公开(公告)号：US20230354513A1

公开(公告)日：2023-11-02

申请号：US18217791

申请日：2023-07-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Jung BYUN ,  Mi Sun HWANG ,  Jung Soo KIM ,  Jin Won LEE ,  Duck Young MAENG

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/036 ,  H05K1/185 ,  H05K1/115 ,  H05K2201/0141 ,  H05K1/0366 ,  H05K1/111

Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.

公开(公告)号：US20220174816A1

公开(公告)日：2022-06-02

申请号：US17222528

申请日：2021-04-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Hoon KIM ,  Yong Duk LEE ,  Duck Young MAENG

IPC: H05K1/11

Abstract: A printed circuit board includes a first substrate portion including a first insulating layer and a first wiring layer; and a second substrate portion disposed on the first substrate portion and including a second insulating layer, a pad disposed on the second insulating layer, and a first via penetrating through the second insulating layer and connecting the first wiring layer and the pad to each other. The first via has a boundary with each of the first wiring layer and the pad, and includes a first metal layer and a second metal layer disposed on different levels.

公开(公告)号：US20220078905A1

公开(公告)日：2022-03-10

申请号：US17198754

申请日：2021-03-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Jung BYUN ,  Mi Sun HWANG ,  Jung Soo KIM ,  Jin Won LEE ,  Duck Young MAENG

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18

Abstract: A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.

公开(公告)号：US20140185254A1

公开(公告)日：2014-07-03

申请号：US13845020

申请日：2013-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jee Soo MOK ,  Jong Seok BAE ,  Soon Jin CHO ,  Duck Young MAENG

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/28 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/26175 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2224/92225 ,  H01L2924/12042 ,  H05K3/3452 ,  H05K2201/09909 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Disclosed herein is a printed circuit board including: a base substrate in which a connection pad is formed; a solder resist layer formed on the base substrate and comprising a trench exposing a surface of the base substrate; and a dam formed on the solder resist layer and burying the inside of the trench.

Abstract translation: 这里公开了一种印刷电路板，包括：基底，其中形成连接垫; 阻焊层，形成在所述基底基板上并且包括暴露所述基底基板的表面的沟槽; 以及形成在阻焊层上并埋设沟槽内部的坝。