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    TANTALUM CAPACITOR
    2.
    发明申请
    TANTALUM CAPACITOR 审中-公开

    公开(公告)号：US20200168405A1

    公开(公告)日：2020-05-28

    申请号：US16594262

    申请日：2019-10-07

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hong Kyu SHIN ,  Young June LEE ,  Hun Chol JUNG ,  Yu Jin CHOI

    IPC: H01G9/10 ,  H01G9/012 ,  H01G9/042

    Abstract: A tantalum capacitor includes: a tantalum body comprising tantalum powder and a tantalum wire exposed to one end surface; an anode lead frame comprising a first electrode member and a second electrode member bent perpendicularly thereto; a cathode electrode lead frame comprising a third electrode member spaced apart from the first electrode member having the tantalum body mounted on an upper surface thereof and a fourth electrode member bent perpendicularly thereto; and a encapsulation portion covering the tantalum body so that lower surfaces of the first and third electrode members and one external surfaces of the second and fourth electrode members are exposed. The anode lead frame comprises a bend portion having a connection part of the first electrode member and the second electrode member as an axis, and an end of the bend portion is in contact with the tantalum wire.

    COMPOSITE ELECTRONIC COMPONENT
    3.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT 审中-公开
    复合电子元件

    公开(公告)号：US20160181011A1

    公开(公告)日：2016-06-23

    申请号：US14887043

    申请日：2015-10-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yu Jin CHOI ,  Min Kyoung CHEON ,  Soo Hwan SON ,  Ho Yoon KIM

    IPC: H01F27/40 ,  H01F27/24 ,  H01G4/248 ,  H01G4/30 ,  H01G4/232 ,  H01G4/005 ,  H01F27/28 ,  H05K1/18

    CPC classification number: H01G4/232 ,  H01F17/0013 ,  H01F27/24 ,  H01F27/2804 ,  H01F27/292 ,  H01F2017/0066 ,  H01G4/30 ,  H01G4/40 ,  H05K3/3442

    Abstract: A composite electronic component includes a composite body including a capacitor and an inductor bonded to each other; an input terminal disposed on a first end surface of the composite body and connected to the coil part of the inductor; an output terminal including a first output terminal disposed on a second end surface of the composite body and connected to the coil part of the inductor and a second output terminal disposed on the second end surface of the composite body and connected to the first internal electrodes of the capacitor; and a ground terminal disposed on the first end surface of the composite body and connected to the second internal electrodes of the capacitor. A bonded surface between the inductor and the capacitor is provided with insulating layers.

    Abstract translation: 复合电子部件包括具有彼此结合的电容器和电感器的复合体; 输入端子，设置在复合体的第一端面上并连接到电感器的线圈部分; 输出端子，包括设置在复合体的第二端面上并连接到电感器的线圈部分的第一输出端子和设置在复合体的第二端面上的第二输出端子，并且连接到第一内部电极 电容器 以及配置在复合体的第一端面上并与电容器的第二内部电极连接的接地端子。 电感器和电容器之间的接合表面设置有绝缘层。

    INDUCTOR ARRAY CHIP AND BOARD HAVING THE SAME
    4.
    发明申请
    INDUCTOR ARRAY CHIP AND BOARD HAVING THE SAME 审中-公开
    电感阵列芯片和具有相同功能的板

    公开(公告)号：US20160078997A1

    公开(公告)日：2016-03-17

    申请号：US14678912

    申请日：2015-04-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan SON ,  Yu Jin CHOI ,  Ho Yoon KIM

    IPC: H01F27/28 ,  H01F27/29 ,  H05K1/18

    CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F17/0033

    Abstract: There are provided an inductor array chip and a board having the same. The inductor array chip includes: a body in which a plurality of magnetic layers are stacked; first and second coil parts having a plurality of conductive patterns and a plurality of conductive vias formed in the plurality of magnetic layers; and first to fourth external electrodes disposed on outer surfaces of the body to be connected to both ends of the first and second coil parts, wherein the first and second coil parts are disposed in a thickness direction of the body and are separated from each other by a gap layer disposed therebetween.

    Abstract translation: 提供了一种电感器阵列芯片和具有该电感器阵列芯片的电路板。 电感器阵列芯片包括：堆叠多个磁性层的主体; 第一和第二线圈部分具有多个导电图案和形成在多个磁性层中的多个导电通孔; 以及设置在所述主体的外表面上以与所述第一和第二线圈部的两端连接的第一至第四外部电极，其中所述第一和第二线圈部分沿着所述主体的厚度方向设置并且彼此分离， 间隔层设置在它们之间。

    INDUCTOR
    5.
    发明申请
    INDUCTOR 有权
    电感器

    公开(公告)号：US20160042860A1

    公开(公告)日：2016-02-11

    申请号：US14812947

    申请日：2015-07-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yu Jin CHOI

    IPC: H01F27/28

    CPC classification number: H01F17/0013 ,  H01F27/292 ,  H01F2017/002

    Abstract: Disclosed herein is an inductor including a ceramic main body on which a first ceramic sheet on which a primary conductor pattern is formed and a second ceramic sheet on which a secondary conductor pattern is formed are alternately stacked; a first via passing through the second ceramic sheet and connecting the primary conductor pattern; and a second via passing through the first ceramic sheet and connecting the secondary conductor pattern, so as to reinforce an electromagnetic coupling of primary and secondary coils.

