中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

35 records (took 0.017 seconds)

    ELECTRONIC COMPONENT
    1.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20200126720A1

    公开(公告)日：2020-04-23

    申请号：US16212567

    申请日：2018-12-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan SON ,  Ho Yoon KIM ,  Sang Soo PARK ,  Woo Chul SHIN

    IPC: H01G4/002 ,  H01G4/30 ,  H01G4/248 ,  H01G4/224 ,  H01G4/232

    Abstract: An electronic component includes a multilayer capacitor including a capacitor body, and an external electrode disposed on an external surface of the capacitor body, an interposer including an interposer body, and an external terminals disposed on an external surface of the interposer body, and an encapsulation portion disposed to cover the multilayer capacitor. The external terminal includes a bonding portion disposed on a first surface of the interposer body to be electrically connected to the external electrode, a mounting portion disposed on a second surface of the interposer opposing the first surface, and a connection portion disposed on an end surface of the interposer to electrically connect the bonding portion to the mounting portion. A thickness of the encapsulation portion is within a range from 0.001 to 0.01 of a length of the electronic component.

    ELECTRONIC COMPONENT
    2.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20200082979A1

    公开(公告)日：2020-03-12

    申请号：US16195399

    申请日：2018-11-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ho Yoon KIM ,  Sang Soo PARK ,  Woo Chul SHIN

    IPC: H01G4/002 ,  H01G4/30 ,  H01G4/248 ,  H01G4/232

    Abstract: An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The external terminals include bonding portions, mounting portions, and connection portions disposed to connect the bonding portions and the mounting portions to each other. Adhesives are provided between the external electrodes and the bonding portion. A height at which the adhesives fall along the connection portions of the external terminals is defined as t and a height of the interposer is defined as T, t/T satisfies 0.04≤t/T≤0.80.

    ELECTRONIC COMPONENTS
    3.
    发明申请
    ELECTRONIC COMPONENTS 审中-公开

    公开(公告)号：US20190259539A1

    公开(公告)日：2019-08-22

    申请号：US16155474

    申请日：2018-10-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ho Yoon KIM ,  Jae Yeol CHOI ,  Soo Hwan SON

    IPC: H01G4/38 ,  H01G4/30 ,  H05K1/11 ,  H01G4/232 ,  H05K1/18

    Abstract: An electronic component includes: a plurality of multilayer capacitors stacked in multiple rows and columns and each having external electrodes on both ends thereof in a first direction; and a board including a body and a connection portion. The connection portion includes: a plurality of positive electrode land patterns; a plurality of negative electrode land patterns; positive and negative electrode terminal patterns formed on a lower surface of the body to be spaced apart from each other in the first direction; a positive electrode connection portion connecting the plurality of positive electrode land patterns to the positive electrode terminal pattern; and a negative electrode connection portion connecting the plurality of negative electrode land patterns to the negative electrode terminal pattern.

    ELECTRONIC COMPONENT
    6.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20200090864A1

    公开(公告)日：2020-03-19

    申请号：US16195499

    申请日：2018-11-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ho Yoon KIM ,  Sang Soo PARK ,  Woo Chul SHIN

    IPC: H01G4/002 ,  H01G4/30 ,  H01G4/248

    Abstract: An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The pair of external terminals include bonding portions disposed on a top surface of the interposer body, mounting portions disposed on a bottom surface of the interposer body, and connection portions disposed on end surfaces of the interposer to connect the bonding portions and the mounting portions to each other. The mounting portions have lengths greater than lengths of the bonding portions in a direction of connection of the pair of external terminals.

    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    7.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开

    公开(公告)号：US20190069410A1

    公开(公告)日：2019-02-28

    申请号：US15959993

    申请日：2018-04-23

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Man Su BYUN ,  Ho Yoon KIM ,  Kyung Hwa YU ,  Dae Heon JEONG ,  Min Kyoung CHEON ,  Soo Hwan SON

    IPC: H05K1/18 ,  H01G4/30 ,  H01G4/232 ,  H01G4/002

    Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
    8.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON 审中-公开

    公开(公告)号：US20180137979A1

    公开(公告)日：2018-05-17

    申请号：US15436085

    申请日：2017-02-17

    Applicant: Samsung Electro-Mechanics, Co., Ltd.

