公开(公告)号：US20220165652A1

公开(公告)日：2022-05-26

申请号：US17391164

申请日：2021-08-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Uk HAN ,  Duck Gyu KIM ,  Min Ki KIM ,  Jae-Min JUNG ,  Jeong-Kyu HA

IPC: H01L23/498 ,  H01L23/58

Abstract: A semiconductor device includes: a substrate including a semiconductor chip region, a guard ring region adjacent to the semiconductor chip region, and an edge region adjacent to the guard ring region; a first interlayer insulating layer disposed on the substrate; a wiring structure disposed inside the first interlayer insulating layer and in the guard ring region, wherein the wiring structure includes a first wiring layer and a second wiring layer disposed above the first wiring layer; and a trench configured to expose at least a part of the first interlayer insulating, layer in the edge region, wherein the trench includes a first bottom surface and a second bottom surface formed at a level different from that of the first bottom surface, wherein the first bottom surface is formed between the wiring structure and the second bottom surface, and the second bottom surface is formed adjacent to the first bottom surface.

公开(公告)号：US20170372992A1

公开(公告)日：2017-12-28

申请号：US15465146

申请日：2017-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yechung CHUNG ,  Woonbae KIM ,  Soyoung LIM ,  Jeong-Kyu HA

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/09 ,  H01L2224/0912

Abstract: In an embodiment, the film product includes a film substrate having a first surface and a second surface opposite the first surface. The film substrate has a length in a first direction and a width in a second direction perpendicular to the first direction. A first plurality of pads is on one of the first surface and the second surface, and the first plurality of pads is arranged in a third direction, the third direction being diagonal with respect to at least one of the first direction and the second direction. At least one merge line is electrically connecting at least two of the first plurality of pads.

公开(公告)号：US20170235997A1

公开(公告)日：2017-08-17

申请号：US15395623

申请日：2016-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inho CHOI ,  Youngdoo JUNG ,  Woonbae KIM ,  Jungwoo KIM ,  Ji-Yong PARK ,  Kyoungsuk YANG ,  Jeong-Kyu HA

IPC: G06K9/00

CPC classification number: G06K9/00087 ,  G06K9/00013

Abstract: A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.

公开(公告)号：US20140367659A1

公开(公告)日：2014-12-18

申请号：US14279170

申请日：2014-05-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KyongSoon CHO ,  Jae-Min JUNG ,  Jeong-Kyu HA

IPC: H01L27/32

CPC classification number: H01L27/3276

Abstract: A display device includes a substantially planar semiconductor package. The semiconductor package drives unit display elements of the display device. The semiconductor package is not folded and has a flat structure. Thus, the occurrence of defects and/or errors in the display device may be reduced as compared to display devices including folded non-planar semiconductor packages. As a result, reliability of the display device may be improved.

Abstract translation: 显示装置包括基本上平面的半导体封装。 半导体封装驱动显示装置的单元显示元件。 半导体封装不折叠并且具有平坦的结构。 因此，与包括折叠的非平面半导体封装的显示装置相比，可以减少显示装置中的缺陷和/或误差的发生。 结果，可以提高显示装置的可靠性。

公开(公告)号：US20130293816A1

公开(公告)日：2013-11-07

申请号：US13769520

申请日：2013-02-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Min JUNG ,  Sang-Uk HAN ,  KwanJai LEE ,  KyongSoon CHO ,  Jeong-Kyu HA

IPC: H01L23/498 ,  H01L51/52

CPC classification number: H01L25/167 ,  H01L23/49827 ,  H01L23/4985 ,  H01L27/323 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/52 ,  H01L51/524 ,  H01L2251/5338 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.

Abstract translation: 可以提供包括其的片上胶片包装和装置组件。 该装置组件包括：薄膜封装，其包括半导体芯片，连接到薄膜封装的一端的面板基板，设置在面板基板上的显示面板，以及连接到薄膜封装的另一端的控制部件。 薄膜封装包括薄膜基板，设置在薄膜基板的顶表面上的第一布线和设置在薄膜基板的底表面上的第二布线。