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    Module comprising antenna and RF element, and base station including same
    2.
    发明授权
    Module comprising antenna and RF element, and base station including same 有权

    公开(公告)号：US11063371B2

    公开(公告)日：2021-07-13

    申请号：US17063929

    申请日：2020-10-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kwanghyun Baek ,  Seungtae Ko ,  Kijoon Kim ,  Juho Son ,  Sangho Lee ,  Youngju Lee ,  Jungyub Lee ,  Yonghun Cheon ,  Dohyuk Ha

    IPC: H01Q21/06 ,  H05K1/18 ,  H01Q1/42 ,  H01Q1/24 ,  H05K9/00 ,  H04B7/0413

    Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.

    Module comprising antenna and RF element, and base station including same
    3.
    发明授权
    Module comprising antenna and RF element, and base station including same 有权

    公开(公告)号：US10797405B1

    公开(公告)日：2020-10-06

    申请号：US16906476

    申请日：2020-06-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kwanghyun Baek ,  Seungtae Ko ,  Kijoon Kim ,  Juho Son ,  Sangho Lee ,  Youngju Lee ,  Jungyub Lee ,  Yonghun Cheon ,  Dohyuk Ha

    IPC: H01Q1/42 ,  H01Q21/06 ,  H01Q1/24 ,  H04B7/0413 ,  H05K1/18 ,  H05K9/00

    Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.

    Antenna module and device including same
    10.
    发明授权
    Antenna module and device including same 有权

    公开(公告)号：US12218407B2

    公开(公告)日：2025-02-04

    申请号：US17946688

    申请日：2022-09-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Juneseok Lee ,  Youngsub Kim ,  Sanghoon Park ,  Jungho Park ,  Kwanghyun Baek ,  Youngju Lee ,  Jungyub Lee ,  Dohyuk Ha ,  Jinsu Heo

    IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q1/38

    Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.

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