公开(公告)号：US20230140892A1

公开(公告)日：2023-05-11

申请号：US17879515

申请日：2022-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung AHN ,  Kwangeun KIM ,  Souk KIM ,  Younghoon SOHN

IPC: H01J37/28 ,  H01J37/22 ,  H01J37/244

CPC classification number: H01J37/28 ,  H01J37/226 ,  H01J37/244

Abstract: A scanning electron microscope (SEM) includes an electron gun, a deflector, an objective lens, first and second detectors each configured to detect emission electrons emitted from the wafer based on the input electron beam being irradiated on the wafer, a first energy filter configured to block electrons having energy less than a first energy among emission electrons emitted from a wafer based on an input electron beam from being detected by the first detector, and a second energy filter configured to block electrons having energy less than second energy among the emission electrons from being detected by the second detector.

公开(公告)号：US20200182783A1

公开(公告)日：2020-06-11

申请号：US16566100

申请日：2019-09-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunhong JUN ,  Sung Yoon RYU ,  Souk KIM ,  Younghoon SOHN ,  Yusin YANG

IPC: G01N21/3581 ,  G01N21/39 ,  G02F1/13363

Abstract: Disclosed are a measuring apparatus and a substrate analysis method using the same. The measuring apparatus includes a light source that generates a laser beam, a beam splitter that splits the laser beam into a probe laser beam and a reference laser beam, an antenna that receives the probe laser beam to produce a terahertz beam, an electro-optical device that receives the reference laser beam and the terahertz beam to change a vertical polarization component and a horizontal polarization component of the reference laser beam, based on intensity of the terahertz beam, and a streak camera that obtains a time-domain signal corresponding to a ratio between the vertical polarization component and the horizontal polarization component.

公开(公告)号：US20180101940A1

公开(公告)日：2018-04-12

申请号：US15691958

申请日：2017-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younghoon SOHN ,  Ilsoo Kim ,  Yusin Yang

IPC: G06T7/00 ,  H01L21/66

CPC classification number: G06T7/001 ,  G06T2207/30148 ,  H01L21/4857 ,  H01L22/12 ,  H01L22/20 ,  H01L23/13 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/97 ,  H01L2924/15311

Abstract: Disclosed are an inspection method, an inspection system, and a method of fabricating a semiconductor package using the same. The inspection method comprises obtaining a reference value by measuring a surface profile of a reference pattern, scanning reference images of the reference pattern by using a plurality of optical inspection conditions, obtaining estimation values of the reference pattern that are measured from the reference images, selecting an desired optical inspection condition among the plurality of optical inspection conditions by comparing the reference value with the estimation values, scanning a target image of a target pattern by using the desired optical inspection condition, and obtaining an error value by quantitatively comparing the target image with a design image of the target pattern.

公开(公告)号：US20180025949A1

公开(公告)日：2018-01-25

申请号：US15584166

申请日：2017-05-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younghoon SOHN ,  Yusin YANG

IPC: H01L21/66 ,  G01R31/265 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  G01B11/27 ,  G01R31/28

Abstract: A method of measuring misalignment of chips, a method of fabricating a fan-out panel level package using the same, and a fan-out panel level package fabricated thereby are provided. The measuring method may include obtaining images by scanning chips on a substrate, obtaining absolute offsets of reference chips with respect to the substrate in the images, obtaining relative offsets of subordinate chips with respect to the reference chips in the images, and calculating misalignments of the chips based on the absolute offsets and the relative offsets.