公开(公告)号：US20230317685A1

公开(公告)日：2023-10-05

申请号：US18188918

申请日：2023-03-23

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Agatino MINOTTI ,  Francesco SALAMONE

IPC: H01L25/07 ,  H01L23/538 ,  H01L23/373 ,  H01L23/473 ,  H01L23/31

CPC classification number: H01L25/072 ,  H01L23/5383 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/3107

Abstract: Electronic device comprising at least a first and a second branch, each branch including a first and a second transistor arranged in series to each other and formed in respective dice of semiconductor material. The dice are sandwiched between a first substrate element and a second substrate element. The first and the second substrate elements are formed each by a multilayer including a first conductive layer, a second conductive layer and an insulating layer extending between the first and the second conductive layers. The first conductive layers of the first and the second substrate elements face towards the outside of the electronic device and define a first and a second main face of the electronic device. The second conductive layer of the first and the second substrate elements is shaped so as to form contact regions facing and in selective electrical contact with the plurality of dice.

公开(公告)号：US20230282564A1

公开(公告)日：2023-09-07

申请号：US18306119

申请日：2023-04-24

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Agatino MINOTTI

IPC: H01L23/498 ,  H01L23/373

CPC classification number: H01L23/49844 ,  H01L23/3735 ,  H01L23/49822

Abstract: A power semiconductor device including a first and second die, each including a plurality of conductive contact regions and a passivation region including a number of projecting dielectric regions and a number of windows. Adjacent windows are separated by a corresponding projecting dielectric region with each conductive contact region arranged within a corresponding window. A package of the surface mount type houses the first and second dice. The package includes a first bottom insulation multilayer and a second bottom insulation multilayer carrying, respectively, the first and second dice. A covering metal layer is arranged on top of the first and second dice and includes projecting metal regions extending into the windows to couple electrically with corresponding conductive contact regions. The covering metal layer moreover forms a number of cavities, which are interposed between the projecting metal regions so as to overlie corresponding projecting dielectric regions.

公开(公告)号：US20220199563A1

公开(公告)日：2022-06-23

申请号：US17553540

申请日：2021-12-16

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Roberto RIZZA

IPC: H01L23/00 ,  H01L23/492

Abstract: The packaged power electronic device has a bearing structure including a base section and a transverse section extending transversely to the base section. A die is bonded to the base section of the bearing structure and has a first terminal on a first main face and a second and a third terminal on a second main face. A package of insulating material embeds the semiconductor die, the second terminal, the third terminal and at least partially the carrying base. A first, a second and a third outer connection region are electrically coupled to the first, the second and the third terminals of the die, respectively, are laterally surrounded by the package and face the second main surface of the package. The transverse section of the bearing structure extends from the base section towards the second main surface of the package and has a higher height with respect to the die.

公开(公告)号：US20220013439A1

公开(公告)日：2022-01-13

申请号：US17367086

申请日：2021-07-02

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Fabio RUSSO

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: An HV MOSFET device has a body integrating source conductive regions. Projecting gate structures are disposed above the body, laterally offset with respect to the source conductive regions. Source contact regions, of a first metal, are arranged on the body in electric contact with the source conductive regions, and source connection regions, of a second metal, are arranged above the source contact regions and have a height protruding with respect to the projecting gate structures. A package includes a metal support bonded to a second surface of the body, and a dissipating region, above the first surface of the semiconductor die. The dissipating region includes a conductive plate having a planar face bonded to the source connection regions and spaced from the projecting gate structures. A package mass of dielectric material is disposed between the support and the dissipating region and incorporates the semiconductor die. The dissipating region is a DBC-type insulation multilayer.

公开(公告)号：US20210327792A1

公开(公告)日：2021-10-21

申请号：US17227030

申请日：2021-04-09

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Fabio Vito COPPONE ,  Francesco SALAMONE

IPC: H01L23/495 ,  H01L23/31

Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

公开(公告)号：US20200303278A1

公开(公告)日：2020-09-24

申请号：US16894460

申请日：2020-06-05

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Francesco SALAMONE ,  Cristiano Gianluca STELLA

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H01L23/433 ,  H01L23/495 ,  H01L23/373 ,  H01L23/48 ,  H01L23/34 ,  H01L23/36 ,  H01L23/42 ,  H01L23/28

Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.