公开(公告)号：US20230283191A1

公开(公告)日：2023-09-07

申请号：US18196596

申请日：2023-05-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonghyun SHIN ,  Youngjae PARK ,  Junghoon LEE ,  Teaho LEE

IPC: H02M7/00 ,  H02M1/00 ,  H02M1/32 ,  H02M5/458 ,  H05K7/20

CPC classification number: H02M7/003 ,  H02M1/0009 ,  H02M1/327 ,  H02M5/458 ,  H05K7/209

Abstract: An electronic device in accordance with one embodiment may include a load that receives power and performs an operation; and a power supply that supplies power to the load, the power supply including: a rectifier configured to rectify an input alternating current (AC) voltage; a converter including at least one first switching element and configured to convert the rectified input AC voltage into a direct current (DC) voltage; an inverter including a plurality of second switching elements and configured to convert the DC voltage into an AC voltage; a plurality of temperature sensors configured to detect the temperature of each of a plurality of switching elements including the at least one first switching element and the plurality of second switching elements; and a processor configured to determine whether a temperature failure occurs in the plurality of switching elements based on a temperature difference between the plurality of switching elements or a temperature variation amount of each of the plurality of switching elements and performs temperature protection control on the plurality of switching elements based on determining that the temperature failure occurs.

公开(公告)号：US20230188980A1

公开(公告)日：2023-06-15

申请号：US18105394

申请日：2023-02-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Lyesuk LEE ,  Junghoon LEE ,  Hyosung JUNG ,  Gajin SONG

IPC: H04W12/0431 ,  H04W4/80

CPC classification number: H04W12/0431 ,  H04W4/80

Abstract: Disclosed are a method for providing an electronic device positioning service and an apparatus supporting same. The electronic device may comprise: a first wireless communication circuit, a second wireless communication circuit, and at least one processor. The at least one processor may: when receiving an advertising packet from an external device, determine a first server corresponding to country information included in the advertising packet among a plurality of accessible servers; and acquire a public key corresponding to the external device from the first server to encrypt position information of the electronic device and transmit the encrypted position information to the first server.

公开(公告)号：US20230117510A1

公开(公告)日：2023-04-20

申请号：US17768063

申请日：2020-06-25

Applicant: Junghoon LEE ,  Samsung Electronics Co., Ltd.

Inventor： Raehong CHO ,  Jaesung LEE ,  Junghoon LEE ,  Geunwoo PARK ,  Jeongmin PARK

IPC: C09D161/02 ,  H05K3/28 ,  C09D123/08 ,  C09D7/20

Abstract: The present disclosure provides a protective coating composition for circuit boards, the composition capable of i) forming a protective coating for effectively protecting a circuit board and an electrical/electronic component mounted thereon, from moisture, foreign materials, and corrosive gas, ii) reducing the formation time of a protective coating, iii) forming a protective coating capable of achieving optimal protective performance with a smaller thickness, and iv) forming a protective coating that is easier to remove. According to one aspect of the present disclosure, an embodiment of the protective coating composition for circuit boards includes a polyketone, and a solvent.

公开(公告)号：US20230117153A1

公开(公告)日：2023-04-20

申请号：US17965197

申请日：2022-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon LEE ,  Kunmo CHU

IPC: B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  B23K35/368

Abstract: Provided is a metal particle for adhesive paste. The metal particle may include a core including at least one metal; and a shell on at least one surface of the core and including at least one metal and nanoparticles. The metal particle may be a transient liquid phase particle and the at least one metal of the core may have a higher melting point than a melting point of the at least one metal of the shell. In addition, provided are a method of preparing the metal particle for adhesive paste, a composite bonding structure formed from the metal particle for adhesive paste, and a semiconductor device including the composite bonding structure.

公开(公告)号：US20220077100A1

公开(公告)日：2022-03-10

申请号：US17467973

申请日：2021-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kunmo CHU ,  Junghoon LEE ,  Byonggwon SONG

IPC: H01L23/00

Abstract: A hybrid bonding structure and a semiconductor including the hybrid bonding structure are provided. The hybrid bonding structure includes a solder ball and a solder paste bonded to the solder ball. The solder paste may include solder particles including at least one of In, Zn, SnBiAg alloy, or SnBi alloy, and ceramic particles. The solder paste may include a flux. The solder particles may include Sn(42.0 wt %)-Ag(0.4 wt %)-Bi(57.5−X) wt %, and the ceramic particles include CeO2(X) wt %, where 0.05≤X≤0.1.

公开(公告)号：US20210013825A1

公开(公告)日：2021-01-14

申请号：US16922419

申请日：2020-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeho LEE ,  Junghyun LEE ,  Junghoon LEE ,  Yoonsup KIM ,  Youngjae PARK ,  Jieun BAN ,  Jong-Hyun SHIN

IPC: H02P27/08 ,  H02M5/458 ,  F04D13/06

Abstract: A compressor control apparatus includes a rectifier configured to rectify AC power to DC power; an inverter including a plurality of switching elements, configured to convert the DC power into a three-phase voltage according to a pulse width modulation (PWM) signal applied to the plurality of switching elements; a motor configured to receive a three-phase current based on the three-phase voltage; a current detector configured to detect a sum of a first phase current, a second phase current, and a third phase current supplied to the motor; and a controller configured to differently determine a duty ratio of the PWM signal applied to each of the plurality of switching elements, and to determine the first phase current, the second phase current, and the third phase current, respectively, based on the determined duty ratio and the sum of the currents detected from the current detector.