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公开(公告)号：US20140286646A1
公开(公告)日：2014-09-25
申请号：US14295367
申请日：2014-06-04
Applicant: Samtec, Inc.
Inventor： Eric ZBINDEN , Randall MUSSER , Jean-Marc André VERDIELL , John MONGOLD , Brian VICICH , Keith GUETIG
IPC: H04B10/40
CPC classification number: G02B6/4284 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4269 , G02B6/4278 , G02B6/4279 , G02B6/428 , G02B6/4292 , G02B6/4293 , H01L2224/48091 , H01L2224/49175 , H01R12/716 , H01R13/639 , H04B1/3833 , H04B10/2504 , H04B10/27 , H04B10/40 , H04B10/801 , H04B10/803 , H05K7/20418 , H01L2924/00014
Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
Abstract translation: 互连系统包括第一电路板，连接到第一电路板的第一和第二连接器，以及收发器，包括光引擎，并被布置成通过电缆接收和发送电信号和光信号，以将从电缆接收的光信号转换为 电信号，以及将从第一连接器接收的电信号转换为通过电缆传输的光信号。 收发器布置成与第一和第二连接器配合，使得至少一些转换的电信号被传输到第一连接器，使得从电缆接收的至少一些电信号被传送到第二连接器。
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公开(公告)号：US20160291274A1
公开(公告)日：2016-10-06
申请号：US15181762
申请日：2016-06-14
Applicant: Samtec, Inc.
Inventor： Eric ZBINDEN , Randall MUSSER , Jean-Marc André VERDIELL , John MONGOLD , Brian VICICH , Keith GUETIG
CPC classification number: G02B6/4284 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4269 , G02B6/4278 , G02B6/4279 , G02B6/428 , G02B6/4292 , G02B6/4293 , H01L2224/48091 , H01L2224/49175 , H01R12/716 , H01R13/639 , H04B1/3833 , H04B10/2504 , H04B10/27 , H04B10/40 , H04B10/801 , H04B10/803 , H05K7/20418 , H01L2924/00014
Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
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公开(公告)号：US20140242817A1
公开(公告)日：2014-08-28
申请号：US13780339
申请日：2013-02-28
Applicant: SAMTEC, INC.
Inventor： John MONGOLD , Randall MUSSER , Brian VICICH , Neal PATTERSON
IPC: H01R13/02
CPC classification number: H01R13/02 , H01R9/091 , H01R12/57 , H01R12/716 , H01R13/11 , H01R13/41 , H01R13/428
Abstract: A contact includes a head, a tail including an opening, a body connected at one end thereof to the head and at another end thereof to the tail, a first lance and a second lance extending from the body, a dimple raised from the body, and a solder member attached to the tail such that the solder member engages at least a portion of the opening. The first lance and the second lance are arranged to deflect when the contact is inserted into a connector; and the first lance, the second lance, and the dimple are arranged to frictionally secure the contact to the connector.
Abstract translation: 触点包括头部，包括开口的尾部，在其一端连接到头部并且在其另一端连接到尾部的主体，从主体延伸的第一枪和第二枪，从主体升起的凹坑， 以及附接到尾部的焊料构件，使得焊料构件与开口的至少一部分接合。 第一喷枪和第二喷枪布置成当接触件插入连接器时偏转; 并且第一长矛，第二长矛和凹坑被布置成将触点摩擦地固定到连接器。
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Patent Agency Ranking
公开(公告)号：US20140148058A1
公开(公告)日：2014-05-29
申请号：US13688400
申请日：2012-11-29
Applicant: SAMTEC, INC.
Inventor： John MONGOLD , Randall MUSSER
IPC: H01R12/58
CPC classification number: H01R12/585 , H01R43/205 , H01R43/22
Abstract: A compliant pin connector mounting system includes a connector housing, a plurality of contacts each disposed in the connector housing and each including a compliant portion and at least one load bearing surface, and a mounting tool arranged to fit into the connector housing and to contact the at least one load bearing surface of each of the plurality of contacts so as to apply a downward force directly to each of the plurality of contacts. The compliant portion of each of the plurality of contacts is arranged to be aligned with a respective hole in a substrate such that when the downward force is applied directly to the at least one load bearing surface of each of plurality of contacts by the mounting tool, the compliant portion of each of the plurality of contacts is press fit into the respective hole in the substrate.
