INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

    公开(公告)号:US20210407890A1

    公开(公告)日:2021-12-30

    申请号:US17162418

    申请日:2021-01-29

    Abstract: An integrated circuit device includes a semiconductor substrate, first through-silicon-via (TSV) structures penetrating a first region of the semiconductor substrate and spaced apart from each other by a first pitch, a first individual device between the first TSV structures and spaced apart from the first TSV structures by a distance that is greater than a first keep-off distance, and second TSV structures penetrating a second region of the semiconductor substrate and spaced apart from each other by a second pitch that is less than the first pitch. The second region of the semiconductor device does not include an individual device that is homogeneous with the first individual device and between the second TSV structures.

    METHOD AND APPARATUS FOR PERFORMING POWER HEADROOM REPORT IN WIRELESS COMMUNICATION SYSTEM

    公开(公告)号:US20210037481A1

    公开(公告)日:2021-02-04

    申请号:US16934462

    申请日:2020-07-21

    Abstract: A communication method and a system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The disclosure discloses a method for a terminal to generate all entry information of multiple power headroom reports (PHRs) as virtual PHs regardless of whether the terminal transmits an uplink to a serving cell in a wireless communication system supporting uplink carrier aggregation.

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