公开(公告)号：US09723250B2

公开(公告)日：2017-08-01

申请号：US14147893

申请日：2014-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hang-Kyu Park ,  Seung-Kyung Lim ,  Dae-Sung Kim ,  So-Ra Kim ,  Hyun-Kyoung Kim

IPC: H04N5/76 ,  H04N5/232

CPC classification number: H04N5/76 ,  H04N5/23206 ,  H04N5/23216 ,  H04N5/23219 ,  H04N5/23222 ,  H04N5/23293

Abstract: A method and an apparatus for recording image data in an electronic device are provided. The method includes storing image data of different directions obtained via a plurality of cameras. In the method for storing image data in an electronic device, first image data and second image data are obtained. A state of an object of the second image data is determined while the first image data is stored. When the state of the object of the second image data meets a certain condition, the second image data is stored together with the first image data.

公开(公告)号：US09641761B2

公开(公告)日：2017-05-02

申请号：US14330864

申请日：2014-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Kyoung Kim ,  Dae-Sung Kim ,  So-Ra Kim ,  Hang-Kyu Park ,  Seung-Kyung Lim

IPC: H04N5/232 ,  G11B27/00 ,  H04N5/77 ,  H04N1/00

CPC classification number: G06F3/0482 ,  G06F3/04886 ,  G06K9/00288 ,  G11B27/00 ,  G11B27/105 ,  G11B27/32 ,  G11B27/34 ,  H04N1/00161 ,  H04N5/23216 ,  H04N5/23293 ,  H04N5/772

Abstract: A method and device for playing contents in an electronic device are provided. The method includes selecting a setting condition value for playing at least one contents, where the at least one contents includes at least one tag information corresponding to the setting condition value, determining the at least one contents satisfying the setting condition value, and playing the at least one contents in a predefined order.

公开(公告)号：US08659163B2

公开(公告)日：2014-02-25

申请号：US13621314

申请日：2012-09-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki-Tae Park ,  Kang-Wook Lee ,  Hyun-Kyoung Kim

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/5384 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/05 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: A semiconductor device includes a substrate, and a through electrode passing through the substrate. The semiconductor device has a pad region and a through electrode region. A pad covers the pad region, extends into the through electrode region, and delimits an opening in the through electrode region. A through electrode extends through the semiconductor substrate below the hole in the pad in the through region.

Abstract translation: 半导体器件包括衬底和穿过衬底的通孔。 半导体器件具有焊盘区域和贯通电极区域。 焊盘覆盖焊盘区域，延伸到通孔电极区域中，并限定通孔电极区域中的开口。 穿通电极通过穿通区域中的垫中的孔下方的半导体衬底延伸。