Abstract translation: 兼容的针连接器安装系统包括连接器壳体，多个触头，每个触头各自设置在连接器壳体中，每个触头包括柔性部分和至少一个承载表面，以及安装工具，其布置成装配到连接器壳体中并且接触 所述多个触点中的每一个的至少一个承载表面，以便向所述多个触点中的每一个施加向下的力。 多个触点中的每一个的柔顺部分布置成与衬底中的相应孔对齐，使得当通过安装工具将向下的力直接施加到多个触点中的每一个的至少一个承载表面时， 多个触点中的每一个的柔顺部分压配合到基板中的相应孔中。
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公开(公告)号：US20130236186A1
公开(公告)日：2013-09-12
申请号：US13895571
申请日：2013-05-16
Applicant: SAMTEC, INC.
Inventor： Eric ZBINDEN , Randall MUSSER , Jean-Marc André VERDIELL , John MONGOLD , Brian VICICH , Keith GUETIG
IPC: H04B10/40
CPC classification number: G02B6/4284 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4269 , G02B6/4278 , G02B6/4279 , G02B6/428 , G02B6/4292 , G02B6/4293 , H01L2224/48091 , H01L2224/49175 , H01R12/716 , H01R13/639 , H04B1/3833 , H04B10/2504 , H04B10/27 , H04B10/40 , H04B10/801 , H04B10/803 , H05K7/20418 , H01L2924/00014
Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
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公开(公告)号：US20160269118A1
公开(公告)日：2016-09-15
申请号：US15157548
申请日：2016-05-18
Applicant: Samtec, Inc.
Inventor： Eric ZBINDEN , Randall MUSSER , Jean-Marc André VERDIELL , John MONGOLD , Brian VICICH , Keith GUETIG
CPC classification number: G02B6/4284 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4269 , G02B6/4278 , G02B6/4279 , G02B6/428 , G02B6/4292 , G02B6/4293 , H01L2224/48091 , H01L2224/49175 , H01R12/716 , H01R13/639 , H04B1/3833 , H04B10/2504 , H04B10/27 , H04B10/40 , H04B10/801 , H04B10/803 , H05K7/20418 , H01L2924/00014
Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
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公开(公告)号：US20140148022A1
公开(公告)日：2014-05-29
申请号：US13688392
申请日：2012-11-29
Applicant: SAMTEC, INC.
Inventor： John MONGOLD , Randall MUSSER , Brian VICICH
IPC: H01R12/73
CPC classification number: H01R12/73 , H01R12/7052 , H01R12/716
Abstract: A mezzanine connector includes a first connector including a pass-through hole and a first plurality of contacts arranged around the pass-through hole, the first connector arranged to be connected to a first substrate such that the first plurality of contacts are connected to the first substrate, and a second connector including a beam and a second plurality of contacts arranged around the beam, the second connector arranged to be connected to a second substrate such that the second plurality of contacts are connected to the second substrate. The pass-through hole extends fully through the first connector in a mating direction of the first connector and the second connector, and the beam of the second connector is arranged to extend into the pass-through hole of the first connector when the first connector and the second connector are mated.
Abstract translation: 夹层连接器包括第一连接器，其包括通孔和布置在通孔周围的第一多个触点，第一连接器布置成连接到第一基板，使得第一多个触点连接到第一 基板，以及包括梁和围绕梁布置的第二多个触点的第二连接器，第二连接器布置成连接到第二基板，使得第二多个触点连接到第二基板。 所述通孔在所述第一连接器和所述第二连接器的配合方向上完全延伸穿过所述第一连接器，并且所述第二连接器的所述梁被布置成当所述第一连接器和所述第二连接器的所述第一连接器 第二个连接器配合。
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公开(公告)号：US20130148973A1
公开(公告)日：2013-06-13
申请号：US13758464
申请日：2013-02-04
Applicant: SAMTEC, INC.
Inventor： Eric ZBINDEN , Randall MUSSER , Jean-Marc André VERDIELL , John MONGOLD , Brian VICICH , Keith GUETIG
CPC classification number: G02B6/4284 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4269 , G02B6/4278 , G02B6/4279 , G02B6/428 , G02B6/4292 , G02B6/4293 , H01L2224/48091 , H01L2224/49175 , H01R12/716 , H01R13/639 , H04B1/3833 , H04B10/2504 , H04B10/27 , H04B10/40 , H04B10/801 , H04B10/803 , H05K7/20418 , H01L2924/00014
Abstract: An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.
Abstract translation: 一种互连系统，包括主机电路板; 连接到主机电路板并包括第一连接器，IC电路板和IC管芯的IC封装; 以及收发器，布置成与第一连接器配合，使得至少一些传输到IC芯片的电信号仅在IC电路板上或通过IC电路板传输。
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