公开(公告)号：US20140148022A1

公开(公告)日：2014-05-29

申请号：US13688392

申请日：2012-11-29

Applicant: SAMTEC, INC.

Inventor： John MONGOLD ,  Randall MUSSER ,  Brian VICICH

IPC: H01R12/73

CPC classification number: H01R12/73 ,  H01R12/7052 ,  H01R12/716

Abstract: A mezzanine connector includes a first connector including a pass-through hole and a first plurality of contacts arranged around the pass-through hole, the first connector arranged to be connected to a first substrate such that the first plurality of contacts are connected to the first substrate, and a second connector including a beam and a second plurality of contacts arranged around the beam, the second connector arranged to be connected to a second substrate such that the second plurality of contacts are connected to the second substrate. The pass-through hole extends fully through the first connector in a mating direction of the first connector and the second connector, and the beam of the second connector is arranged to extend into the pass-through hole of the first connector when the first connector and the second connector are mated.

Abstract translation: 夹层连接器包括第一连接器，其包括通孔和布置在通孔周围的第一多个触点，第一连接器布置成连接到第一基板，使得第一多个触点连接到第一 基板，以及包括梁和围绕梁布置的第二多个触点的第二连接器，第二连接器布置成连接到第二基板，使得第二多个触点连接到第二基板。 所述通孔在所述第一连接器和所述第二连接器的配合方向上完全延伸穿过所述第一连接器，并且所述第二连接器的所述梁被布置成当所述第一连接器和所述第二连接器的所述第一连接器 第二个连接器配合。

公开(公告)号：US20130148973A1

公开(公告)日：2013-06-13

申请号：US13758464

申请日：2013-02-04

Applicant: SAMTEC, INC.

Inventor： Eric ZBINDEN ,  Randall MUSSER ,  Jean-Marc André VERDIELL ,  John MONGOLD ,  Brian VICICH ,  Keith GUETIG

IPC: H04B10/40 ,  H04B1/38

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.

Abstract translation: 一种互连系统，包括主机电路板; 连接到主机电路板并包括第一连接器，IC电路板和IC管芯的IC封装; 以及收发器，布​​置成与第一连接器配合，使得至少一些传输到IC芯片的电信号仅在IC电路板上或通过IC电路板传输。