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公开(公告)号：US20240317580A1
公开(公告)日：2024-09-26
申请号：US18736603
申请日：2024-06-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Fumiya KUROKAWA , Yasuhiro AIDA
CPC classification number: B81C1/00301 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2201/0271 , B81B2207/07 , B81B2207/096 , B81C2203/0109
Abstract: A MEMS device includes a first substrate having a MEMS structure, a second substrate opposing the first substrate with an interval therebetween in an opposing direction, a first joint portion that includes a eutectic layer including as a main material, a eutectic alloy of plural types of metal, that is provided between the first and second substrates and surrounds the MEMS structure as viewed in the opposing direction, and that is joined to the first and second substrates, and a contact layer that is provided between the first and second substrates and is in contact with the first and second substrates. The contact layer includes a portion of the plural types of metal included in the first joint portion.
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2.发明公开公开(公告)号：US20240302169A1
公开(公告)日：2024-09-12
申请号：US18179609
申请日：2023-03-07
Applicant: Honeywell International Inc.
Inventor： Christopher J. Mauer , Shuang Li , Zhizhen Shen , Jingwei Li
CPC classification number: G01C21/188 , B81B7/02 , G01C21/18 , B81B2201/0235 , B81B2201/0242 , B81B2207/05 , G01C21/166
Abstract: An inertial measurement unit (IMU). The IMU includes: a plurality of micro-electromechanical system (MEMS) sensors, each having an output; a memory for storing calibration coefficients separately for each of the plurality of MEMS sensors, blending weights for each of the plurality of MEMS sensors, and data blending instructions for blending the outputs of the plurality of MEMS sensors; and a processor, coupled to the memory and the plurality of MEMS sensors, configured to execute the data blending instructions to apply the calibration coefficients separately to each of the plurality of MEMS sensors and the blending weights to the outputs of the plurality of MEMS sensors to create a blended output for the IMU; wherein the blending weights are calculated based on a plurality of test parameters for the plurality of MEMS sensors using at least one of a harmonic and a geometric mean of the plurality of test parameters.
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公开(公告)号：US12054386B2
公开(公告)日：2024-08-06
申请号：US17175410
申请日：2021-02-12
Applicant: STMicroelectronics S.r.l.
Inventor： Enrico Rosario Alessi , Fabio Passaniti
CPC classification number: B81B7/007 , B81B7/02 , G06N3/08 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292
Abstract: An analysis method of a device through a MEMS sensor is provided in which the MEMS sensor includes a control unit and a sensing assembly coupled to the device. The analysis method includes acquiring, through the sensing assembly, first data indicative of an operative state of the device. Testing is performed for the presence of a first abnormal operating condition of the device. If the first abnormal operating condition of the device is confirmed, a self-test of the sensing assembly is performed to generate a quantity indicative of an operative state of the sensing assembly. The self-test includes acquiring, through the sensing assembly, second data indicative of the operative state of the sensing assembly, generating a signature according to the second data, and processing the signature through deep learning techniques to generate said quantity.
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公开(公告)号：US20240228264A9
公开(公告)日：2024-07-11
申请号：US17973084
申请日：2022-10-25
Applicant: STMicroelectronics International N.V.
Inventor： Roseanne DUCA
IPC: B81B3/00 , B81C1/00 , H01L21/48 , H01L23/00 , H01L23/492 , H01L25/00 , H01L25/065
CPC classification number: B81B3/0072 , B81C1/00666 , H01L21/4875 , H01L23/4924 , H01L24/48 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/50 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/015 , B81B2207/07 , B81B2207/096 , B81C2203/038 , B81C2203/0771 , H01L2224/48011 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06548 , H01L2924/1433 , H01L2924/1461 , H01L2924/16195 , H01L2924/16251 , H01L2924/167
Abstract: A sensor package includes a packaging formed by a package bottom, first and second sidewalls extending upwardly from first and second opposite sides of the package bottom, and third and fourth sidewalls extending upwardly from third and fourth opposite sides of the package bottom, the sidewalls and package bottom defining a cavity. An integrated circuit is attached to the package bottom. A plate extends between two of the sidewalls within the cavity and is spaced apart from the package bottom. Sensors are attached to a top surface of the plate on opposite sides of an opening. Wire bondings electrically connect pads on a top face of the sensor to corresponding pads on a top face of the integrated circuit, for example by passing through the opening in the plate or passing past a side end of the plate. A lid extends across and between the sidewalls to close the cavity.
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公开(公告)号：US12024422B2
公开(公告)日：2024-07-02
申请号：US17161367
申请日：2021-01-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri Duqi , Lorenzo Baldo , Domenico Giusti
CPC classification number: B81C1/00238 , B81B7/0051 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2203/0118 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81B2207/07 , B81C2201/0133 , B81C2203/032 , B81C2203/035 , B81C2203/0792
Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.
