公开(公告)号：US20220165652A1

公开(公告)日：2022-05-26

申请号：US17391164

申请日：2021-08-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Uk HAN ,  Duck Gyu KIM ,  Min Ki KIM ,  Jae-Min JUNG ,  Jeong-Kyu HA

IPC: H01L23/498 ,  H01L23/58

Abstract: A semiconductor device includes: a substrate including a semiconductor chip region, a guard ring region adjacent to the semiconductor chip region, and an edge region adjacent to the guard ring region; a first interlayer insulating layer disposed on the substrate; a wiring structure disposed inside the first interlayer insulating layer and in the guard ring region, wherein the wiring structure includes a first wiring layer and a second wiring layer disposed above the first wiring layer; and a trench configured to expose at least a part of the first interlayer insulating, layer in the edge region, wherein the trench includes a first bottom surface and a second bottom surface formed at a level different from that of the first bottom surface, wherein the first bottom surface is formed between the wiring structure and the second bottom surface, and the second bottom surface is formed adjacent to the first bottom surface.

公开(公告)号：US20150357250A1

公开(公告)日：2015-12-10

申请号：US14606954

申请日：2015-01-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Ki KIM ,  Jung Jin KIM ,  Yong Min KWON

IPC: H01L21/66 ,  H01L33/00

CPC classification number: H01L33/005 ,  G01J2001/4252 ,  G01J2003/466 ,  G01R31/2635 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0041

Abstract: A method of manufacturing a light emitting device package includes forming a plurality of light emitting devices by growing a plurality of semiconductor layers on a wafer, and measuring color characteristics of light emitted from each of the plurality of light emitting devices. For each of the plurality of light emitting devices, a type and an amount of wavelength conversion material is determined for color compensating the light emitting device based on a difference between the measured color characteristics and target color characteristics. A wavelength conversion layer is formed on at least two light emitting devices among the plurality of light emitting devices, the wavelength conversion layer having the type and the amount of wavelength conversion material determined for the at least two light emitting devices. The plurality of light emitting devices is then divided into individual light emitting device packages.

Abstract translation: 制造发光器件封装的方法包括通过在晶片上生长多个半导体层来形成多个发光器件，并测量从多个发光器件中的每一个发射的光的颜色特性。 对于多个发光器件中的每一个，基于测量的颜色特性和目标颜色特性之间的差异，确定波长转换材料的类型和量用于对发光器件进行颜色补偿。 波长转换层形成在多个发光器件中的至少两个发光器件上，波长转换层具有为至少两个发光器件确定的类型和波长转换材料的量。 然后将多个发光器件分成单独的发光器件封装。