公开(公告)号：US20220108939A1

公开(公告)日：2022-04-07

申请号：US17491082

申请日：2021-09-30

Applicant: STMicroelectronics S.r.l.

Inventor： Agatino MINOTTI ,  Francesco SALAMONE ,  Massimiliano FIORITO ,  Alessio SCORDIA ,  Manuel PONTURO

IPC: H01L23/49 ,  H01L23/492 ,  H01L23/373 ,  H01R12/58 ,  H01R43/02

Abstract: A blocking element is provided for connecting an electronic, micro-mechanical and/or micro-electro-mechanical component, in particular for controlling the propulsion of an electric vehicle. The pin blocking element is formed by a holed body having a first end, a second end and an axial cavity configured for fittingly accommodating a connecting pin. A first flange projects transversely from the holed body at the first end and a second flange projects transversely from the holed body at the second end. The first flange has a greater area than the second flange and is configured to be ultrasonically soldered to a conductive bearing plate to form a power module.

公开(公告)号：US20160118320A1

公开(公告)日：2016-04-28

申请号：US14870721

申请日：2015-09-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fabio Vito COPPONE ,  Agatino MINOTTI ,  Francesco SALAMONE

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49562 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49568 ,  H01L24/06 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/84 ,  H01L2924/00

Abstract: An electronic device comprising: a semiconductor die integrating an electronic component; a leadframe housing the semiconductor die; a protection body, which surrounds laterally and at the top the semiconductor die and, at least in part, the leadframe structure, defining a top surface, a bottom surface, and a thickness of the electronic device; and a conductive lead electrically coupled to the semiconductor die. The conductive lead is modelled in such a way as to extend throughout the thickness of the protection body for forming a front electrical contact accessible from the top surface of the electronic device, and a rear electrical contact accessible from the bottom surface of the electronic device.

Abstract translation: 一种电子设备，包括：集成电子部件的半导体管芯; 引线框架，其容纳半导体管芯; 保护体，其横向地和顶部包围半导体管芯，并且至少部分地围绕引线框架结构，限定电子器件的顶表面，底表面和厚度; 以及电连接到半导体管芯的导电引线。 导电引线被模制成能够延伸到保护体的整个厚度上，以形成从电子器件的顶表面可接近的前电接触，以及可从电子器件的底表面接近的后电接触。

公开(公告)号：US20240429132A1

公开(公告)日：2024-12-26

申请号：US18830402

申请日：2024-09-10

Applicant: STMicroelectronics S.r.l.

Inventor： Agatino MINOTTI ,  Francesco SALAMONE ,  Massimiliano FIORITO ,  Alessio SCORDIA ,  Manuel PONTURO

IPC: H01L23/49 ,  H01L23/373 ,  H01L23/492 ,  H01R12/58 ,  H01R43/02

Abstract: A blocking element is provided for connecting an electronic, micro-mechanical and/or micro-electro-mechanical component, in particular for controlling the propulsion of an electric vehicle. The pin blocking element is formed by a holed body having a first end, a second end and an axial cavity configured for fittingly accommodating a connecting pin. A first flange projects transversely from the holed body at the first end and a second flange projects transversely from the holed body at the second end. The first flange has a greater area than the second flange and is configured to be ultrasonically soldered to a conductive bearing plate to form a power module.

公开(公告)号：US20230317685A1

公开(公告)日：2023-10-05

申请号：US18188918

申请日：2023-03-23

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Agatino MINOTTI ,  Francesco SALAMONE

IPC: H01L25/07 ,  H01L23/538 ,  H01L23/373 ,  H01L23/473 ,  H01L23/31

CPC classification number: H01L25/072 ,  H01L23/5383 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/3107

Abstract: Electronic device comprising at least a first and a second branch, each branch including a first and a second transistor arranged in series to each other and formed in respective dice of semiconductor material. The dice are sandwiched between a first substrate element and a second substrate element. The first and the second substrate elements are formed each by a multilayer including a first conductive layer, a second conductive layer and an insulating layer extending between the first and the second conductive layers. The first conductive layers of the first and the second substrate elements face towards the outside of the electronic device and define a first and a second main face of the electronic device. The second conductive layer of the first and the second substrate elements is shaped so as to form contact regions facing and in selective electrical contact with the plurality of dice.

