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11.
公开(公告)号:US11764459B2
公开(公告)日:2023-09-19
申请号:US18147270
申请日:2022-12-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Juneseok Lee , Junsig Kum , Kwanghyun Baek , Dohyuk Ha , Jinsu Heo , Youngju Lee , Jungyub Lee
CPC classification number: H01Q1/2283 , H01Q1/243 , H01Q9/0435 , H01Q9/42 , H04B7/0617 , H05K1/189
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
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公开(公告)号:US11464109B2
公开(公告)日:2022-10-04
申请号:US16876501
申请日:2020-05-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanghyun Baek , Juneseok Lee , Dohyuk Ha , Youngju Lee , Jinsu Heo
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic apparatus is provided. The electronic apparatus includes a printed circuit board (PCB), an antenna module mounted on a surface of the printed circuit board, and a radio frequency integrated circuit (RFIC) module mounted on another surface of the printed circuit. The printed circuit board includes a coaxial plated through-hole (PTH) electrically connected with the antenna module and the RFIC.
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公开(公告)号:US11309621B2
公开(公告)日:2022-04-19
申请号:US16844706
申请日:2020-04-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanghyun Baek , Dohyuk Ha , Youngju Lee , Jungyub Lee , Juneseok Lee , Jinsu Heo
Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module includes a first printed circuit board (PCB) stacked at least one layer, and a second PCB disposed on an upper surface of the first PCB and stacked at least one layer. The antenna module further includes a wireless communication chip disposed on an upper surface of the second PCB and controlling an electrical signal for a radio frequency, a first structure disposed on the upper surface of the first PCB and surrounding the upper surface of the first PCB, a first antenna disposed on an inner surface of the first structure to face the first PCB, and a feed line electrically connecting the first antenna and the wireless communication chip.
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公开(公告)号:US11063370B2
公开(公告)日:2021-07-13
申请号:US17063918
申请日:2020-10-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanghyun Baek , Seungtae Ko , Kijoon Kim , Juho Son , Sangho Lee , Youngju Lee , Jungyub Lee , Yonghun Cheon , Dohyuk Ha
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号:US11050165B2
公开(公告)日:2021-06-29
申请号:US17062990
申请日:2020-10-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanghyun Baek , Seungtae Ko , Kijoon Kim , Juho Son , Sangho Lee , Youngju Lee , Jungyub Lee , Yonghun Cheon , Dohyuk Ha
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号:US12300898B2
公开(公告)日:2025-05-13
申请号:US18192910
申请日:2023-03-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sanghoon Park , Kwanghyun Baek , Juneseok Lee , Dohyuk Ha , Jungho Park , Youngju Lee , Jungyub Lee , Jinsu Heo
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.
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公开(公告)号:US12218407B2
公开(公告)日:2025-02-04
申请号:US17946688
申请日:2022-09-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Juneseok Lee , Youngsub Kim , Sanghoon Park , Jungho Park , Kwanghyun Baek , Youngju Lee , Jungyub Lee , Dohyuk Ha , Jinsu Heo
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.
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公开(公告)号:US12027774B2
公开(公告)日:2024-07-02
申请号:US17754893
申请日:2020-10-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dohyuk Ha , Kwanghyun Baek , Juneseok Lee , Jinsu Heo , Youngju Lee , Jungyub Lee
CPC classification number: H01Q21/065 , H01Q1/2283 , H01Q13/06 , H01Q21/0025 , H01Q21/0075 , H01Q21/064
Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting higher data transmission rates than a 4th generation (4G) communication system such as long-term evolution (LTE). An antenna module in a wireless communication system includes: a printed circuit board (PCB); a radio frequency integrated circuit (RFIC); and a plurality of antenna elements for emitting a radio frequency (RF) signal, wherein the plurality of antenna elements may be disposed in a first area of a first surface of the PCB, and the RFIC may be disposed in a second area, different from the first area, of the first surface of the PCB.
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19.
公开(公告)号:US11545733B2
公开(公告)日:2023-01-03
申请号:US16793360
申请日:2020-02-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Juneseok Lee , Junsig Kum , Kwanghyun Baek , Dohyuk Ha , Jinsu Heo , Youngju Lee , Jungyub Lee
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
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20.
公开(公告)号:US11439003B2
公开(公告)日:2022-09-06
申请号:US16844590
申请日:2020-04-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanghyun Baek , Juneseok Lee , Dohyuk Ha , Junsig Kum , Kijoon Kim , Youngju Lee , Jungyub Lee , Jinsu Heo
Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module and a base station including the antenna module. The antenna module includes a printed circuit board in which at least one layer is stacked, a feeding unit disposed at one surface of the printed circuit board, and a first antenna spaced apart from the feeding unit by a predetermined first length.
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