公开(公告)号：US20210183784A1

公开(公告)日：2021-06-17

申请号：US16809925

申请日：2020-03-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Mi Sun HWANG ,  Dae Jung BYUN ,  Chang Hwa PARK ,  Sang Ho JEONG ,  Jun Hyeong JANG ,  Ki Ho NA ,  Je Sang PARK ,  Yong Duk LEE ,  Yoo Rim CHA ,  Yeo Il PARK

IPC: H01L23/538 ,  H01L23/00

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.

公开(公告)号：US20220174816A1

公开(公告)日：2022-06-02

申请号：US17222528

申请日：2021-04-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Hoon KIM ,  Yong Duk LEE ,  Duck Young MAENG

IPC: H05K1/11

Abstract: A printed circuit board includes a first substrate portion including a first insulating layer and a first wiring layer; and a second substrate portion disposed on the first substrate portion and including a second insulating layer, a pad disposed on the second insulating layer, and a first via penetrating through the second insulating layer and connecting the first wiring layer and the pad to each other. The first via has a boundary with each of the first wiring layer and the pad, and includes a first metal layer and a second metal layer disposed on different levels.

公开(公告)号：US20210193580A1

公开(公告)日：2021-06-24

申请号：US16817807

申请日：2020-03-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Jung BYUN ,  Chang Hwa PARK ,  Sang Ho JEONG ,  Ki Ho NA ,  Je Sang PARK ,  Yong Duk LEE ,  Jin Won LEE

IPC: H01L23/538 ,  H01L23/64

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.

公开(公告)号：US20210183774A1

公开(公告)日：2021-06-17

申请号：US16814197

申请日：2020-03-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Jung BYUN ,  Chang Hwa PARK ,  Sang Ho JEONG ,  Je Sang PARK ,  Mi Sun HWANG ,  Yong Duk LEE ,  Jin Won LEE ,  Yeo Il PARK

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/065 ,  H01L23/522

Abstract: A substrate embedded electronic component package includes a core member having a cavity in which a metal layer is disposed on a bottom surface thereof, an electronic component disposed in the cavity, an encapsulant filling at least a portion of the cavity and covering at least a portion of each of the core member and the electronic component, and a connection structure disposed on the encapsulant and including a first wiring layer connected to the electronic component. A wall surface of the cavity has at least one groove portion protruding outwardly from a center of the cavity, and the groove portion extends to a same depth in the core member as a depth of the cavity.