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    FERRITE POWDER OF METAL, FERRITE MATERIAL COMPRISING THE SAME, AND MULTILAYERED CHIP COMPONENTS COMPRISING FERRITE LAYER USING THE FERRITE MATERIAL
    1.
    发明申请
    FERRITE POWDER OF METAL, FERRITE MATERIAL COMPRISING THE SAME, AND MULTILAYERED CHIP COMPONENTS COMPRISING FERRITE LAYER USING THE FERRITE MATERIAL 审中-公开
    含铁的金属粉末，包含它的铁素体粉末和使用铁素体的包含铁素体层的多层芯片组件

    公开(公告)号：US20140239219A1

    公开(公告)日：2014-08-28

    申请号：US14273118

    申请日：2014-05-08

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Yong AN ,  Myeong Gi KIM ,  Ic Seob KIM

    IPC: H01F1/01

    CPC classification number: H01F1/01 ,  H01F1/33 ,  H01F1/36 ,  H01F17/04 ,  H01F27/255

    Abstract: Disclosed herein are a ferrite powder having a core-shell structure, the core being made of iron (Fe) or iron-based compounds comprising iron (Fe) and the shell being made of metal oxides, a ferrite material comprising the ferrite powder and the glass, and multilayered chip components including the ferrite layer using the ferrite material, inner electrodes, and outer electrodes. According to the exemplary embodiments of the present invention, it is possible to provide the ferrite material capable of improving the change in the inductance L value in response to applied current by suppressing magnetization at high current. The multilayered chip components including the ferrite material according to the exemplary embodiment of the present invention can also be used in a band of MHz.

    Abstract translation: 本发明公开了一种具有核 - 壳结构的铁氧体粉末，该芯由铁（Fe）或铁（Fe）构成的铁基化合物和壳由金属氧化物制成，铁氧体材料包含铁氧体粉末和 玻璃和多层芯片部件，包括使用铁氧体材料的铁氧体层，内部电极和外部电极。 根据本发明的示例性实施例，可以提供能够通过抑制高电流下的磁化来响应于施加的电流来改进电感L值的变化的铁氧体材料。 包括根据本发明的示例性实施例的铁氧体材料的多层芯片组件也可以用于MHz频带。

    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    2.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 有权
    复合电子元件及其相应的板

    公开(公告)号：US20150371781A1

    公开(公告)日：2015-12-24

    申请号：US14745319

    申请日：2015-06-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Kang Ryong CHOI ,  Il Jin PARK ,  Sung Yong AN ,  Jung Wook SEO ,  Myeong Gi KIM

    IPC: H01G4/40 ,  H01F27/28 ,  H01G4/30

    CPC classification number: H03H7/0115 ,  H01F27/2804 ,  H01G4/30 ,  H01G4/40 ,  H03H2001/0057 ,  H03H2001/0085

    Abstract: A composite electronic component includes a composite body containing a capacitor and an inductor coupled to each other, the capacitor including a ceramic body having a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part, an input terminal disposed on a first end surface of the composite body and connected to the coil part, an output terminal including first output terminals disposed on a second end surface of the composite body and connected to the coil part and a second output terminal disposed on a second side surface of the composite body and connected to the first internal electrodes, and a ground terminal disposed on a first side surface of the composite body. The capacitor and the inductor are coupled in a vertical direction, and a magnetic metal layer is provided between the inductor and the capacitor.

    Abstract translation: 复合电子部件包括：复合体，其包含彼此耦合的电容器和电感器，所述电容器包括具有多个电介质层和第一和第二内部电极的陶瓷体，所述电感器包括具有线圈部的磁性体， 输入端子，设置在复合体的第一端面上并连接到线圈部分;输出端子，包括设置在复合体的第二端面上并连接到线圈部分的第一输出端子和布置在线圈部分上的第二输出端子 复合体的第二侧面，与第一内部电极连接，配置在复合体的第一侧面上的接地端子。 电容器和电感器在垂直方向上耦合，并且在电感器和电容器之间提供磁性金属层。

    COMPOSITE ELECTRONIC COMPONENT AND A BOARD FOR MOUNTING THE SAME
    3.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND A BOARD FOR MOUNTING THE SAME 有权
    复合电子元件和安装板的板