    Abstract translation: 本文公开了一种电感器，其包括陶瓷主体，其上形成有主导体图案的第一陶瓷片和形成有二次导体图案的第二陶瓷片交替堆叠; 第一通孔穿过第二陶瓷片并连接主导体图案; 以及通过第一陶瓷片并连接次级导体图案的第二通孔，以便加强初级和次级线圈的电磁耦合。

    TANTALUM CAPACITOR
    6.
    发明申请
    TANTALUM CAPACITOR 有权

    公开(公告)号：US20210210289A1

    公开(公告)日：2021-07-08

    申请号：US16938007

    申请日：2020-07-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hong Kyu SHIN ,  Young June LEE ,  Yu Jin CHOI

    IPC: H01G9/012 ,  H01G9/15 ,  H01G9/042 ,  H01G9/10 ,  H01G9/052 ,  H01G2/02

    Abstract: A tantalum capacitor includes a tantalum body having a tantalum wire exposed from one surface; a positive electrode terminal including a first electrode portion connected to the tantalum wire and a second electrode portion connected to be perpendicular to the first electrode portion; wherein the first electrode portion includes a first protrusion disposed in a tantalum wire direction, and the tantalum wire includes a first groove disposed in a tantalum body direction, wherein the first groove and the first protrusion are connected to each other.

    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    9.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 有权
    复合电子元件及其相应的板

    公开(公告)号：US20170018373A1

    公开(公告)日：2017-01-19

    申请号：US15069438

    申请日：2016-03-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan SON ,  Young Ghyu AHN ,  Yu Jin CHOI

    IPC: H01G15/00 ,  H01G9/15 ,  H01G9/042 ,  H05K1/11 ,  H01G4/012 ,  H01G4/12 ,  H01G4/008 ,  H05K1/18 ,  H01G4/30

    CPC classification number: H05K1/111 ,  H01G2/06 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/30 ,  H01G4/38 ,  H01G9/042 ,  H01G9/15 ,  H05K1/181 ,  H05K2201/10015

    Abstract: A composite electronic component includes a multilayer ceramic capacitor including a ceramic body in which dielectric layers and internal electrodes are alternately disposed, and first and second external electrodes disposed on a lower surface of the ceramic body; a tantalum capacitor including a body portion containing a sintered material of a tantalum powder and a tantalum wire having a portion embedded in the body portion, and disposed on the multilayer ceramic capacitor; and an encapsulant part enclosing the tantalum capacitor and the multilayer ceramic capacitor, wherein the internal electrodes are led to the lower surface of the ceramic body.

    Abstract translation: 复合电子部件包括：层叠陶瓷电容器，其包括交替设置电介质层和内部电极的陶瓷体，以及设置在陶瓷体的下表面的第一外部电极和第二外部电极; 钽电容器，包括：包含钽粉末的烧结材料的主体部分和具有嵌入在主体部分中的部分的钽线，并且设置在所述多层陶瓷电容器上; 以及包围钽电容器和多层陶瓷电容器的密封剂部件，其中内部电极被引导到陶瓷体的下表面。

    COMPOSITE ELECTRONIC COMPONENT, BOARD HAVING THE SAME, AND PACKAGING UNIT THEREOF
    10.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT, BOARD HAVING THE SAME, AND PACKAGING UNIT THEREOF 审中-公开
    复合电子元件，具有该组件的板及其包装单元

    公开(公告)号：US20160042872A1

    公开(公告)日：2016-02-11

    申请号：US14638816

    申请日：2015-03-04

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yu Jin CHOI ,  Soo Hwan SON

    IPC: H01G4/40 ,  H01G4/30 ,  H01F27/29 ,  H05K1/11 ,  H01F27/28 ,  H01G4/12 ,  H05K1/18

    CPC classification number: H01G4/40 ,  H01F17/0013 ,  H01F27/255 ,  H01F27/292 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/306 ,  H05K3/3442 ,  H05K2201/1006 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: A composite electronic component includes: a composite body having a capacitor and an inductor coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to oppose each other with each of the dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part; an input terminal disposed on a first side surface of the composite body; an output terminal including a first output terminal disposed on a second side surface of the composite body and a second output terminal disposed on the second side surface of the composite body; and a ground terminal disposed on the first side surface of the composite body.

    Abstract translation: 复合电子部件包括：具有彼此耦合的电容器和电感器的复合体，所述电容器包括陶瓷体，所述陶瓷体中多个电介质层和设置成与每个所述电介质层彼此相对的第一和第二内部电极 叠置在其间，并且所述电感器包括包括线圈部分的磁体; 输入端子，设置在复合体的第一侧面上; 输出端子，包括设置在复合体的第二侧表面上的第一输出端子和设置在复合体的第二侧表面上的第二输出端子; 以及设置在复合体的第一侧面上的接地端子。

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