Method for manufacturing an ohmic contact for a HEMT device

    公开(公告)号:US12154967B2

    公开(公告)日:2024-11-26

    申请号:US16697051

    申请日:2019-11-26

    Abstract: A method for manufacturing an ohmic contact for a HEMT device, comprising the steps of: forming a photoresist layer, on a semiconductor body comprising a heterostructure; forming, in the photoresist layer, an opening, through which a surface region of the semiconductor body is exposed at said heterostructure; etching the surface region of the semiconductor body using the photoresist layer as etching mask to form a trench in the heterostructure; depositing one or more metal layers in said trench and on the photoresist layer; and carrying out a process of lift-off of the photoresist layer.

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