    公开(公告)号：US20150109074A1

    公开(公告)日：2015-04-23

    申请号：US14315110

    申请日：2014-06-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan SON ,  Jin Woo HAHN ,  Joon Hwan KWAG ,  Kyoung No LEE ,  Myeong Gi KIM ,  Hwan Soo LEE

    IPC: H03H7/01

    CPC classification number: H03H7/0115 ,  H03H2001/0085

    Abstract: A composite electronic component may include: a composite body including a capacitor formed of a ceramic body in which a plurality of dielectric layers and first and second internal electrodes are laminated, and an inductor formed of a magnetic body including a coil; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on the second end surface of the composite body; and a ground terminal disposed on one or more of upper and lower surfaces and the first end surface of the capacitor of the composite body. The capacitor is adjacent to the inductor.

    Abstract translation: 复合电子部件可以包括：复合体，包括由多个电介质层和第一和第二内部电极层叠的陶瓷体形成的电容器和由包括线圈的磁体形成的电感器; 输入端子，设置在复合体的第一端面上; 输出端子，包括设置在复合体的第二端面上的第一输出端子和设置在复合体的第二端面上的第二输出端子; 以及设置在所述复合体的电容器的上表面和下表面的一个或多个以及第一端面上的接地端子。 电容器与电感器相邻。

    MULTI-LAYERED CHIP ELECTRONIC COMPONENT
    6.
    发明申请
    MULTI-LAYERED CHIP ELECTRONIC COMPONENT 有权
    多层芯片电子元件

    公开(公告)号：US20130335184A1

    公开(公告)日：2013-12-19

    申请号：US13633544

    申请日：2012-10-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Woo HAHN ,  Myeong Gi KIM ,  Sung Yong AN ,  Ic Seob KIM ,  Byeong Cheol MOON

    IPC: H01F5/00

    CPC classification number: H01F3/14 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/292

    Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 μm≦Tg≦7 μm, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern.

    Abstract translation: 提供一种多层芯片电子部件，其包括：包括2016尺寸以下的多层磁性层的多层体; 导电图案在堆叠方向上电连接以形成多层体内的线圈图案; 以及形成在多层磁性层之间的层叠多层体的表面上的非磁性间隙层，其厚度Tg在1mum @ Tg @7μm的范围内，其中非磁隙层数 可以具有在磁性层中的至少四层之间的范围内的间隙层的数量和线圈图案的匝数。

    MULTILAYER ELECTRONIC COMPONENT
    9.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权
    多层电子元件

    公开(公告)号：US20150102888A1

    公开(公告)日：2015-04-16

    申请号：US14281097

    申请日：2014-05-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Myeong Gi KIM ,  Il Jin Park ,  Ho Yoon Kim ,  Jin Woo Hahn ,  Min Kyoung Cheon

    IPC: H01F27/255 ,  H01F27/28

    CPC classification number: H01F17/0013

    Abstract: A multilayer electronic component may include: a magnetic body in which a plurality of magnetic layers are stacked; and conductor patterns formed on the magnetic body. The magnetic body may include: metal magnetic particles; an oxide film formed on a surface of the metal magnetic particle as a first oxide obtained by oxidation of at least one component of the metal magnetic particle; and a filling portion formed in a space between the metal magnetic particles as a second oxide obtained by oxidization of at least one component of the metal magnetic particle. At least one of the first oxide and the second oxide is provided between adjacent metal magnetic particles, and an oxide film formed on a surface of a metal magnetic particle forms a neck portion with an oxide film formed on a surface of an adjacent metal magnetic particle.

    Abstract translation: 多层电子部件可以包括：堆叠多个磁性层的磁性体; 以及形成在磁体上的导体图案。 磁体可以包括：金属磁性颗粒; 形成在所述金属磁性体的表面上的氧化膜，作为通过使所述金属磁性体的至少一种成分氧化而得到的第一氧化物; 以及填充部分，其形成在金属磁性颗粒之间的空间中，作为通过氧化金属磁性颗粒的至少一种成分而获得的第二氧化物。 第一氧化物和第二氧化物中的至少一个设置在相邻的金属磁性颗粒之间，形成在金属磁性颗粒的表面上的氧化膜形成具有在相邻的金属磁性颗粒的表面上形成的氧化膜的颈部 。

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