公开(公告)号：US20160007439A1

公开(公告)日：2016-01-07

申请号：US14674765

申请日：2015-03-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Hwan SON ,  Myeong Gi KIM ,  Min Kyoung CHEON ,  Yu Jin CHOI ,  Ho Yoon KIM ,  So Yeon SONG

IPC: H05K1/02 ,  H05K1/18 ,  H01F27/28 ,  H01G4/40 ,  H01F27/29

CPC classification number: H05K1/023 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/0026 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30 ,  H01G4/40 ,  H05K1/181

Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor.

Abstract translation: 复合电子部件包括电容器和电感器彼此耦合的复合体，所述电容器包括：陶瓷体，其包括多个电介质层和第一和第二内部电极，所述电感器包括具有线圈的磁性体 部分。 输入端子设置在复合体的第一侧表面上并连接到线圈部分。 输出端子包括设置在复合体的第一侧表面上并连接到线圈部分的第一输出端子和设置在复合体的第一端面上并连接到第一内部电极的第二输出端子。 接地端子设置在复合体的第二端面上并连接到第二内部电极。 电容器耦合到电感器的侧表面。

公开(公告)号：US20150155084A1

公开(公告)日：2015-06-04

申请号：US14289025

申请日：2014-05-28

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ic Seob KIM ,  Soo Hwan SON ,  Yu Jin CHOI ,  Ho Yoon KIM ,  Myeong Gi KIM ,  So Yeon SONG ,  Min Kyoung CHEON ,  Byeong Cheol MOON ,  Young Il LEE

IPC: H01F1/147 ,  H01F41/04 ,  H05K1/11 ,  H05K1/18 ,  H01F27/255 ,  H01F27/28

CPC classification number: H05K1/181 ,  H01F1/22 ,  H01F17/0013 ,  H01F27/255 ,  H01F41/046 ,  H01F2017/0066

Abstract: A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an active part including the plurality of magnetic metal layers and internal conductive layer. The multilayer electronic component may have excellent DC bias characteristics by using a magnetic metal material, implement low direction resistance (Rdc) by increasing a cross-sectional area of an internal coil, and secure high magnetic permeability while decreasing a core loss of the magnetic metal material to thereby improve efficiency characteristic.

Abstract translation: 多层电子部件及其制造方法以及具有该多个电子部件的基板。 多层电子部件包括多个磁性金属层，形成在磁性金属层上的内部导电层，形成在包括多个磁性金属层和内部导电层的有源部分上和之下的上部和下部覆盖层。 多层电子部件可以通过使用磁性金属材料具有优异的DC偏置特性，通过增加内部线圈的横截面积来实现低方向电阻（Rdc），并且在降低磁性金属的磁芯损耗的同时确保高磁导率 材料，从而提高效率特性。