chips above a circuit board at a first distance, a fifth operation of radiating a laser to the plurality of micro LED chips, and a sixth operation of causing the first adhesive layer to be deformed by the light-to-heat conversion layer, so that the plurality of micro LED chips are detached from the first adhesive layer to be attached to the circuit board. Various other embodiments are possible.

公开(公告)号：US20200152845A1

公开(公告)日：2020-05-14

申请号：US16678106

申请日：2019-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byunghoon LEE ,  Jamyeong KOO

IPC: H01L33/62 ,  H01L25/075

Abstract: A micro-LED mounting structure includes a first layer having a conductive pad disposed on a surface thereof, a second layer including a first surface, a second surface opposite the first surface and disposed on the surface of the first layer, and a via-hole extending from the conductive pad of the first layer to the first surface and including a conductive material, and a micro-LED disposed on the first surface of the second layer to be electrically connected with the conductive material included in the via-hole. The via-hole includes a first opening in the first surface of the second layer and in which the conductive material is formed, the conductive material of the first surface provides a conductive area on a portion of the first surface of the second layer, and the conductive area and an area within a specified area of the conductive area define a substantially flat surface.

公开(公告)号：US20230387372A1

公开(公告)日：2023-11-30

申请号：US18205312

申请日：2023-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Jamyeong KOO ,  Sera KWON ,  Byunghoon LEE ,  Changkyu CHUNG

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/58 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/58 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L2224/30505 ,  H01L2224/30517 ,  H01L2224/3003 ,  H01L2224/3011 ,  H01L2224/32145 ,  H01L2924/12041 ,  H01L2224/2919 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2924/0132

Abstract: Provided is a display assembly including a plurality of light emitting diodes, a plurality of electrodes provided on the plurality of light emitting diodes, a substrate, a plurality of electrode pads provided on the substrate, the plurality of electrode pads being connected to the electrodes provided on the plurality of light emitting diodes, and an adhesive layer fixing the plurality of light emitting diodes to the substrate, wherein the adhesive layer includes a non-conductive polymer resin, a flux agent mixed with the non-conductive polymer resin, and a plurality of conductive particles dispersed in the non-conductive polymer resin and connecting the electrodes of the light emitting diodes and the plurality of electrode pads.

公开(公告)号：US20220085265A1

公开(公告)日：2022-03-17

申请号：US17456838

申请日：2021-11-29

Applicant: Samsung Electronics Co., Ltd. ,  RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

Inventor： Byunghoon LEE ,  Taeil KIM ,  Jamyeong KOO ,  Juseung LEE

IPC: H01L33/62 ,  H01L25/16 ,  H01L23/00

Abstract: Various embodiments of the disclosure disclose a method for manufacturing a micro Light Emitting Diode (LED) display. The disclosed manufacturing method may include coating a face of a substrate including a circuit portion with a first thickness of a polymer adhesive solution containing a plurality of metal particles, attaching an array of micro LED chips on the polymer adhesive solution, physically connecting a connection pad for each of the array of micro LED chips to the metal particles through heating and pressing the attached plurality of micro LED chips to descend through the polymer adhesive solution, and chemically bonding the metal particles to the connection pad and the circuit portion through heating and pressing so that the micro LED chips are electrically connected to the circuit portion. Various other embodiments are also possible.

公开(公告)号：US20210265327A1

公开(公告)日：2021-08-26

申请号：US17253645

申请日：2019-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jamyeong KOO ,  Youngkyong JO ,  Byunghoon LEE

IPC: H01L25/13 ,  H01L33/62 ,  H01L23/00

Abstract: A micro-LED display and a method for manufacturing same are disclosed. The disclosed micro-LED display may comprise: a circuit board; at least one first electrode formed on the circuit board; at least one micro-LED chip bonded onto the first electrode; a second electrode formed on the micro-LED chip; a bonding structure formed by heating the first electrode and the second electrode through laser irradiation; and at least one composite resin part supporting the bonding structure.