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1.发明申请INTEGRATED ACOUSTIC TRANSDUCER IN MEMS TECHNOLOGY, AND MANUFACTURING PROCESS THEREOF 审中-公开MEMS技术中的集成式声学传感器及其制造工艺公开(公告)号：US20140038335A1
公开(公告)日：2014-02-06
申请号：US14035798
申请日：2013-09-24
Applicant: STMicroelectronics S.r.l.
Inventor： Angelo Antonio Merassi , Sarah Zerbini , Luca Coronato
CPC classification number: B81C1/00182 , B81B3/0035 , B81B3/0072 , B81B2201/0257 , B81C1/00158 , H04R7/24 , H04R19/005 , H04R19/04 , H04R31/00 , Y10T29/49005
Abstract: A MEMS acoustic transducer, for example, a microphone, includes a substrate provided with a cavity, a supporting structure, fixed to the substrate, a membrane having a perimetral edge and a centroid, suspended above the cavity and fixed to the substrate the membrane configured to oscillate via the supporting structure. The supporting structure includes a plurality of anchorage elements fixed to the membrane, and each anchorage element is coupled to a respective portion of the membrane between the centroid and the perimetral edge of the membrane.
Abstract translation: MEMS声换能器，例如麦克风，包括设置有空腔的基板，固定到基板的支撑结构，具有周缘和质心的膜，悬挂在空腔上方并固定到基板上，膜构造 通过支撑结构振荡。 支撑结构包括固定在膜上的多个锚定元件，并且每个锚定元件在膜的质心和周边之间连接到膜的相应部分。
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2.发明授权MEMS device and corresponding micromechanical structure with integrated compensation of thermo-mechanical stress 有权MEMS器件和相应的微机械结构具有热机械应力的集成补偿公开(公告)号：US09327962B2
公开(公告)日：2016-05-03
申请号：US14189774
申请日：2014-02-25
Applicant: STMicroelectronics S.r.l.
Inventor： Angelo Antonio Merassi
CPC classification number: B81B3/0072 , B81B2201/0242 , G01P1/006 , G01P15/125 , G01P15/18 , G01P2015/0814 , G01P2015/0831
Abstract: A micromechanical structure of a MEMS device, integrated in a die of semiconductor material provided with a substrate and having at least a first axis of symmetry lying in a horizontal plane, has a stator structure, which is fixed with respect to the substrate, and a rotor structure, having a suspended mass, mobile with respect to the substrate and to the stator structure as a result of an external action, the stator structure having fixed sensing electrodes capacitively coupled to the rotor structure; a compensation structure is integrated in the die for compensation of thermo-mechanical strains. The compensation structure has stator compensation electrodes, which are fixed with respect to the substrate, are capacitively coupled to the rotor structure, and are arranged symmetrically to the fixed sensing electrodes with respect to the first axis of symmetry.
Abstract translation: MEMS器件的微机械结构集成在具有衬底并且至少具有位于水平面中的第一对称轴线的半导体材料的管芯中，具有相对于衬底固定的定子结构，以及 转子结构，具有悬挂质量，相对于衬底移动并由于外部动作导致定子结构，定子结构具有电容耦合到转子结构的固定感测电极; 补偿结构集成在模具中用于补偿热机械应变。 补偿结构具有相对于基板固定的定子补偿电极，电容耦合到转子结构，并且相对于第一对称轴对称地设置在固定感测电极上。
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3.发明授权Semiconductor integrated device with mechanically decoupled active area and related manufacturing process 有权半导体集成器件具有机械解耦有源区和相关制造工艺公开(公告)号：US09184138B2
公开(公告)日：2015-11-10
申请号：US13719103
申请日：2012-12-18
Inventor： Angelo Antonio Merassi , Marco Ferrera , Marco Mantovani , Paolo Ferrari , Benedetto Vigna
CPC classification number: H01L23/562 , H01L21/56 , H01L23/16 , H01L23/3107 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor integrated device is provided with: a die having a body of semiconductor material with a front surface, and an active area arranged at the front surface; and a package having a support element carrying the die at a back surface of the body, and a coating material covering the die. The body includes a mechanical decoupling region, which mechanically decouples the active area from mechanical stresses induced by the package; the mechanical decoupling region is a trench arrangement within the body, which releases the active area from an external frame of the body, designed to absorb the mechanical stresses induced by the package.
