公开(公告)号：US11842561B2

公开(公告)日：2023-12-12

申请号：US17277787

申请日：2019-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunjang Jin ,  Youjin Kim ,  Suna Kim ,  Min Park ,  Bongjae Rhee ,  Yongwon Lee

IPC: G06V40/13 ,  G06F3/041 ,  B32B7/12 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36

CPC classification number: G06V40/1329 ,  B32B7/12 ,  B32B27/08 ,  B32B27/308 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  G06F3/041 ,  G06V40/1306 ,  B32B2307/732 ,  B32B2457/208

Abstract: Various embodiments disclosed in the present document relate to: a protective film configured to be attached to a display glass equipped with an ultrasonic fingerprint sensor; and an electronic device including the same. According to the various embodiments disclosed in the present document, a protective film can be provided, which is configured to be attached to an electronic device provided with an ultrasonic fingerprint sensor, the protective film comprising: a first adhesive layer configured to be attached on a front plate of the electronic device; and a first substrate layer stacked and disposed on one surface side of the first adhesive layer, integrated with the first adhesive layer, and covering the front plate.

公开(公告)号：US11284513B2

公开(公告)日：2022-03-22

申请号：US16994441

申请日：2020-08-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungho Yoo ,  Namkyoung Kim ,  Jaeyong Ko ,  Youjin Kim ,  Tongho Chung

IPC: H05K1/11 ,  H05K1/02 ,  H01P1/20

Abstract: Various embodiments of the disclosure disclose a device including a main printed circuit board in which a band stop filter that interrupts at least some signals corresponding to a signal received from or transmitted to an antenna module is formed in via group patterns, and an antenna module connected to the main printed circuit board, and a printed circuit board. Various embodiments are possible.

公开(公告)号：US11134577B2

公开(公告)日：2021-09-28

申请号：US16865879

申请日：2020-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongwon Lee ,  Youjin Kim ,  Min Park ,  Bongjae Rhee

IPC: H05K5/00 ,  H05K1/18 ,  G06K9/00 ,  H05K5/03

Abstract: An electronic device including a display module is provided. The electronic device includes a housing, a display module including a cover layer forming one surface of the housing, a first panel disposed below the cover layer and including pixels, and a second panel disposed below the first panel and including a layers, and a sensor coupled to the display module and forming a sensing region on the one surface of the housing. The display module includes an opening which penetrates the second panel, and the sensor is disposed in the second panel. A thermal shrinkage film is disposed in the opening to be in contact with the first panel. The thermal shrinkage film includes a first film being in contact with the first panel and having adhesion at a temperature above a specific first temperature, and a second film including a shrinking member which contracts at a temperature above the first temperature, and a light shielding member.