    Inventor： Ho Yoon KIM

    IPC: H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H01G4/224 ,  H01G4/002 ,  H05K1/18 ,  H05K1/11

    CPC classification number: H01G4/30 ,  H01G4/002 ,  H01G4/012 ,  H01G4/224 ,  H01G4/248 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015

    Abstract: A composite electronic component includes: a composite including a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with respective dielectric layers interposed therebetween, external electrodes extending from third and fourth surfaces of the capacitor body to portions of the first, second, fifth, and sixth surfaces, respectively, a discharge layer disposed between the external electrodes on the second surface of the capacitor body, and a protective layer disposed on the discharge layer; and conductive resin layers overlapping the third and fourth surfaces and portions of the first, second, fifth, and sixth surfaces, respectively. Widths of portions of the external electrodes formed on the first surface of the capacitor body are greater than widths of portions of the first and second conductive resin layers overlapping the first surface of the capacitor body.

    COMPOSITE ELECTRONIC COMPONENT
    9.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT 审中-公开
    复合电子元件

    公开(公告)号：US20160181011A1

    公开(公告)日：2016-06-23

    申请号：US14887043

    申请日：2015-10-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yu Jin CHOI ,  Min Kyoung CHEON ,  Soo Hwan SON ,  Ho Yoon KIM

    IPC: H01F27/40 ,  H01F27/24 ,  H01G4/248 ,  H01G4/30 ,  H01G4/232 ,  H01G4/005 ,  H01F27/28 ,  H05K1/18

    CPC classification number: H01G4/232 ,  H01F17/0013 ,  H01F27/24 ,  H01F27/2804 ,  H01F27/292 ,  H01F2017/0066 ,  H01G4/30 ,  H01G4/40 ,  H05K3/3442

    Abstract: A composite electronic component includes a composite body including a capacitor and an inductor bonded to each other; an input terminal disposed on a first end surface of the composite body and connected to the coil part of the inductor; an output terminal including a first output terminal disposed on a second end surface of the composite body and connected to the coil part of the inductor and a second output terminal disposed on the second end surface of the composite body and connected to the first internal electrodes of the capacitor; and a ground terminal disposed on the first end surface of the composite body and connected to the second internal electrodes of the capacitor. A bonded surface between the inductor and the capacitor is provided with insulating layers.

    Abstract translation: 复合电子部件包括具有彼此结合的电容器和电感器的复合体; 输入端子，设置在复合体的第一端面上并连接到电感器的线圈部分; 输出端子，包括设置在复合体的第二端面上并连接到电感器的线圈部分的第一输出端子和设置在复合体的第二端面上的第二输出端子，并且连接到第一内部电极 电容器 以及配置在复合体的第一端面上并与电容器的第二内部电极连接的接地端子。 电感器和电容器之间的接合表面设置有绝缘层。

    INDUCTOR ARRAY CHIP AND BOARD HAVING THE SAME
    10.
    发明申请
    INDUCTOR ARRAY CHIP AND BOARD HAVING THE SAME 审中-公开
    电感阵列芯片和具有相同功能的板

    公开(公告)号：US20160078997A1

    公开(公告)日：2016-03-17

    申请号：US14678912

    申请日：2015-04-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan SON ,  Yu Jin CHOI ,  Ho Yoon KIM

    IPC: H01F27/28 ,  H01F27/29 ,  H05K1/18

    CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F17/0033

    Abstract: There are provided an inductor array chip and a board having the same. The inductor array chip includes: a body in which a plurality of magnetic layers are stacked; first and second coil parts having a plurality of conductive patterns and a plurality of conductive vias formed in the plurality of magnetic layers; and first to fourth external electrodes disposed on outer surfaces of the body to be connected to both ends of the first and second coil parts, wherein the first and second coil parts are disposed in a thickness direction of the body and are separated from each other by a gap layer disposed therebetween.

    Abstract translation: 提供了一种电感器阵列芯片和具有该电感器阵列芯片的电路板。 电感器阵列芯片包括：堆叠多个磁性层的主体; 第一和第二线圈部分具有多个导电图案和形成在多个磁性层中的多个导电通孔; 以及设置在所述主体的外表面上以与所述第一和第二线圈部的两端连接的第一至第四外部电极，其中所述第一和第二线圈部分沿着所述主体的厚度方向设置并且彼此分离， 间隔层设置在它们之间。

Patent Agency Ranking