公开(公告)号：US20230282564A1

公开(公告)日：2023-09-07

申请号：US18306119

申请日：2023-04-24

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Agatino MINOTTI

IPC: H01L23/498 ,  H01L23/373

CPC classification number: H01L23/49844 ,  H01L23/3735 ,  H01L23/49822

Abstract: A power semiconductor device including a first and second die, each including a plurality of conductive contact regions and a passivation region including a number of projecting dielectric regions and a number of windows. Adjacent windows are separated by a corresponding projecting dielectric region with each conductive contact region arranged within a corresponding window. A package of the surface mount type houses the first and second dice. The package includes a first bottom insulation multilayer and a second bottom insulation multilayer carrying, respectively, the first and second dice. A covering metal layer is arranged on top of the first and second dice and includes projecting metal regions extending into the windows to couple electrically with corresponding conductive contact regions. The covering metal layer moreover forms a number of cavities, which are interposed between the projecting metal regions so as to overlie corresponding projecting dielectric regions.

公开(公告)号：US20250087623A1

公开(公告)日：2025-03-13

申请号：US18956979

申请日：2024-11-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Agatino MINOTTI

IPC: H01L23/00 ,  H01L23/538

Abstract: Packaged device having a carrying base; an accommodation cavity in the carrying base; a semiconductor die in the accommodation cavity, the semiconductor die having die pads; a protective layer, covering the semiconductor die and the carrying base; first vias in the protective layer, at the die pads; and connection terminals of conductive material. The connection terminals have first connection portions in the first vias, in electrical contact with the die pads, and second connection portions, extending on the protective layer, along a side surface of the packaged device.

公开(公告)号：US20220320032A1

公开(公告)日：2022-10-06

申请号：US17701352

申请日：2022-03-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Agatino MINOTTI

IPC: H01L23/00 ,  H01L25/065

Abstract: A connecting strip of conductive elastic material having an arched shape having a concave side and a convex side. The connecting strip is fixed at the ends to a support carrying a die with the convex side facing the support. During bonding, the connecting strip undergoes elastic deformation and presses against the die, thus electrically connecting the at least one die to the support.

公开(公告)号：US20220084980A1

公开(公告)日：2022-03-17

申请号：US17472207

申请日：2021-09-10

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Agatino MINOTTI

IPC: H01L23/00

Abstract: Packaged device having a carrying base; an accommodation cavity in the carrying base; a semiconductor die in the accommodation cavity, the semiconductor die having die pads; a protective layer, covering the semiconductor die and the carrying base; first vias in the protective layer, at the die pads; and connection terminals of conductive material. The connection terminals have first connection portions in the first vias, in electrical contact with the die pads, and second connection portions, extending on the protective layer, along a side surface of the packaged device.

公开(公告)号：US20210159161A1

公开(公告)日：2021-05-27

申请号：US17142738

申请日：2021-01-06

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Agatino MINOTTI

IPC: H01L23/498 ,  H01L23/373

Abstract: A power semiconductor device including a first and second die, each including a plurality of conductive contact regions and a passivation region including a number of projecting dielectric regions and a number of windows. Adjacent windows are separated by a corresponding projecting dielectric region with each conductive contact region arranged within a corresponding window. A package of the surface mount type houses the first and second dice. The package includes a first bottom insulation multilayer and a second bottom insulation multilayer carrying, respectively, the first and second dice. A covering metal layer is arranged on top of the first and second dice and includes projecting metal regions extending into the windows to couple electrically with corresponding conductive contact regions. The covering metal layer moreover forms a number of cavities, which are interposed between the projecting metal regions so as to overlie corresponding projecting dielectric regions.