Method for manufacturing semiconductor device
    11.
    发明授权
    Method for manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US09190428B2

    公开(公告)日:2015-11-17

    申请号:US14276239

    申请日:2014-05-13

    Abstract: A first semiconductor substrate is used which has a structure in which a peeling layer is not formed in a section subjected to a first dividing treatment, so that the peeling layer is not exposed at the end surface of a second semiconductor substrate when the second semiconductor substrate is cut out of the first semiconductor substrate. In addition, a supporting material is provided on a layer to be peeled of the second semiconductor substrate before the second semiconductor substrate is subjected to a second dividing treatment.

    Abstract translation: 使用第一半导体基板,其具有其中在经受第一分割处理的部分中不形成剥离层的结构,使得当第二半导体基板上的剥离层不暴露在第二半导体基板的端面时 被切出第一半导体衬底。 另外,在对第二半导体衬底进行第二次分割处理之前,在要被剥离的第二半导体衬底的层上提供支撑材料。

    Semiconductor substrate and method for manufacturing semiconductor device
    13.
    发明授权
    Semiconductor substrate and method for manufacturing semiconductor device 有权
    半导体基板及半导体装置的制造方法

    公开(公告)号:US08728868B2

    公开(公告)日:2014-05-20

    申请号:US13962326

    申请日:2013-08-08

    Abstract: Provided is a method for manufacturing a semiconductor device, which prevents waste generation from being caused peeling of films and prevents failure of peeling from being caused by waste due to peeling of films. A first semiconductor substrate is used which has a structure in which a peeling layer is not formed in a section subjected to a first dividing treatment, so that the peeling layer is not exposed at the end surface of a second semiconductor substrate when the second semiconductor substrate is cut out of the first semiconductor substrate. In addition, a supporting material is provided on a layer to be peeled of the second semiconductor substrate before the second semiconductor substrate is subjected to a second dividing treatment.

    Abstract translation: 提供一种制造半导体器件的方法,其防止废物产生被膜剥离,并防止由于剥离而导致的剥离不会导致剥离。 使用第一半导体基板,其具有其中在经受第一分割处理的部分中不形成剥离层的结构,使得当第二半导体基板上的剥离层不暴露在第二半导体基板的端面时 被切出第一半导体衬底。 另外,在对第二半导体衬底进行第二次分割处理之前,在要被剥离的第二半导体衬底的层上提供支撑材料。

    Display device
    15.
    发明授权

    公开(公告)号:US11508787B2

    公开(公告)日:2022-11-22

    申请号:US16867890

    申请日:2020-05-06

    Abstract: A display device, an electronic device, or a lighting device that is unlikely to be broken is provided. A flexible first substrate and a flexible second substrate overlap with each other with a display element provided therebetween. A flexible third substrate is bonded on the outer surface of the first substrate, and a flexible fourth substrate is bonded on the outer surface of the second substrate. The third substrate is formed using a material softer than the first substrate, and the fourth substrate is formed using a material softer than the second substrate.

    Light-emitting device and method for manufacturing light-emitting device

    公开(公告)号:US11355729B2

    公开(公告)日:2022-06-07

    申请号:US16900034

    申请日:2020-06-12

    Abstract: A highly reliable flexible light-emitting device is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, a light-emitting element between the first flexible substrate and the second flexible substrate, a first bonding layer; and a second bonding layer in a frame shape surrounding the first bonding layer. The first bonding layer and the second bonding layer are between the second flexible substrate and the light-emitting element. The light-emitting element includes layer containing a light-emitting organic compound between the pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.

    Light-Emitting Device, Module, Electronic Device, and Method for Manufacturing Light-Emitting Device

    公开(公告)号:US20220085323A1

    公开(公告)日:2022-03-17

    申请号:US17530914

    申请日:2021-11-19

    Inventor: Akihiro Chida

    Abstract: A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.

    Display device and electronic device

    公开(公告)号:US10984755B2

    公开(公告)日:2021-04-20

    申请号:US16465316

    申请日:2017-12-18

    Inventor: Akihiro Chida

    Abstract: A display device whose aspect ratio can be changed is provided. The display device includes a plurality of display units and a plurality of driver circuit units. The plurality of display units each include a light-emitting portion and a connection region. The plurality of driver circuit units each include a driver circuit portion and a connection region. The connection regions of the adjacent units overlap with each other and one shaft passes through the connection regions. The adjacent units are electrically connected to each other with the one shaft. With such a structure, an angle between the adjacent units electrically connected to each other with one shaft can be changed, which enables the aspect ratio of the display device to be changed.

    Light-emitting device, module, electronic device, and method for manufacturing light-emitting device

    公开(公告)号:US10270057B2

    公开(公告)日:2019-04-23

    申请号:US15839059

    申请日:2017-12-12

    Inventor: Akihiro Chida

    Abstract: A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.

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