DISPLAY DEVICE
    1.
    发明申请

    公开(公告)号:US20210341974A1

    公开(公告)日:2021-11-04

    申请号:US17374915

    申请日:2021-07-13

    Abstract: A display device including a lower substrate having a display area and a pad area, a display structure disposed in the display area of the lower substrate, pad electrodes disposed in the pad area of the lower substrate and spaced apart in a first direction, and a conductive film package including a base substrate disposed on the pad electrodes, and including a corner portion having a curved shape, bump electrodes disposed in a first portion of a bottom surface of the base substrate and overlapping the pad electrodes, metal patterns disposed in second portions of the bottom surface of the base substrate positioned at both sides of the first portion, a first film layer disposed between the base substrate and the lower substrate and overlapping the pad electrodes, a part of the bump electrodes, and the metal patterns, and conductive balls disposed inside the first film layer.

    Display apparatus and method of manufacturing the same

    公开(公告)号:US11036071B2

    公开(公告)日:2021-06-15

    申请号:US16655724

    申请日:2019-10-17

    Abstract: A method of manufacturing a display apparatus is provided as follows. A substrate having a display portion on an upper surface of the substrate is prepared. A protection film having an opening is attached to a lower surface of the substrate so that the protection film overlaps the display portion. A support film is attached to the lower surface so that the support film is disposed within the opening of the protection film. A driving circuit chip is attached to the upper surface so that the driving chip is spaced apart from the display portion and the opening. At least a part of the support film is removed. The substrate is bent along a longitudinal direction of the opening.

    Electronic device and method of manufacturing the same

    公开(公告)号:US12058817B2

    公开(公告)日:2024-08-06

    申请号:US17827768

    申请日:2022-05-29

    CPC classification number: H05K3/323 H05K3/361 H01L24/83

    Abstract: An electronic device includes a display panel having first pads, a circuit board that includes second pads corresponding to the first pads, and a conductive adhesive member disposed between the display panel and the circuit board to connect the first pads and the second pads, in which the conductive adhesive member includes a first resin layer adjacent to the display panel, a second resin layer disposed between the first resin layer and the circuit board and having a curing agent different from that of the first resin layer, and conductive particles disposed in the first resin layer wherein at least one of the second pads protrudes through the second resin layer and is in contact with the conductive particles.

    Display apparatus and method of manufacturing the same

    公开(公告)号:US10483098B2

    公开(公告)日:2019-11-19

    申请号:US15585357

    申请日:2017-05-03

    Abstract: A method of manufacturing a display apparatus is provided as follows. A substrate having a display portion on an upper surface of the substrate is prepared. A protection film having an opening is attached to a lower surface of the substrate so that the protection film overlaps the display portion. A support film is attached to the lower surface so that the support film is disposed within the opening of the protection film. A driving circuit chip is attached to the upper surface so that the driving chip is spaced apart from the display portion and the opening. At least a part of the support film is removed. The substrate is bent along a longitudinal direction of the opening.

    Display device and method of providing the same

    公开(公告)号:US11943980B2

    公开(公告)日:2024-03-26

    申请号:US17716277

    申请日:2022-04-08

    Inventor: Hayoung Choi

    Abstract: A display device includes a display panel, a circuit board, a first conductive film, first and second lower films, and first and second adhesive layers. The display panel includes a display area and a pad area which includes a first pad part. The circuit board is attached on the display panel and includes a lead part overlapping the first pad part. The first conductive film is between the display panel and the circuit board and electrically connects the first pad part and the lead part to each other. The first and second lower films are attached to the display panel to respectively correspond to the display area and the pad area. A thickness of the second adhesive layer between the display panel and the second lower film is less than a thickness of the first adhesive layer between the display panel and the first lower film.

    Display device
    8.
    发明授权

    公开(公告)号:US10333087B2

    公开(公告)日:2019-06-25

    申请号:US15709943

    申请日:2017-09-20

    Abstract: A display device includes a substrate having a planar area, a bending area extending from the planar area, and a surrounding area extending from the bending area, a first protective layer at a boundary portion of the bending area, and a second protective layer covering an entire surface of the bending area and covering the first protective layer.

    Display device
    10.
    发明授权

    公开(公告)号:US11599162B2

    公开(公告)日:2023-03-07

    申请号:US17374915

    申请日:2021-07-13

    Abstract: A display device including a lower substrate having a display area and a pad area, a display structure disposed in the display area of the lower substrate, pad electrodes disposed in the pad area of the lower substrate and spaced apart in a first direction, and a conductive film package including a base substrate disposed on the pad electrodes, and including a corner portion having a curved shape, bump electrodes disposed in a first portion of a bottom surface of the base substrate and overlapping the pad electrodes, metal patterns disposed in second portions of the bottom surface of the base substrate positioned at both sides of the first portion, a first film layer disposed between the base substrate and the lower substrate and overlapping the pad electrodes, a part of the bump electrodes, and the metal patterns, and conductive balls disposed inside the first film layer.

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