Abstract:
A method for the production of glass components, an apparatus for carrying out the method, and a glass component that is obtainable through the method are provided. The method is a drawing method wherein a forming zone of a preform is heated to a temperature that allows drawing of the glass. The method includes a forming zone of the preform that is very small. Thereby the width of the preform is decreased to a smaller extent than its thickness. The glass components that can be obtained by this method have very smooth surfaces.
Abstract:
A method for the production of glass components, an apparatus for carrying out the method, and a glass component that is obtainable through the method are provided. The method is a drawing method wherein a forming zone of a preform is heated to a temperature that allows drawing of the glass. The method includes a forming zone of the preform that is very small. Thereby the width of the preform is decreased to a smaller extent than its thickness. The glass components that can be obtained by this method have very smooth surfaces.
Abstract:
The production of optoelectronic components, optical components being mounted in the composite wafer. Provided to this end is a method for producing optoelectronic components, in particular image signal acquiring or image signal outputting components, in the case of which optical components are respectively provided, picked up and mounted on a wafer, the optical components preferably respectively being positioned individually or in groups relative to the position of assigned optoelectronic or optical components of the wafer or of a wafer to be connected thereto.