公开(公告)号：US10699915B2

公开(公告)日：2020-06-30

申请号：US16234815

申请日：2018-12-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chanho Lee ,  Hyunsoo Chung ,  Hansung Ryu ,  Inyoung Lee

IPC: H01L21/50 ,  H01L23/48 ,  H01L23/00 ,  H01L23/58 ,  H01L23/373 ,  H01L21/48 ,  H01L21/02 ,  H01L23/544 ,  H01L25/065 ,  H01L21/768 ,  H01L23/31

Abstract: A semiconductor device including a substrate, an insulating layer on the substrate and including a trench, at least one via structure penetrating the substrate and protruding above a bottom surface of the trench, and a conductive structure surrounding the at least one via structure in the trench may be provided.

公开(公告)号：US09640575B2

公开(公告)日：2017-05-02

申请号：US15090158

申请日：2016-04-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hansung Ryu ,  Seungkon Mok

IPC: H01L27/146 ,  H01L31/0203

CPC classification number: H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes a substrate, an image sensor chip mounted on the substrate, a holder disposed on the substrate and surrounding the image sensor chip, and the holder has an inner surface facing the image sensor chip and an outer surface opposite to the inner surface. The semiconductor package further includes a transparent cover combined with the holder, and the transparent cover is spaced apart from and faces the substrate. The holder includes: a hole penetrating the holder from the inner surface to the outer surface. In addition, the semiconductor package further includes a first stopper disposed in the hole and a second stopper disposed at a position corresponding to the hole on the outer surface of the holder.