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    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
    11.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20250105024A1

    公开(公告)日：2025-03-27

    申请号：US18973931

    申请日：2024-12-09

    Applicant: STMicroelectronics S.r.l.

    Inventor： Fulvio Vittorio FONTANA ,  Michele DERAI

    IPC: H01L21/48 ,  H01L21/78 ,  H01L23/495

    Abstract: A semiconductor chip is mounted at a first surface of a leadframe and an insulating encapsulation is formed onto the leadframe. An etching mask is applied to a second surface of the leadframe to cover locations of two adjacent rows of electrical contacts as well as a connecting bar between the two adjacent rows which electrically couples the electrical contacts. The second surface is then etched through the etching mask to remove leadframe material at the second surface and define the electrical contacts and connecting bar. The electrical contacts include a distal surface as well as flanks left uncovered by the insulating encapsulation. The etching mask is then removed and the electrical contacts and the connecting bars are used as electrodes in an electroplating of the distal surface and the flanks of the electrical contacts. The connecting bar is then removed from between the two adjacent rows during device singulation.

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
    12.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220199424A1

    公开(公告)日：2022-06-23

    申请号：US17550747

    申请日：2021-12-14

    Applicant: STMicroelectronics S.r.l.

    Inventor： Fulvio Vittorio FONTANA ,  Michele DERAI

    IPC: H01L21/48 ,  H01L23/495 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31

    Abstract: A semiconductor chip is mounted at a first surface of a leadframe and an insulating encapsulation is formed onto the leadframe. An etching mask is applied to a second surface of the leadframe to cover locations of two adjacent rows of electrical contacts as well as a connecting bar between the two adjacent rows which electrically couples the electrical contacts. The second surface is then etched through the etching mask to remove leadframe material at the second surface and define the electrical contacts and connecting bar. The electrical contacts include a distal surface as well as flanks left uncovered by the insulating encapsulation. The etching mask is then removed and the electrical contacts and the connecting bars are used as electrodes in an electroplating of the distal surface and the flanks of the electrical contacts. The connecting bar is then removed from between the two adjacent rows during device singulation.

    DEVICE OF A WEARABLE TYPE FOR DISPENSING A FLUID, AND CORRESPONDING DISPENSING METHOD
    15.
    发明申请
    DEVICE OF A WEARABLE TYPE FOR DISPENSING A FLUID, AND CORRESPONDING DISPENSING METHOD 审中-公开
    用于分配流体的易磨损类型的装置和相应的分配方法

    公开(公告)号：US20160184852A1

    公开(公告)日：2016-06-30

    申请号：US14867099

    申请日：2015-09-28

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Fulvio Vittorio FONTANA

    IPC: B05B12/08 ,  B05B15/06 ,  B05B11/00

    CPC classification number: B05B12/085 ,  A61M5/14224 ,  A61M5/14248 ,  A61M5/16854 ,  A61M2005/14268 ,  A61M2205/0244 ,  B05B11/3042 ,  B05B15/62

    Abstract: A device for dispensing a fluid includes a fixed part to be worn by a user, a fluid connection including a terminal outlet, a needle coupled to the terminal outlet of the fluid connection for dispensing a fluid, and a replaceable part coupled to the fixed part via the fluid connection. The replaceable part includes a reservoir for containing the fluid to be dispensed, and a micro-pump coupled to the reservoir to send the fluid to the fixed part through the fluid connection. An actuator operates the micro-pump. The fixed part includes a pressure-sensor in proximity to the terminal outlet of the fluid connection and is associated with dispensing the fluid from the needle. An electronic control module controls operation of the micro-pump via the pressure-sensor.

    Abstract translation: 用于分配流体的装置包括要由使用者佩戴的固定部件，包括端子出口的流体连接件，连接到用于分配流体的流体连接件的端子出口的针和耦合到固定部分的可替换部件 通过流体连接。 可替换部件包括用于容纳要分配的流体的储存器和耦合到储存器的微型泵，以通过流体连接将流体发送到固定部件。 致动器操作微型泵。 固定部分包括靠近流体连接的端子出口的压力传感器，并且与从针头分配流体相关联。 电子控制模块通过压力传感器控制微型泵的操作。

    SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION
    18.
    发明公开
    SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION 审中-公开

    公开(公告)号：US20240096759A1

    公开(公告)日：2024-03-21

    申请号：US18508007

    申请日：2023-11-13

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Cristina SOMMA ,  Fulvio Vittorio FONTANA

    IPC: H01L23/495

    CPC classification number: H01L23/49503 ,  H01L23/49517 ,  H01L23/49575

    Abstract: One or more embodiments are directed to quad flat no-lead (QFN) semiconductor packages, devices, and methods in which one or more electrical components are positioned between a die pad of a QFN leadframe and a semiconductor die. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and at least one electrical component that has a first contact on the die pad and a second contact on the lead. A semiconductor die is positioned on the at least one electrical component and is spaced apart from the die pad by the at least one electrical component. The device further includes at least one conductive wire, or wire bond, that electrically couples the at least one lead to the semiconductor die.

    SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
    20.
    发明申请
    SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD 有权

    公开(公告)号：US20210407894A1

    公开(公告)日：2021-12-30

    申请号：US17470269

    申请日：2021-09-09

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Fulvio Vittorio FONTANA ,  Giovanni GRAZIOSI ,  Michele DERAI

    IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

    Abstract: Methods of forming a semiconductor device comprising a lead-frame having a die pad having at least one electrically conductive die pad area and an insulating layer applied onto the electrically conductive die pad area. An electrically conductive layer is applied onto the insulating layer with one or more semiconductor dice coupled, for instance adhesively, to the electrically conductive layer. The electrically conductive die pad area, the electrically conductive layer and the insulating layer sandwiched therebetween form at least one capacitor integrated in the device. The electrically conductive die pad area comprises a sculptured structure with valleys and peaks therein; the electrically conductive layer comprises electrically conductive filling material extending into the valleys in the sculptured structure of the electrically conductive die pad area.

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