公开(公告)号：US11842561B2

公开(公告)日：2023-12-12

申请号：US17277787

申请日：2019-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunjang Jin ,  Youjin Kim ,  Suna Kim ,  Min Park ,  Bongjae Rhee ,  Yongwon Lee

IPC: G06V40/13 ,  G06F3/041 ,  B32B7/12 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36

CPC classification number: G06V40/1329 ,  B32B7/12 ,  B32B27/08 ,  B32B27/308 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  G06F3/041 ,  G06V40/1306 ,  B32B2307/732 ,  B32B2457/208

Abstract: Various embodiments disclosed in the present document relate to: a protective film configured to be attached to a display glass equipped with an ultrasonic fingerprint sensor; and an electronic device including the same. According to the various embodiments disclosed in the present document, a protective film can be provided, which is configured to be attached to an electronic device provided with an ultrasonic fingerprint sensor, the protective film comprising: a first adhesive layer configured to be attached on a front plate of the electronic device; and a first substrate layer stacked and disposed on one surface side of the first adhesive layer, integrated with the first adhesive layer, and covering the front plate.

公开(公告)号：US11243562B2

公开(公告)日：2022-02-08

申请号：US16487600

申请日：2018-02-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinman Kim ,  Suna Kim ,  Joohan Kim ,  Jinwoo Park ,  Hunjo Jung ,  Eunyeung Lee ,  Hyunsuk Choi

IPC: G06K9/00 ,  G06F1/16 ,  G06F21/32

Abstract: Various embodiments of the present invention relate to an electronic device comprising a biometric sensor disposed in a display, and the electronic device comprises: a transparent cover; a display module located under the transparent cover, wherein the display module comprises a display layer in which pixels are formed and one or more additional layers formed under the display layer, and an opening is formed in at least a partial region of at least one layer among the one or more layers; a first printed circuit board having a biometric sensor module, which is disposed under the display module and makes contact with the opening; and a second printed circuit board electrically connected to the first printed circuit board and the display module, wherein a pressure sensor module can be disposed in the surrounding region of the biometric sensor module under the display module in the second printed circuit board. In addition, other embodiments are possible.