公开(公告)号：US20130330035A1

公开(公告)日：2013-12-12

申请号：US13787918

申请日：2013-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-Jae Shin ,  Hyun-il Byun ,  Kwang-hyun Lee ,  Kwan-sik Cho ,  Ho-chul Ji ,  Jung-hyung Pyo ,  Kyoung-ho Ha

IPC: G02B6/12

CPC classification number: G02B6/12 ,  G02B6/4207 ,  G02B6/4214 ,  G02B6/428 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311

Abstract: A semiconductor package and a semiconductor device including the same. The semiconductor package includes: a package substrate; a plurality of connection elements that are disposed on the package substrate; and a semiconductor chip that includes at least one optical input/output element that transmits/receives an optical signal to/from the outside at an optical input/output angle with respect to a direction perpendicular to a bottom surface of the package substrate, and is electrically connected to the package substrate through the plurality of connection

Abstract translation: 一种半导体封装和包括该半导体封装的半导体器件。 半导体封装包括：封装衬底; 多个连接元件，其设置在所述封装基板上; 以及半导体芯片，其包括至少一个光输入/输出元件，所述至少一个光输入/输出元件相对于垂直于所述封装基板的底面的方向以光输入/输出角度向/从外部发送/接收光信号，并且是 通过多个连接电连接到封装衬底