公开(公告)号：US20250105024A1

公开(公告)日：2025-03-27

申请号：US18973931

申请日：2024-12-09

Applicant: STMicroelectronics S.r.l.

Inventor： Fulvio Vittorio FONTANA ,  Michele DERAI

IPC: H01L21/48 ,  H01L21/78 ,  H01L23/495

Abstract: A semiconductor chip is mounted at a first surface of a leadframe and an insulating encapsulation is formed onto the leadframe. An etching mask is applied to a second surface of the leadframe to cover locations of two adjacent rows of electrical contacts as well as a connecting bar between the two adjacent rows which electrically couples the electrical contacts. The second surface is then etched through the etching mask to remove leadframe material at the second surface and define the electrical contacts and connecting bar. The electrical contacts include a distal surface as well as flanks left uncovered by the insulating encapsulation. The etching mask is then removed and the electrical contacts and the connecting bars are used as electrodes in an electroplating of the distal surface and the flanks of the electrical contacts. The connecting bar is then removed from between the two adjacent rows during device singulation.

公开(公告)号：US20220199424A1

公开(公告)日：2022-06-23

申请号：US17550747

申请日：2021-12-14

Applicant: STMicroelectronics S.r.l.

Inventor： Fulvio Vittorio FONTANA ,  Michele DERAI

IPC: H01L21/48 ,  H01L23/495 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31

Abstract: A semiconductor chip is mounted at a first surface of a leadframe and an insulating encapsulation is formed onto the leadframe. An etching mask is applied to a second surface of the leadframe to cover locations of two adjacent rows of electrical contacts as well as a connecting bar between the two adjacent rows which electrically couples the electrical contacts. The second surface is then etched through the etching mask to remove leadframe material at the second surface and define the electrical contacts and connecting bar. The electrical contacts include a distal surface as well as flanks left uncovered by the insulating encapsulation. The etching mask is then removed and the electrical contacts and the connecting bars are used as electrodes in an electroplating of the distal surface and the flanks of the electrical contacts. The connecting bar is then removed from between the two adjacent rows during device singulation.

公开(公告)号：US20190259691A1

公开(公告)日：2019-08-22

申请号：US16398022

申请日：2019-04-29

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fulvio Vittorio FONTANA ,  Giovanni GRAZIOSI

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H01L49/02

Abstract: In an embodiment, a semiconductor device includes: a lead-frame including one or more electrically conductive areas, one or more dielectric layers over the electrically conductive area or areas, one or more electrically conductive layer over the one or more dielectric layers thus forming one or more capacitors each including the dielectric layer sandwiched between an electrically conductive area and the electrically conductive layer. The semiconductor device also includes a semiconductor die on the lead-frame electrically connected to the one or more electrically conductive layers.

公开(公告)号：US20160209440A1

公开(公告)日：2016-07-21

申请号：US15081507

申请日：2016-03-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giulio RICOTTI ,  Alberto PAGANI ,  Fulvio Vittorio FONTANA ,  Ubaldo MASTROMATTEO

IPC: G01P15/11 ,  G01P15/097 ,  G01C19/5783

CPC classification number: G01P15/11 ,  B81B7/008 ,  B81B2201/025 ,  B81B2207/012 ,  B81C1/0023 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/097 ,  G01P15/105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An inertial sensor having a body with an excitation coil and a first sensing coil extending along a first axis. A suspended mass includes a magnetic-field concentrator, in a position corresponding to the excitation coil, and configured for displacing by inertia in a plane along the first axis. A supply and sensing circuit is electrically coupled to the excitation coil and to the first sensing coil, and is configured for generating a time-variable flow of electric current that flows in the excitation coil so as to generate a magnetic field that interacts with the magnetic-field concentrator to induce a voltage/current in the sensing coil. The integrated circuit is configured for measuring a value of the voltage/current induced in the first sensing coil so as to detect a quantity associated to the displacement of the suspended mass along the first axis.

公开(公告)号：US20160184852A1

公开(公告)日：2016-06-30

申请号：US14867099

申请日：2015-09-28

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Fulvio Vittorio FONTANA

IPC: B05B12/08 ,  B05B15/06 ,  B05B11/00

CPC classification number: B05B12/085 ,  A61M5/14224 ,  A61M5/14248 ,  A61M5/16854 ,  A61M2005/14268 ,  A61M2205/0244 ,  B05B11/3042 ,  B05B15/62

Abstract: A device for dispensing a fluid includes a fixed part to be worn by a user, a fluid connection including a terminal outlet, a needle coupled to the terminal outlet of the fluid connection for dispensing a fluid, and a replaceable part coupled to the fixed part via the fluid connection. The replaceable part includes a reservoir for containing the fluid to be dispensed, and a micro-pump coupled to the reservoir to send the fluid to the fixed part through the fluid connection. An actuator operates the micro-pump. The fixed part includes a pressure-sensor in proximity to the terminal outlet of the fluid connection and is associated with dispensing the fluid from the needle. An electronic control module controls operation of the micro-pump via the pressure-sensor.