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Patent Agency Ranking
公开(公告)号：US12013240B2
公开(公告)日：2024-06-18
申请号：US17873125
申请日：2022-07-25
Applicant: AAC Kaitai Technologies (Wuhan) CO., LTD
Inventor： Zhao Ma , Zhan Zhan , Xiao Kan , Shan Yang , Shitao Yan , Hongtao Peng , Yang Li , Kahkeen Lai , Veronica Tan
IPC: G01C19/5733 , G01C19/5769
CPC classification number: G01C19/5733 , G01C19/5769 , B81B2201/0242
Abstract: A MEMS gyroscope includes an anchor point unit, a sensing unit elastically connected with the anchor point unit, and a driving unit elastically connected with the anchor point unit and the sensing unit. The anchor point unit includes four corner anchor point structures arranged at four corners of the MEMS gyroscope and four central anchor points. The sensing unit includes four first mass blocks elastically connected with the corner anchor point structures and the central anchor points to form avoiding spaces, four second mass blocks arranged within the avoiding spaces, and four decoupling mass blocks. The driving unit includes four driving pieces respectively connected with outer sides of the second mass blocks. The MEMS gyroscope realizes independent detection of angular velocities of three axes and realizes differential detection and balance of vibration moment, which immune to influence of acceleration shock and quadrature error and improves detection accuracy.
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公开(公告)号：US20240132340A1
公开(公告)日：2024-04-25
申请号：US17973084
申请日：2022-10-24
Applicant: STMicroelectronics (Malta) Ltd.
Inventor： Roseanne DUCA
IPC: B81B3/00 , B81C1/00 , H01L21/48 , H01L23/00 , H01L23/492 , H01L25/00 , H01L25/065
CPC classification number: B81B3/0072 , B81C1/00666 , H01L21/4875 , H01L23/4924 , H01L24/48 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/50 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/015 , B81B2207/07 , B81B2207/096 , B81C2203/038 , B81C2203/0771 , H01L2224/48011 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06548 , H01L2924/1433 , H01L2924/1461 , H01L2924/16195 , H01L2924/16251 , H01L2924/167
Abstract: A sensor package includes a packaging formed by a package bottom, first and second sidewalls extending upwardly from first and second opposite sides of the package bottom, and third and fourth sidewalls extending upwardly from third and fourth opposite sides of the package bottom, the sidewalls and package bottom defining a cavity. An integrated circuit is attached to the package bottom. A plate extends between two of the sidewalls within the cavity and is spaced apart from the package bottom. Sensors are attached to a top surface of the plate on opposite sides of an opening. Wire bondings electrically connect pads on a top face of the sensor to corresponding pads on a top face of the integrated circuit, for example by passing through the opening in the plate or passing past a side end of the plate. A lid extends across and between the sidewalls to close the cavity.
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公开(公告)号：US20240044936A1
公开(公告)日：2024-02-08
申请号：US18487459
申请日：2023-10-16
Applicant: SEIKO EPSON CORPORATION
Inventor： Yusuke KINOSHITA , Nobuyuki IMAI
CPC classification number: G01P15/18 , G01C21/165 , G01C21/18 , G01S19/47 , G01S19/49 , B81B2201/0242 , B81B2201/0235
Abstract: An inertia measurement device, which is used in combination with a satellite positioning receiver that outputs a positioning result at every T seconds in a positioning system equipped on a vehicle, when a Z-axis angular velocity sensor, a position error P[m] based on the detection signal of the Z-axis angular velocity sensor while the vehicle moves at a moving speed V[m/sec] for T seconds satisfies Pp≥P=(V/Bz)×(1−cos(Bz×T)) (where, a bias error of the Z-axis angular velocity sensor is Bz[deg/sec] and a predetermined allowable maximum position error during movement for T seconds is Pp[m]), and a bias error Bx and By of the Y-axis angular velocity sensor satisfies Bz
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公开(公告)号：US11885621B2
公开(公告)日：2024-01-30
申请号：US17415340
申请日：2020-02-04
Inventor： Koichiro Nakashima , Takashi Uchida , Yusuke Nakamura , Hideki Ueda , Naruhito Noda , Toshitsugu Konishi , Toshio Yamazaki
IPC: G01C19/5783 , B81B7/00 , G01C19/5684
CPC classification number: G01C19/5783 , B81B7/007 , B81B7/0048 , G01C19/5684 , B81B2201/0242
Abstract: A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.
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公开(公告)号：US20230382719A1
公开(公告)日：2023-11-30
申请号：US18359892
申请日：2023-07-27
Inventor： CHING-KAI SHEN , YI-CHUAN TENG , WEI-CHU LIN , HUNG-WEI LIANG , JUNG-KUO TU
CPC classification number: B81B7/0041 , B81C1/00293 , B81B2201/0235 , B81C2203/0145 , B81B2201/0242 , B81B2207/07
Abstract: The present disclosure provides a method for fabricating a semiconductor structure, including bonding a capping substrate over a sensing substrate, forming a through hole traversing the capping substrate, forming a dielectric layer over the capping substrate under a first vacuum level, and forming a metal layer over the dielectric layer under a second vacuum level, wherein the second vacuum level is higher than the first vacuum level.
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