公开(公告)号：US20210202806A1

公开(公告)日：2021-07-01

申请号：US17133608

申请日：2020-12-23

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Min JANG ,  Sung Hyun LEE ,  Chang Yeon KIM

IPC: H01L33/58 ,  H01L25/075 ,  H01L27/15 ,  H01L33/38 ,  H01L33/44 ,  H01L33/62

Abstract: A display apparatus including a circuit board, a plurality of light emitting devices mounted on the circuit board, a transparent substrate disposed on the light emitting devices, and a light absorbing layer disposed between the transparent substrate and the light emitting devices, in which the light absorbing layer covers upper regions of the light emitting devices and a region between the light emitting devices.

公开(公告)号：US20190019923A1

公开(公告)日：2019-01-17

申请号：US16125769

申请日：2018-09-10

Applicant: SEOUL VIOSYS CO., LTD

Inventor： Chi Hyun IN ,  Jun Yong PARK ,  Kyu Ho LEE ,  Dae Woong SUH ,  Jong Hyeon CHAE ,  Chang Hoon KIM ,  Sung Hyun LEE

IPC: H01L33/48 ,  H01L33/20 ,  H01L33/50 ,  H01L33/44 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/20 ,  H01L33/44 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0033

Abstract: Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.