Abstract translation: 用于分配流体的装置包括要由使用者佩戴的固定部件，包括端子出口的流体连接件，连接到用于分配流体的流体连接件的端子出口的针和耦合到固定部分的可替换部件 通过流体连接。 可替换部件包括用于容纳要分配的流体的储存器和耦合到储存器的微型泵，以通过流体连接将流体发送到固定部件。 致动器操作微型泵。 固定部分包括靠近流体连接的端子出口的压力传感器，并且与从针头分配流体相关联。 电子控制模块通过压力传感器控制微型泵的操作。

公开(公告)号：US20250070000A1

公开(公告)日：2025-02-27

申请号：US18943461

申请日：2024-11-11

Applicant: STMicroelectronics S.r.l.

Inventor： Fulvio Vittorio FONTANA

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: A lead frame for an integrated electronic device includes a die pad made of a first metallic material. A top coating layer formed by a second metallic material is arranged on a top surface of the die pad. The second metallic material has an oxidation rate lower than the first metallic material. The top coating layer leaves exposed a number of corner portions of the top surface of the die pad. A subsequent heating operation, for example occurring in connection with wirebonding, causes an oxidized layer to form on the corner portions of the top surface of the die pad at a position in contact with the top coating layer.

公开(公告)号：US20240347495A1

公开(公告)日：2024-10-17

申请号：US18752274

申请日：2024-06-24

Applicant: STMicroelectronics S.r.l.

Inventor： Fulvio Vittorio FONTANA

IPC: H01L23/00 ,  G01N21/956 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L24/19 ,  G01N21/95684 ,  H01L21/565 ,  H01L23/3185 ,  H01L24/11 ,  H01L24/13 ,  H01L24/20 ,  H01L25/0652

Abstract: A semiconductor product includes a layer of semiconductor die package molding material embedding a semiconductor die having a front surface and an array of electrically-conductive bodies such as spheres or balls around the semiconductor die. The electrically-conductive bodies have front end portions around the front surface of the semiconductor die and back end portions protruding from the layer of semiconductor die package molding material. Electrically-conductive formations are provided between the front surface of the semiconductor die and front end portions of the electrically-conductive bodies left uncovered by the package molding material. Light-permeable sealing material can be provided at electrically-conductive formations to facilitate inspecting the electrically-conductive formations via visual inspection through the light-permeable sealing material.

公开(公告)号：US20240096759A1

公开(公告)日：2024-03-21

申请号：US18508007

申请日：2023-11-13

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristina SOMMA ,  Fulvio Vittorio FONTANA

IPC: H01L23/495

CPC classification number: H01L23/49503 ,  H01L23/49517 ,  H01L23/49575

Abstract: One or more embodiments are directed to quad flat no-lead (QFN) semiconductor packages, devices, and methods in which one or more electrical components are positioned between a die pad of a QFN leadframe and a semiconductor die. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and at least one electrical component that has a first contact on the die pad and a second contact on the lead. A semiconductor die is positioned on the at least one electrical component and is spaced apart from the die pad by the at least one electrical component. The device further includes at least one conductive wire, or wire bond, that electrically couples the at least one lead to the semiconductor die.

公开(公告)号：US20230090848A1

公开(公告)日：2023-03-23

申请号：US18070051

申请日：2022-11-28

Applicant: STMicroelectronics S.r.l.

Inventor： Fulvio Vittorio FONTANA

IPC: H01L23/495 ,  H01L23/00

Abstract: A lead frame for an integrated electronic device includes a die pad made of a first metallic material. A top coating layer formed by a second metallic material is arranged on a top surface of the die pad. The second metallic material has an oxidation rate lower than the first metallic material. The top coating layer leaves exposed a number of corner portions of the top surface of the die pad. A subsequent heating operation, for example occurring in connection with wirebonding, causes an oxidized layer to form on the corner portions of the top surface of the die pad at a position in contact with the top coating layer.

公开(公告)号：US20210407894A1

公开(公告)日：2021-12-30

申请号：US17470269

申请日：2021-09-09

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fulvio Vittorio FONTANA ,  Giovanni GRAZIOSI ,  Michele DERAI

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

Abstract: Methods of forming a semiconductor device comprising a lead-frame having a die pad having at least one electrically conductive die pad area and an insulating layer applied onto the electrically conductive die pad area. An electrically conductive layer is applied onto the insulating layer with one or more semiconductor dice coupled, for instance adhesively, to the electrically conductive layer. The electrically conductive die pad area, the electrically conductive layer and the insulating layer sandwiched therebetween form at least one capacitor integrated in the device. The electrically conductive die pad area comprises a sculptured structure with valleys and peaks therein; the electrically conductive layer comprises electrically conductive filling material extending into the valleys in the sculptured structure of the electrically conductive die pad area.