公开(公告)号：US20230163260A1

公开(公告)日：2023-05-25

申请号：US18094718

申请日：2023-01-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihoon KANG ,  Jitsuo OTA ,  Myunghee KIM ,  Jenghun SUH

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/38 ,  H01L25/075

CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/382 ,  H01L33/502

Abstract: A micro LED and a display module are provided. The micro LED includes a first semiconductor layer having a light emission surface and electronically connected to a first electrode; a second semiconductor layer electronically connected to a second electrode; an active layer disposed between the first and second semiconductor layers; and a wavelength conversion layer stacked on the light emission surface of the first semiconductor layer. The wavelength conversion layer is made of a semiconductor having a chalcopyrite-structure. The display module includes a plurality of such plurality of micro LEDs arranged in pixel units, which are electronically connected to a plurality of TFT electrodes. The module also includes a glass substrate and a TFT layer formed on one surface of the glass substrate, and the plurality of TFT electrodes are formed on the TFT layer. The resulting TFT layer does not require a color filter or a cover layer.

公开(公告)号：US20220238503A1

公开(公告)日：2022-07-28

申请号：US17723034

申请日：2022-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myunghee KIM ,  Youngki JUNG ,  Donghwan KIM ,  Yong NAMKUNG ,  Chulgyu JUNG

IPC: H01L25/16 ,  H01L23/00

Abstract: A display module is disclosed. The display module includes a substrate; a plurality of inorganic light-emitting diodes provided in a plurality of mounting grooves formed in the substrate, the plurality of inorganic light-emitting diodes including an inorganic light-emitting diode that has a first chip electrode and a second chip electrode; a first substrate electrode pad and a second substrate electrode pad provided at a bottom surface of a mounting groove from among the plurality of mounting grooves, the first substrate electrode pad being electrically coupled to the first chip electrode and the second substrate electrode pad being electrically coupled to the second chip electrode; and a third substrate electrode pad and a fourth substrate electrode pad provided around the mounting groove.

公开(公告)号：US20210111325A1

公开(公告)日：2021-04-15

申请号：US17024833

申请日：2020-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myunghee KIM ,  Donghwan Kim ,  Sungwook Kim ,  Yong Namkung ,  Jenghun Suh ,  Jaephil Shim

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/00 ,  H01L33/00 ,  H01L33/40 ,  H01L33/42 ,  H01L33/44 ,  H01L33/58

Abstract: A display module and a manufacturing method thereof are provided. The manufacturing method may include forming an epitaxial film comprising a light emitting layer, a first type semiconductor layer, and a second type semiconductor layer, attaching the epitaxial film to an intermediate substrate comprising a conductive material, patterning the epitaxial film to form a light emitting diode (LED) and coupling the LED to a driving circuit layer through the conductive material.

公开(公告)号：US20200349882A1

公开(公告)日：2020-11-05

申请号：US16864702

申请日：2020-05-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myunghee KIM ,  Jenghun SUH ,  Jaephil SHIM ,  Jihoon KANG ,  Jitsuo OTA

IPC: G09G3/32 ,  H01L51/50 ,  G09G3/20 ,  H01L33/00 ,  H01L51/52

Abstract: Disclosed are a display panel including an LED device and a method for manufacturing a display module. According to an embodiment, the method for manufacturing the display module includes: forming a plurality of light emitting diodes (LEDs); and forming a plurality of partition walls that divide light-emitting regions by each of the plurality of LEDs, wherein the forming the plurality of LEDs includes: etching a growth substrate to form a plurality of LEDs and forming a plurality of protrusions and a plurality of depressions on the growth substrate; and forming a reflector layer on a surface of the plurality of protrusions and a surface of the plurality of depressions, and wherein the forming the plurality of partition walls includes removing a part of the growth substrate so that the plurality of partition walls are formed based on the plurality of protrusions, and a space between the plurality of partition walls is formed based on the plurality of depressions.