MEMS DEVICE AND CORRESPONDING MICROMECHANICAL STRUCTURE WITH INTEGRATED COMPENSATION OF THERMO-MECHANICAL STRESS
    11.
    发明申请
    MEMS DEVICE AND CORRESPONDING MICROMECHANICAL STRUCTURE WITH INTEGRATED COMPENSATION OF THERMO-MECHANICAL STRESS 审中-公开
    MEMS器件与相应的微机电结构与热机械应力的综合补偿

    公开(公告)号:US20160207757A1

    公开(公告)日:2016-07-21

    申请号:US15085901

    申请日:2016-03-30

    Abstract: A micromechanical structure of a MEMS device, integrated in a die of semiconductor material provided with a substrate and having at least a first axis of symmetry lying in a horizontal plane, has a stator structure, which is fixed with respect to the substrate, and a rotor structure, having a suspended mass, mobile with respect to the substrate and to the stator structure as a result of an external action, the stator structure having fixed sensing electrodes capacitively coupled to the rotor structure; a compensation structure is integrated in the die for compensation of thermo-mechanical strains. The compensation structure has stator compensation electrodes, which are fixed with respect to the substrate, are capacitively coupled to the rotor structure, and are arranged symmetrically to the fixed sensing electrodes with respect to the first axis of symmetry.

    Abstract translation: MEMS器件的微机械结构集成在具有衬底并且至少具有位于水平面中的第一对称轴线的半导体材料的管芯中,具有相对于衬底固定的定子结构,以及 转子结构,具有悬挂质量,相对于衬底移动并由于外部动作导致定子结构,定子结构具有电容耦合到转子结构的固定感测电极; 补偿结构集成在模具中用于补偿热机械应变。 补偿结构具有相对于基板固定的定子补偿电极,电容耦合到转子结构,并且相对于第一对称轴对称地设置在固定感测电极上。

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