公开(公告)号：US20140312484A1

公开(公告)日：2014-10-23

申请号：US14258818

申请日：2014-04-22

Applicant: STMicroelectronics S.r.l.

Inventor： Pierangelo MAGNI ,  Giuseppe GATTAVARI ,  Mark Andrew SHAW

IPC: H01L23/34 ,  H01L23/00

CPC classification number: H01L23/34 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/80 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/183 ,  H05K3/306 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An embodiment of an electronic assembly for mounting on an electronic board includes a plurality of electric contact regions exposed on a mounting surface of the electronic board. The electronic assembly includes a chip of semiconductor material in which at least one electronic component is integrated, at least one support element including a first main surface and a second main surface opposite to the first main surface, the chip being enclosed by the at least one support element, a heat dissipation plate thermally coupled to said chip to dissipate the heat produced by it, exposed on the first main surface of the support element, a plurality of contact elements, each electrically coupled to a respective electric terminal of the electronic component integrated in the chip, exposed on the same first main surface of which is exposed to the dissipation plate. Also included are a plurality of electric connection elements, each adapted to electrically intercouple a respective contact element of the electronic assembly with a corresponding electric contact region of the electronic board, in such a way that the second main surface of the at least one support element faces the mounting surface of the electronic board.

Abstract translation: 用于安装在电子板上的电子组件的实施例包括暴露在电子板的安装表面上的多个电接触区域。 电子组件包括其中集成有至少一个电子部件的半导体材料芯片，包括第一主表面和与第一主表面相对的第二主表面的至少一个支撑元件，芯片被至少一个 支撑元件，热耦合到所述芯片以散发由其产生的热量的散热板，暴露在支撑元件的第一主表面上，多个接触元件，每个接触元件电耦合到电子元件的相应电气端子集成 在芯片中，暴露在与其散开板相同的第一主表面上。 还包括多个电连接元件，每个电连接元件适于将电子组件的相应接触元件与电子板的对应电接触区域电相互耦合，使得至少一个支撑元件的第二主表面 面向电子板的安装表面。

公开(公告)号：US20240186198A1

公开(公告)日：2024-06-06

申请号：US18437899

申请日：2024-02-09

Applicant: STMicroelectronics S.r.l.

Inventor： Pierangelo MAGNI ,  Michele DERAI

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/18 ,  H01L23/498

CPC classification number: H01L23/3107 ,  H01L21/561 ,  H01L23/18 ,  H01L23/49838

Abstract: A semiconductor chip or die is mounted at a position on a support substrate. A light-permeable laser direct structuring (LDS) material is then molded onto the semiconductor chip positioned on the support substrate. The semiconductor chip is visible through the LDS material. Laser beam energy is directed to selected spatial locations of the LDS material to structure in the LDS material a pattern of structured formations corresponding to the locations of conductive lines and vias for making electrical connection to the semiconductor chip. The spatial locations of the LDS material to which laser beam energy is directed are selected as a function of the position the semiconductor chip which is visible through the LDS material, thus countering undesired effects of positioning offset of the chip on the substrate.

公开(公告)号：US20220392830A1

公开(公告)日：2022-12-08

申请号：US17887838

申请日：2022-08-15

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni ZIGLIOLI ,  Alberto PINTUS ,  Pierangelo MAGNI

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56

Abstract: A plastic material substrate has a die mounting location for a semiconductor die. Metallic traces are formed on selected areas of the plastic material substrate, wherein the metallic traces provide electrically-conductive paths for coupling to the semiconductor die. The semiconductor die is attached onto the die mounting location. The semiconductor die attached onto the die mounting location is electrically bonded to selected ones of the metallic traces formed on the plastic material substrate. A package material is molded onto the semiconductor die attached onto the die mounting location.

公开(公告)号：US20220068741A1

公开(公告)日：2022-03-03

申请号：US17411585

申请日：2021-08-25

Applicant: STMicroelectronics S.r.l.

Inventor： Pierangelo MAGNI ,  Michele DERAI

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/18 ,  H01L21/56

Abstract: A semiconductor chip or die is mounted at a position on a support substrate. A light-permeable laser direct structuring (LDS) material is then molded onto the semiconductor chip positioned on the support substrate. The semiconductor chip is visible through the LDS material. Laser beam energy is directed to selected spatial locations of the LDS material to structure in the LDS material a pat gstern of structured formations corresponding to the locations of conductive lines and vias for making electrical connection to the semiconductor chip. The spatial locations of the LDS material to which laser beam energy is directed are selected as a function of the position the semiconductor chip which is visible through the LDS material, thus countering undesired effects of positioning offset of the chip on the substrate.