Abstract translation: 半导体集成器件具有：具有前表面的半导体材料体的主体和配置在前表面的有源区域; 以及具有在主体的背面承载模具的支撑元件和覆盖模具的包覆材料的包装。 机体包括机械解耦区域，机械解耦有源区域与由包装引起的机械应力; 机械解耦区域是主体内的沟槽布置，其从主体的外框架释放活动区域，设计成吸收由包装引起的机械应力。
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4.发明申请PROCESS FOR MANUFACTURING AN INTEGRATED MEMBRANE OF NOZZLES IN MEMS TECHNOLOGY FOR A SPRAY DEVICE AND SPRAY DEVICE USING SUCH MEMBRANE 审中-公开在使用这种膜的喷雾装置和喷射装置的MEMS技术中制造喷嘴的集成膜的方法公开(公告)号：US20140202453A1
公开(公告)日：2014-07-24
申请号：US14225285
申请日：2014-03-25
Applicant: STMicroelectronics S.r.l.
Inventor： Angelo Antonio Merassi , Angelo Pesci , Benedetto Vigna , Ernestino Galeazzi , Marco Mantovani
IPC: A61M15/00
CPC classification number: A61M15/009 , B05B1/14 , B05B17/0638 , B05D7/00 , B81B2201/058 , B81B2203/0127 , B81C1/00087 , Y10T29/49401
Abstract: A process for manufacturing a membrane of nozzles of a spray device, comprising the steps of laying a substrate, forming a membrane layer on the substrate, forming a plurality of nozzles in the membrane layer, forming a plurality of supply channels in the substrate, each supply channel being substantially aligned in a vertical direction to a respective nozzle of the plurality of nozzles and in direct communication with the respective nozzle.
Abstract translation: 一种喷雾装置的喷嘴膜的制造方法，其特征在于，包括以下步骤：在所述基材上形成膜层，在所述膜层上形成膜层，在所述膜层中形成多个喷嘴，在所述基材中形成多个供给流路， 供应通道在垂直方向上基本上对准多个喷嘴中的相应喷嘴并与相应喷嘴直接连通。
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5.发明授权Process for manufacturing an integrated membrane of nozzles in MEMS technology for a spray device and spray device using such membrane 有权用于制造用于喷雾装置的MEMS技术中的喷嘴集成膜的方法和使用这种膜的喷涂装置的方法公开(公告)号：US08721910B2
公开(公告)日：2014-05-13
申请号：US13754510
申请日：2013-01-30
Applicant: STMicroelectronics S.r.l.
Inventor： Angelo Antonio Merassi , Angelo Pesci , Benedetto Vigna , Ernestino Galeazzi , Marco Mantovani
IPC: B44C1/22
CPC classification number: A61M15/009 , B05B1/14 , B05B17/0638 , B05D7/00 , B81B2201/058 , B81B2203/0127 , B81C1/00087 , Y10T29/49401
Abstract: A process for manufacturing a membrane of nozzles of a spray device, comprising the steps of laying a substrate, forming a membrane layer on the substrate, forming a plurality of nozzles in the membrane layer, forming a plurality of supply channels in the substrate, each supply channel being substantially aligned in a vertical direction to a respective nozzle of the plurality of nozzles and in direct communication with the respective nozzle.
