Bonding structure and display device including the same

    公开(公告)号:US11586258B2

    公开(公告)日:2023-02-21

    申请号:US16939866

    申请日:2020-07-27

    Abstract: A display device includes a display panel, a bonding substrate and a bridge board. The display panel includes a pixel array disposed on a base substrate and an input pad electrically connected to the pixel array. The bonding substrate is disposed under the display panel and includes an output pad. The bridge board is bonded to the input pad of the display panel and the output pad of the bonding substrate to electrically connect the display panel to the bonding substrate, wherein the bridge board includes a rigid material.

    Display device
    12.
    发明授权

    公开(公告)号:US11093011B2

    公开(公告)日:2021-08-17

    申请号:US16856032

    申请日:2020-04-23

    Abstract: A display device including a lower substrate having a display area and a pad area, a display structure disposed in the display area of the lower substrate, pad electrodes disposed in the pad area of the lower substrate and spaced apart in a first direction, and a conductive film package including a base substrate disposed on the pad electrodes, and including a corner portion having a curved shape, bump electrodes disposed in a first portion of a bottom surface of the base substrate and overlapping the pad electrodes, metal patterns disposed in second portions of the bottom surface of the base substrate positioned at both sides of the first portion, a first film layer disposed between the base substrate and the lower substrate and overlapping the pad electrodes, a part of the bump electrodes, and the metal patterns, and conductive balls disposed inside the first film layer.

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