公开(公告)号：US10916833B2

公开(公告)日：2021-02-09

申请号：US16291567

申请日：2019-03-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Ryul Shin ,  Min Sakong ,  Chae Up Yoo ,  Jin Woo Jung ,  Ho Saeng Kim ,  Byung Chan Jang

IPC: H01Q1/24 ,  H01Q9/42 ,  H01Q5/378

Abstract: An electronic device is provided. The electronic device includes a housing including a segment part used to insulate a portion of the housing and an antenna disposed at a position corresponding to the segment part.

公开(公告)号：US10707559B2

公开(公告)日：2020-07-07

申请号：US15899674

申请日：2018-02-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Moon Soo Son ,  Dong Ryul Shin ,  Hee Jun Lee ,  Byung Chan Jang ,  Hyun Jun Jeong

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q5/371 ,  H01Q7/00 ,  H01Q1/48 ,  H01Q21/28 ,  H01Q9/42 ,  H01Q5/328 ,  H04M1/02 ,  H05K9/00 ,  H01Q9/30

Abstract: Disclosed is an electronic device that includes a housing including a first plate, a second plate, and a side member, a ground layer, a display, a communication circuit, and a processor. The side member includes a first conductive part, a second conductive part, and a non-conductive part in contact with the first conductive part and the second conductive part and interposed between the first conductive part and the second conductive part. The first conductive part may be electrically coupled with the second conductive part. The ground layer may be electrically coupled with a partial section of the first conductive part that is adjacent to the second conductive part. The communication circuit may be electrically connected with the first conductive part and the second conductive part.

公开(公告)号：US20180026361A1

公开(公告)日：2018-01-25

申请号：US15656669

申请日：2017-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min SAKONG ,  Dong Ryul Shin ,  Yoon Jae Lee ,  Seong Tae Jeong ,  Jin Woo Jung

IPC: H01Q3/00 ,  H04B1/3827 ,  H01Q1/48 ,  H01Q1/24

CPC classification number: H01Q3/00 ,  H01Q1/243 ,  H01Q1/245 ,  H01Q1/48 ,  H01Q5/35 ,  H01Q5/378 ,  H04B1/3838

Abstract: A communication method performed in an electronic device including a conductive pattern and the electronic device are provided. The electronic device includes a conductive pattern used as a radiator for wireless communication, a feeding unit connected with the conductive pattern, a ground unit connected with the conductive pattern, a first impedance matching circuit disposed in a first area adjacent to the feeding unit and connected to the conductive pattern, a second impedance matching circuit disposed in a second area adjacent to the conductive pattern and connected to the conductive pattern, and a control unit that matches impedance by controlling at least one of the first impedance matching circuit and the second impedance matching circuit by a closed-loop scheme.

公开(公告)号：US20170250460A1

公开(公告)日：2017-08-31

申请号：US15443822

申请日：2017-02-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Ryul Shin ,  Young Gwon Koo ,  Ho Saeng Kim ,  Jin Woo Jung ,  Jae Bong Chun ,  Hyun Suk Choi

IPC: H01Q1/24 ,  G06F3/14 ,  H04M1/02 ,  G09G5/00 ,  H01Q1/38 ,  G06F3/041 ,  G06F3/147

Abstract: An electronic device is provided, which includes a housing including a first plate, a second plate, and a side plate surrounding part of a space between the first plate and the second plate, a display positioned inside the housing and exposed through the first plate, a first conductive plate attached to or integrated into the display, wherein the first conductive plate faces the first direction and includes a first periphery extending along the side plate, a second conductive plate facing the third direction, wherein the second conducive plate includes a second periphery extending along the first periphery and a portion of the second periphery is coupled to the first periphery, and a wireless communication circuit electrically connected to the second conductive plate and configured to use at least one of the first conductive plate or the second conductive plate as an antenna element.

公开(公告)号：US11152686B2

公开(公告)日：2021-10-19

申请号：US16107277

申请日：2018-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Ryul Shin ,  Him Chan YuN ,  Yoon Jae Lee ,  Jung Hoon Seo ,  Ui Chul Jeong

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q5/371 ,  H01Q1/50 ,  H01Q9/04 ,  H05K1/02 ,  H05K1/18

Abstract: An electronic device which includes a housing is provided. The housing includes a first surface, a second surface facing away from the first surface, and a side member surrounding a space between the first surface and the second surface, a display that is exposed through a substantial portion of the first surface of the housing, a first radiator that forms a portion of the side member, a PCB that is positioned within the housing and includes a ground layer, a communication circuit that is positioned on the PCB, and a conductive pattern having a length corresponding to a length of the first radiator.

公开(公告)号：US10396434B2

公开(公告)日：2019-08-27

申请号：US15411340

申请日：2017-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Gwon Koo ,  Dong Ryul Shin ,  Jin Woo Jung ,  Byoung Uk Yoon ,  Jae Bong Chun ,  Hyun Suk Choi

IPC: H01Q1/12 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q1/48 ,  H01Q1/52 ,  H01Q9/42 ,  H04M1/02 ,  H05K1/02 ,  H05K1/18 ,  H01Q13/10 ,  H04B1/3827

Abstract: An electronic device is provided. The electronic device includes a housing including a first surface, a second surface, and a side plate surrounding part of a space between the first surface and the second surface, a display disposed in the housing, a first plate attached to or integrated into the display, a second plate facing in the third direction and positioned adjacent to the side plate, a flexible printed circuit board (FPCB) including a first planar portion coupled to the first plate, and a second planar portion coupled to the second plate and angled from the first planar portion, a printed circuit board (PCB) interposed between the display and the second surface, and a mid-plate disposed in the housing, wherein the second planar portion of the FPCB is interposed between a side surface of the mid-plate and the second plate separated from each other by a gap.

公开(公告)号：US20190198978A1

公开(公告)日：2019-06-27

申请号：US16291567

申请日：2019-03-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Ryul Shin ,  Min Sakong ,  Chae Up Yoo ,  Jin Woo Jung ,  Ho Saeng Kim ,  Byung Chan Jang

IPC: H01Q1/24 ,  H01Q5/378 ,  H01Q9/42

CPC classification number: H01Q1/243 ,  H01Q1/241 ,  H01Q5/378 ,  H01Q9/42

Abstract: An electronic device is provided. The electronic device includes a housing including a segment part used to insulate a portion of the housing and an antenna disposed at a position corresponding to the segment part.

公开(公告)号：US10224603B2

公开(公告)日：2019-03-05

申请号：US14922967

申请日：2015-10-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Ryul Shin ,  Min Sakong ,  Chae Up Yoo ,  Jin Woo Jung ,  Ho Saeng Kim ,  Byung Chan Jang

IPC: H01Q1/24 ,  H01Q5/378 ,  H01Q9/42

Abstract: An electronic device is provided. The electronic device includes a housing including a segment part used to insulate a portion of the housing and an antenna disposed at a position corresponding to the segment part.