Abstract translation: 一种喷雾装置的喷嘴膜的制造方法，其特征在于，包括以下步骤：在所述基材上形成膜层，在所述膜层上形成膜层，在所述膜层中形成多个喷嘴，在所述基材中形成多个供给流路， 供应通道在垂直方向上基本上对准多个喷嘴中的相应喷嘴并与相应喷嘴直接连通。
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Patent Agency Ranking
公开(公告)号：US09815687B2
公开(公告)日：2017-11-14
申请号：US15085901
申请日：2016-03-30
Applicant: STMicroelectronics S.R.L.
Inventor： Angelo Antonio Merassi
CPC classification number: B81B3/0072 , B81B2201/0242 , G01P1/006 , G01P15/125 , G01P15/18 , G01P2015/0814 , G01P2015/0831
Abstract: A micromechanical structure of a MEMS device, integrated in a die of semiconductor material provided with a substrate and having at least a first axis of symmetry lying in a horizontal plane, has a stator structure, which is fixed with respect to the substrate, and a rotor structure, having a suspended mass, mobile with respect to the substrate and to the stator structure as a result of an external action, the stator structure having fixed sensing electrodes capacitively coupled to the rotor structure; a compensation structure is integrated in the die for compensation of thermo-mechanical strains. The compensation structure has stator compensation electrodes, which are fixed with respect to the substrate, are capacitively coupled to the rotor structure, and are arranged symmetrically to the fixed sensing electrodes with respect to the first axis of symmetry.
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7.发明申请SEMICONDUCTOR INTEGRATED DEVICE WITH MECHANICALLY DECOUPLED ACTIVE AREA AND RELATED MANUFACTURING PROCESS 有权具有机械解除活动区域的半导体集成器件及相关制造工艺公开(公告)号：US20130168840A1
公开(公告)日：2013-07-04
申请号：US13719103
申请日：2012-12-18
Inventor： Angelo Antonio Merassi , Marco Ferrera , Marco Mantovani , Paolo Ferrari , Benedetto Vigna
CPC classification number: H01L23/562 , H01L21/56 , H01L23/16 , H01L23/3107 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor integrated device is provided with: a die having a body of semiconductor material with a front surface, and an active area arranged at the front surface; and a package having a support element carrying the die at a back surface of the body, and a coating material covering the die. The body includes a mechanical decoupling region, which mechanically decouples the active area from mechanical stresses induced by the package; the mechanical decoupling region is a trench arrangement within the body, which releases the active area from an external frame of the body, designed to absorb the mechanical stresses induced by the package.
Abstract translation: 半导体集成器件具有：具有前表面的半导体材料体的主体和配置在前表面的有源区域; 以及具有在主体的背面承载模具的支撑元件和覆盖模具的包覆材料的包装。 机体包括机械解耦区域，机械解耦有源区域与由包装引起的机械应力; 机械解耦区域是主体内的沟槽布置，其从主体的外框架释放活动区域，设计成吸收由包装引起的机械应力。
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8.发明申请PROCESS FOR MANUFACTURING AN INTEGRATED MEMBRANE OF NOZZLES IN MEMS TECHNOLOGY FOR A SPRAY DEVICE AND SPRAY DEVICE USING SUCH MEMBRANE 有权在使用这种膜的喷雾装置和喷射装置的MEMS技术中制造喷嘴的集成膜的方法公开(公告)号：US20130134131A1
公开(公告)日：2013-05-30
申请号：US13754510
申请日：2013-01-30
Applicant: STMicroelectronics S.r.l.
Inventor： Angelo Antonio Merassi , Angelo Pesci , Benedetto Vigna , Ernestino Galeazzi , Mauro Mantovani
IPC: B05D7/00
CPC classification number: A61M15/009 , B05B1/14 , B05B17/0638 , B05D7/00 , B81B2201/058 , B81B2203/0127 , B81C1/00087 , Y10T29/49401
Abstract: A process for manufacturing a membrane of nozzles of a spray device, comprising the steps of laying a substrate, forming a membrane layer on the substrate, forming a plurality of nozzles in the membrane layer, forming a plurality of supply channels in the substrate, each supply channel being substantially aligned in a vertical direction to a respective nozzle of the plurality of nozzles and in direct communication with the respective nozzle.
