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公开(公告)号：US20220285188A1
公开(公告)日：2022-09-08
申请号：US17506154
申请日：2021-10-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunjoon KIM , Seogwoo Hong , Kyungwook Hwang , Junsik Hwang , Dongho Kim , Joonyong Park
IPC: H01L21/673 , H01L33/20 , H01L33/62 , B65G47/90
Abstract: Provided is a display transfer structure including a substrate including a plurality of wells, and a plurality of light emitting elements disposed in the plurality of wells, wherein the plurality of light emitting elements have a rotationally asymmetric planar shape, and wherein the plurality of wells respectively have a planar shape different from a planar shape of each of the plurality of light emitting elements.
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公开(公告)号：US20220246584A1
公开(公告)日：2022-08-04
申请号：US17506135
申请日：2021-10-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junsik HWANG , Seogwoo Hong , Kyungwook Hwang , Hyunjoon Kim , Joonyong Park
IPC: H01L25/075 , H01L33/00 , H01L21/68 , G09G3/32 , H01L21/683
Abstract: A display transferring structure includes a transferring substrate including a mold including a plurality of recesses, and a plurality of protrusions provided on an outer surface of the mold connected to the plurality of recesses; and micro semiconductor chips arranged in the recesses. When the micro semiconductor chips are wet aligned, by such protrusions, sliding of the micro semiconductor chips toward the inside of the recesses may be improved.
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公开(公告)号：US11301663B2
公开(公告)日：2022-04-12
申请号：US16905240
申请日：2020-06-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jinmyoung Kim , Seogwoo Hong , Seokwhan Chung , Byungkyu Lee
Abstract: A fingerprint sensor and a method of manufacturing the same are provided. The fingerprint sensor includes an active region including driving electrodes and sensing electrodes crossing the driving electrodes, tracer regions connected respectively to the driving electrodes and the sensing electrodes, and shield layers disposed respectively on the tracer regions.
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14.发明申请公开(公告)号：US20210240302A1
公开(公告)日：2021-08-05
申请号：US16984685
申请日：2020-08-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hongsuk KIM , Dongkyun Kim , Seogwoo Hong , Jinmyoung Kim , Jinhee Nam
Abstract: A touch sensor may include: a touch panel including a plurality of electrodes and a plurality of electrode pads respectively connected to the plurality of electrodes; a bonding layer disposed on and in contact with the plurality of electrode pads; and a printed circuit board including: an insulating layer including a first surface adjacent to the bonding layer and a second surface facing the first surface; a plurality of first bonding pads provided in a first region of the first surface of the insulating layer; a plurality of second bonding pads disposed on the second surface of the insulating layer; and a plurality of extension pads disposed on a second region different from the first region of the first surface of the insulating layer and respectively connected to the plurality of second bonding pads.
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公开(公告)号：US10976875B2
公开(公告)日：2021-04-13
申请号：US16902941
申请日：2020-06-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seogwoo Hong , Jinmyoung Kim
Abstract: Provided are a transparent fingerprint recognition sensor and a touch screen device including the transparent fingerprint recognition sensor. The transparent fingerprint recognition sensor includes: a substrate; a plurality of first electrodes disposed on the substrate in a sensing area; an insulating layer disposed on the substrate and covering the plurality of first electrodes; a plurality of second electrodes disposed within the insulating layer in the sensing area; a plurality of first signal lines disposed within the insulating layer in the bezel area; and a plurality of second signal lines disposed on a top surface of the insulating layer, in the bezel area.
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Patent Agency Ranking
公开(公告)号：US10719178B2
公开(公告)日：2020-07-21
申请号：US15971030
申请日：2018-05-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seogwoo Hong , Jinmyoung Kim
Abstract: Provided are a transparent fingerprint recognition sensor and a touch screen device including the transparent fingerprint recognition sensor. The transparent fingerprint recognition sensor includes: a substrate; a plurality of first electrodes disposed on the substrate in a sensing area; an insulating layer disposed on the substrate and covering the plurality of first electrodes; a plurality of second electrodes disposed within the insulating layer in the sensing area; a plurality of first signal lines disposed within the insulating layer in the bezel area; and a plurality of second signal lines disposed on a top surface of the insulating layer, in the bezel area.
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公开(公告)号：US12183719B2
公开(公告)日：2024-12-31
申请号：US17483103
申请日：2021-09-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junsik Hwang , Seogwoo Hong , Kyungwook Hwang
IPC: H01L25/075 , H01L33/00 , H01L33/20 , H01L33/50 , H01L33/62
Abstract: A display transferring structure includes a transfer substrate including a plurality of recesses, each of the plurality of recesses including a first trap having a space in which a predetermined object can be moved and a second trap connected to the first trap and having a shape and size in which the object can be seated; and a micro-semiconductor chip positioned in the second trap. The micro-semiconductor chip may be self-aligned in a correct position by the display transferring structure.
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公开(公告)号：US12148857B2
公开(公告)日：2024-11-19
申请号：US17477875
申请日：2021-09-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Joonyong Park , Seogwoo Hong , Kyungwook Hwang , Hyunjoon Kim , Junsik Hwang
Abstract: Provided is a method of manufacturing a display, the method including a first operation of transferring a plurality of micro light emitting diodes (LEDs) to a plurality of wells of an interposer through a fluidic self assembly (FSA) process, a second operation of aligning a driving substrate on the interposer, a third operation of injecting a penetrating solvent between the interposer and the driving substrate, such that the penetrating solvent penetrates between the plurality of micro LEDs and the plurality of wells, and a fourth operation of transferring the plurality of micro LEDs to the driving substrate by radiating light to the interposer to vaporize the penetrating solvent.
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公开(公告)号：US12148739B2
公开(公告)日：2024-11-19
申请号：US18234798
申请日：2023-08-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seogwoo Hong , Junsik Hwang , Kyungwook Hwang
IPC: H01L25/075 , H01L27/12 , H01L33/50 , H01L33/62
Abstract: The present disclosure provides a micro-light-emitting diode display apparatus and a method of manufacturing the same. Provided is a micro-light-emitting diode (LED) display apparatus including a plurality of pixels, the micro-LED display apparatus including a driving circuit substrate, a first electrode provided on the driving circuit substrate, one or more microlight-emitting diodes (LEDs) provided on the first electrode, an insulating layer provided on the one or more micro-LEDs, a via pattern provided in the insulating layer, electrical contacts provided in the via pattern, and a second electrode provided on the electrical contacts, wherein the via pattern exposes a portion of the one or more micro-LEDs.
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公开(公告)号：US20240321680A1
公开(公告)日：2024-09-26
申请号：US18514514
申请日：2023-11-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungchan KANG , Daehyuk Son , Seogwoo Hong
IPC: H01L23/427 , H01L25/065
CPC classification number: H01L23/427 , H01L25/0652 , H01L2225/06589
Abstract: A semiconductor device includes: a semiconductor chip; a cooling channel configured to allow a coolant to (i) flow in liquid phase and (ii) absorb heat generated by the semiconductor chip during operation; and a wick structure configured to generate a capillary force for moving the coolant in the liquid phase along a wall surface of the cooling channel. The wick structure includes a suspended wick structure that is disposed apart from the wall surface by a capillary distance.
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