公开(公告)号：US10426067B2

公开(公告)日：2019-09-24

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.