公开(公告)号：US20190074296A1

公开(公告)日：2019-03-07

申请号：US15963629

申请日：2018-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-kyu RYU ,  Min-su Kim ,  Dae-seong Lee

IPC: H01L27/118

Abstract: An integrated circuit including first and second macroblocks arranged in a first direction, and a plurality of cells between the first macroblock and the second macroblock, the plurality of cells including at least one first ending cell adjacent to the first macroblock and having a first width in the first direction, at least one second ending cell adjacent to the second macroblock and having a second width different from the first width in the first direction, and at least one standard cell between the at least one first ending cell and the at least one second ending cell may be provided.

公开(公告)号：US20180336307A1

公开(公告)日：2018-11-22

申请号：US15971079

申请日：2018-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min-su Kim ,  Yong-seok Lee ,  Han-shin Shin

IPC: G06F17/50 ,  G03F1/36

Abstract: A method of manufacturing an IC includes detecting connectivity between polygons from layout data of the IC and extracting a layout netlist, by performing a DRC on the layout data. The DRC includes loading a rule file including a DRC syntax. The method includes performing INS verification on the extracted layout netlist and schematic data of the IC to generate LVS result data. The method includes manufacturing the IC according to a layout based on the layout data and the LVS result data.

公开(公告)号：US09468066B2

公开(公告)日：2016-10-11

申请号：US14176001

申请日：2014-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byoung-chul Park ,  Kyung-jin Jeon ,  Min-su Kim

IPC: H05B33/08 ,  F21V29/00 ,  F21K99/00 ,  F21V23/04 ,  F21Y103/00 ,  F21Y105/00 ,  F21V29/507 ,  F21Y101/02

CPC classification number: H05B33/0848 ,  F21K9/20 ,  F21K9/232 ,  F21K9/233 ,  F21K9/27 ,  F21V23/0435 ,  F21V23/0464 ,  F21V29/004 ,  F21V29/507 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A photo sensor-integrated tubular light emitting apparatus includes a cylindrical cover unit, a light-emitting module and a pair of sockets. The cylindrical cover unit includes a heat dissipation member and a cover. The cover has light-transmittance and is combined with the heat dissipation member. The light-emitting module is disposed in the cylindrical cover unit and has a plurality of arrayed light-emitting devices therein. The pair of sockets is combined with ends of the cylindrical cover unit. A photo sensor module is disposed in one of the pair of sockets. A driving voltage applied to the light-emitting module is adjusted based on an amount of light sensed by the photo sensor module.

Abstract translation: 一种光传感器集成式管状发光装置，包括圆柱形盖单元，发光模块和一对插座。 圆筒盖单元包括散热构件和盖。 盖具有透光性并与散热构件组合。 发光模块设置在圆筒形盖单元中，并且在其中具有多个排列的发光装置。 一对插座与圆柱形盖单元的端部相结合。 光传感器模块设置在一对插座之一中。 基于光传感器模块感测的光量来调整施加到发光模块的驱动电压。