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11.发明公开公开(公告)号：US20240292571A1
公开(公告)日：2024-08-29
申请号：US18658464
申请日：2024-05-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bongkyu MIN , Taewoo KIM , Jinyong PARK , Hyelim YUN , Hyeongju LEE , Jiseon HAN
CPC classification number: H05K7/20454 , H05K1/18 , H05K2201/10037 , H05K2201/10151 , H05K2201/10159
Abstract: An electronic device is provided. The electronic device includes a base plate, a first component disposed on the base plate, a second component which is disposed on the base plate and provided at a position spaced apart from the first component, an interposer which is connected to the base plate and surrounds the first component and the second component, a cover plate including a cover plate body which is connected to the interposer and covers the first component and the second component, and a cover hole which is formed to penetrate the cover plate body, and a heat dissipation plate including a heat dissipation plate body which is disposed on the cover plate body and faces the first component and the second component, a heat dissipation hole which is formed to penetrate the heat dissipation plate body and communicates with the cover hole, and a flow guide which is formed on the heat dissipation plate body and guides the flow of a thermal interface material.
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12.发明公开公开(公告)号：US20240107726A1
公开(公告)日：2024-03-28
申请号：US18514331
申请日：2023-11-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyelim YUN , Bongkyu MIN , Dohoon KIM , Taewoo KIM , Jinyong PARK , Jungje BANG , Hyeongju LEE
CPC classification number: H05K9/0032 , H05K1/115 , H05K1/144 , H05K1/181 , H05K7/1427 , H05K2201/10371 , H05K2201/10378
Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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13.发明申请公开(公告)号：US20200337188A1
公开(公告)日：2020-10-22
申请号：US16921801
申请日：2020-07-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyelim YUN , Bongkyu MIN , Dohoon KIM , Taewoo KIM , Jinyong PARK , Jungje BANG , Hyeongju LEE
Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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