Abstract translation: 一种喷雾装置的喷嘴膜的制造方法，其特征在于，包括以下步骤：在所述基材上形成膜层，在所述膜层上形成膜层，在所述膜层中形成多个喷嘴，在所述基材中形成多个供给流路， 供应通道在垂直方向上基本上对准多个喷嘴中的相应喷嘴并与相应喷嘴直接连通。
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9.发明授权Process for manufacturing an integrated membrane of nozzles in MEMS technology for a spray device and spray device using such membrane 有权用于制造用于喷雾装置的MEMS技术中的喷嘴集成膜的方法和使用这种膜的喷涂装置的方法公开(公告)号：US09486593B2
公开(公告)日：2016-11-08
申请号：US14225285
申请日：2014-03-25
Applicant: STMicroelectronics S.r.l.
Inventor： Angelo Antonio Merassi , Angelo Pesci , Benedetto Vigna , Ernestino Galeazzi , Marco Mantovani
CPC classification number: A61M15/009 , B05B1/14 , B05B17/0638 , B05D7/00 , B81B2201/058 , B81B2203/0127 , B81C1/00087 , Y10T29/49401
Abstract: A process for manufacturing a membrane of nozzles of a spray device, comprising the steps of laying a substrate, forming a membrane layer on the substrate, forming a plurality of nozzles in the membrane layer, forming a plurality of supply channels in the substrate, each supply channel being substantially aligned in a vertical direction to a respective nozzle of the plurality of nozzles and in direct communication with the respective nozzle.
Abstract translation: 一种喷雾装置的喷嘴膜的制造方法，其特征在于，包括以下步骤：在所述基材上形成膜层，在所述膜层上形成膜层，在所述膜层中形成多个喷嘴，在所述基材中形成多个供给流路， 供应通道在垂直方向上基本上对准多个喷嘴中的相应喷嘴并与相应喷嘴直接连通。
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10.发明申请MEMS DEVICE AND CORRESPONDING MICROMECHANICAL STRUCTURE WITH INTEGRATED COMPENSATION OF THERMO-MECHANICAL STRESS 有权MEMS器件与相应的微机电结构与热机械应力的综合补偿公开(公告)号：US20140252509A1
公开(公告)日：2014-09-11
申请号：US14189774
申请日：2014-02-25
Applicant: STMicroelectronics S.r.l.
Inventor： Angelo Antonio Merassi
IPC: B81B3/00
CPC classification number: B81B3/0072 , B81B2201/0242 , G01P1/006 , G01P15/125 , G01P15/18 , G01P2015/0814 , G01P2015/0831
Abstract: A micromechanical structure of a MEMS device, integrated in a die of semiconductor material provided with a substrate and having at least a first axis of symmetry lying in a horizontal plane, has a stator structure, which is fixed with respect to the substrate, and a rotor structure, having a suspended mass, mobile with respect to the substrate and to the stator structure as a result of an external action, the stator structure having fixed sensing electrodes capacitively coupled to the rotor structure; a compensation structure is integrated in the die for compensation of thermo-mechanical strains. The compensation structure has stator compensation electrodes, which are fixed with respect to the substrate, are capacitively coupled to the rotor structure, and are arranged symmetrically to the fixed sensing electrodes with respect to the first axis of symmetry.
Abstract translation: MEMS器件的微机械结构集成在具有衬底并且至少具有位于水平面中的第一对称轴线的半导体材料的管芯中，具有相对于衬底固定的定子结构，以及 转子结构，具有悬挂质量，相对于衬底移动并由于外部动作导致定子结构，定子结构具有电容耦合到转子结构的固定感测电极; 补偿结构集成在模具中用于补偿热机械应变。 补偿结构具有相对于基板固定的定子补偿电极，电容耦合到转子结构，并且相对于第一对称轴对称地设置在固定感测电极上。
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