公开(公告)号：US11009477B2

公开(公告)日：2021-05-18

申请号：US16397635

申请日：2019-04-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01K7/01 ,  G01K7/16 ,  G01K7/18 ,  G01K7/20 ,  G01L9/12 ,  H01L25/00 ,  H01L27/02 ,  H01L29/78 ,  G01N27/22 ,  H01L25/065 ,  G01L19/00 ,  G01D21/02

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

公开(公告)号：US20190257780A1

公开(公告)日：2019-08-22

申请号：US16397635

申请日：2019-04-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier LE NEEL ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01N27/22 ,  G01L19/00 ,  H01L27/02 ,  G01K7/16 ,  G01K7/20 ,  G01K7/18 ,  G01K7/01 ,  G01L9/12 ,  H01L25/00 ,  H01L25/065 ,  H01L29/78

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

公开(公告)号：US10094797B2

公开(公告)日：2018-10-09

申请号：US15605825

申请日：2017-05-25

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: H01L29/84 ,  G01N27/22 ,  H01L25/065 ,  H01L29/78 ,  G01L9/12 ,  G01K7/18 ,  G01K7/20 ,  G01L19/00 ,  G01K7/16 ,  H01L25/00 ,  H01L27/02 ,  G01K7/01 ,  G01D21/02

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

公开(公告)号：US09689824B2

公开(公告)日：2017-06-27

申请号：US14887145

申请日：2015-10-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01P15/08 ,  H01L29/84 ,  G01N27/22 ,  H01L25/065 ,  H01L25/00 ,  G01L9/12 ,  G01K7/01 ,  H01L27/02 ,  H01L29/78 ,  G01K7/18 ,  G01K7/20 ,  G01L19/00 ,  G01K7/16 ,  G01D21/02

CPC classification number: G01N27/223 ,  G01D21/02 ,  G01K7/01 ,  G01K7/16 ,  G01K7/186 ,  G01K7/20 ,  G01L9/12 ,  G01L19/0092 ,  H01L25/0652 ,  H01L25/50 ,  H01L27/0248 ,  H01L29/7804 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

公开(公告)号：US20140291829A1

公开(公告)日：2014-10-02

申请号：US13853886

申请日：2013-03-29

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Olivier Le Neel ,  Shian-Yeu Kam ,  Tien-Choy Loh ,  Ditto Adnan ,  Tze Wei Dennis Chew

IPC: H01L25/16 ,  H01L21/56

CPC classification number: H01L25/16 ,  B81C1/0023 ,  G01N27/223 ,  H01L21/56 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/00 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A micro-sensor device that includes a passivation-protected ASIC module and a micro-sensor module bonded to a patterned cap provides protection for signal conditioning circuitry while allowing one or more sensing elements in the micro-sensor module to be exposed to an ambient environment. According to a method of fabricating the micro-sensor device, the patterned cap can be bonded to the micro-sensor module using a planarizing adhesive that is chemically compatible with the sensing elements. In one embodiment, the adhesive material is the same material used for the dielectric active elements, for example, a photo-sensitive polyimide film.

Abstract translation: 包括钝化保护ASIC模块和结合到图案化盖的微传感器模块的微传感器装置为信号调节电路提供保护，同时允许微传感器模块中的一个或多个感测元件暴露于周围环境 。 根据制造微传感器装置的方法，图案化盖可以使用与感测元件化学相容的平面化粘合剂结合到微传感器模块。 在一个实施例中，粘合剂材料是用于介电活性元件的材料，例如光敏聚酰亚胺膜。

公开(公告)号：US20140291677A1

公开(公告)日：2014-10-02

申请号：US13853732

申请日：2013-03-29

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01K7/16 ,  G01N27/22 ,  G01L9/12 ,  H01L25/065 ,  H01L25/00

CPC classification number: G01N27/223 ,  G01D21/02 ,  G01K7/01 ,  G01K7/16 ,  G01K7/186 ,  G01K7/20 ,  G01L9/12 ,  G01L19/0092 ,  H01L25/0652 ,  H01L25/50 ,  H01L27/0248 ,  H01L29/7804 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

Abstract translation: 基于半导体的多传感器模块将微型温度，压力和湿度传感器集成在单个基板上。 压力和湿度传感器可以实现为电容薄膜传感器，而温度传感器实现为精密微型惠斯通电桥。 这种多传感器模块可以用作专用集成电路（ASIC）中的构建块。 此外，多传感器模块可以构建在可用于处理来自传感器的信号的现有电路之上。 使用差分传感器的集成多传感器模块可以大量同时测量各种局部环境条件，并以高精度测量。 多传感器模块还具有集成加热器，可用于自动或根据需要校准或调整传感器。 这种具有低功耗的微型集成多传感器模块可用于医疗监控和移动计算，包括智能手机应用。