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    Polarizer and display device including the same
    11.
    发明授权
    Polarizer and display device including the same 有权

    公开(公告)号：US10261359B1

    公开(公告)日：2019-04-16

    申请号：US15958384

    申请日：2018-04-20

    Applicant: Samsung Display Co., Ltd.

    Inventor： Seon Uk Lee ,  Min Su Kim ,  Jae Cheol Park ,  Yeo Geon Yoon ,  You Young Jin ,  Wang Su Hong

    IPC: G02F1/1335 ,  G02B5/30 ,  G02F1/1337

    Abstract: Provided are a polarizer and a display device including a polarizer. The polarizer comprises: a base; a wire grid pattern layer disposed on the base and including wire patterns extending in a first direction and spaced apart from each other in a second direction intersecting the first direction; and a capping layer which is disposed on the wire grid pattern layer and comprises a first inorganic capping layer containing an inorganic material and an organic capping layer containing an organic material, wherein the first inorganic capping layer comprises inorganic capping patterns which are disposed on the wire grid pattern layer, extend in the first direction and are spaced apart from each other in the second direction and being disposed at positions corresponding to the wire patterns, and at least a portion of the organic capping layer is inserted into a space between adjacent inorganic capping patterns.

    DECORATIVE PRINT MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
    12.
    发明申请
    DECORATIVE PRINT MEMBER AND DISPLAY DEVICE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20180370183A1

    公开(公告)日：2018-12-27

    申请号：US15842634

    申请日：2017-12-14

    Applicant: Samsung Display Co., Ltd.

    Inventor： Min Su Kim ,  Ji Young Wang

    IPC: B32B3/30 ,  B41M3/00

    Abstract: A decorative print member and a display device including the decorative print member are provided. The decorative print member includes a base layer, a first decorative print pattern disposed on the base layer, and a shielding layer disposed over the first decorative print pattern. The first decorative print pattern includes a first decorative print layer disposed on the base layer, and a second decorative print layer disposed on the first decorative print layer. The shielding layer covers upper and side surfaces of the second decorative print layer, and a side surface of the first decorative print layer protrudes outwardly from the side surface of the second decorative print layer and a side surface of the shielding layer.

    Liquid crystal display
    13.
    发明授权
    Liquid crystal display 有权

    公开(公告)号：US09977288B2

    公开(公告)日：2018-05-22

    申请号：US14514694

    申请日：2014-10-15

    Applicant: Samsung Display Co., Ltd.

    Inventor： Ho Lim ,  Min Su Kim ,  Sung-Yi Kim ,  Tae Min Kim ,  Tae Hoon Kim ,  Yi Seul Song

    IPC: C09K19/00 ,  G02F1/1337

    CPC classification number: G02F1/133711 ,  G02F1/133788 ,  G02F2001/133726 ,  G02F2001/133742 ,  Y10T428/10 ,  Y10T428/1005

    Abstract: A liquid crystal display includes: a first insulating substrate, a second insulating substrate, a pixel electrode positioned on the first insulating substrate, a common electrode positioned on the first insulating substrate or the second insulating substrate, a first alignment layer positioned on the first insulating substrate, a second alignment layer positioned on the second insulating substrate, and a liquid crystal layer positioned between the first insulating substrate and the second insulating substrate. The first alignment layer and/or the second alignment layer include an additive and an alignment layer compound having a main chain, and a plurality of side chains connected to the main chain, and at least one of the plurality of side chains includes a vertical alignment group, and a reactive mesogen including two or more photoreactive groups.

    Chip bonding apparatus and chip bonding method
    16.
    发明授权
    Chip bonding apparatus and chip bonding method 有权
    芯片接合装置和芯片接合方法

    公开(公告)号：US09570417B2

    公开(公告)日：2017-02-14

    申请号：US14706752

    申请日：2015-05-07

    Applicant: Samsung Display Co., Ltd.

    Inventor： Seong Beom Jeong ,  Min Su Kim

    IPC: H01L21/00 ,  H01L23/00

    CPC classification number: H01L24/83 ,  H01L24/75 ,  H01L2224/83048 ,  H01L2224/83091 ,  H01L2224/83121 ,  H01L2224/83851

    Abstract: The chip bonding apparatus used in a chip bonding method includes a heating unit for heating an anisotropic conductive film at a first temperature; an attachment unit for attaching an integrated circuit chip to the anisotropic conductive film; a stage on which a substrate is seated; a chip transport unit for moving and aligning the integrated circuit chip that is attached to the anisotropic conductive film on the substrate; and a bonding head arranged above the stage to bond the integrated circuit chip that is attached to the anisotropic conductive film onto the substrate through thermo-compression of the integrated circuit chip onto the substrate at a second temperature that is lower than the first temperature.

    Abstract translation: 用于芯片接合方法的芯片接合装置包括：加热单元，用于在第一温度下加热各向异性导电膜; 用于将集成电路芯片附接到各向异性导电膜的附接单元; 衬底就座的阶段; 芯片传送单元，用于移动和对准附着到基板上的各向异性导电膜的集成电路芯片; 以及结合头，其布置在所述平台上方，以在低于所述第一温度的第二温度下将所述集成电路芯片通过所述集成电路芯片的热压缩而将附着于所述各向异性导电膜的所述集成电路芯片接合到所述基板上。

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