公开(公告)号：US20160062132A1

公开(公告)日：2016-03-03

申请号：US14838507

申请日：2015-08-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonyong Park ,  Dongouk Kim ,  Jihyun Bae ,  Bongsu Shin ,  Jong G. Ok ,  Ilsun Yoon ,  Sunghoon Lee ,  Jaeseung Chung ,  Sukgyu Hahm

IPC: G02B27/62 ,  G02F1/1335 ,  G02B5/30 ,  B29C65/48 ,  B29C65/00

CPC classification number: G02B27/62 ,  G02B5/3058 ,  G02F1/13336 ,  G02F2001/133548

Abstract: A master wafer includes: a plurality of unit wafers each including a pattern disposed thereon; a coupling surface defined on each of the unit wafers; and a coupling part which couples adjacent unit wafers among the plurality of unit wafers on which the coupling surface is defined, to each other.

Abstract translation: 主晶片包括：多个单元晶片，每个单元晶片包括设置在其上的图案; 限定在每个单元晶片上的耦合表面; 以及耦合部件，其将限定有耦合表面的多个单元晶片中的相邻单元晶片彼此连接。

公开(公告)号：US20160023399A1

公开(公告)日：2016-01-28

申请号：US14724898

申请日：2015-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghoon Lee ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Jaeseung Chung ,  Sukgyu Hahm ,  Jong G. Ok ,  Ilsun Yoon

IPC: B29C59/16

CPC classification number: B29C59/16 ,  B29C59/165 ,  B29C67/00 ,  B29C2045/0075 ,  G03F7/0002

Abstract: A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.

Abstract translation: 通过使用压印工艺形成图案的方法包括：仅在基板上的图案形成区域中形成粘附促进层; 涂覆树脂以覆盖基材和粘合促进层; 通过将印模模压到树脂上，将印模的图案转印到覆盖基材和粘合促进层的树脂上; 在覆盖基材和粘合促进层的树脂上照射紫外光，固化树脂并在基材上形成对应于印模的图案的固化树脂的图案; 并将印模从基板上分离出来，将一部分固化的树脂图案仅留在基板上的粘合促进层上，并从基板上除去固化的树脂图案的剩余部分。

公开(公告)号：US09855703B2

公开(公告)日：2018-01-02

申请号：US14724898

申请日：2015-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghoon Lee ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Jaeseung Chung ,  Sukgyu Hahm ,  Jong G. Ok ,  Ilsun Yoon

IPC: B29C59/16 ,  B29C67/00 ,  G03F7/00 ,  B29C45/00

CPC classification number: B29C59/16 ,  B29C59/165 ,  B29C67/00 ,  B29C2045/0075 ,  G03F7/0002

Abstract: A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.

公开(公告)号：US09658484B2

公开(公告)日：2017-05-23

申请号：US14817496

申请日：2015-08-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghoon Lee ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Jong G. Ok ,  Ilsun Yoon ,  Jaeseung Chung ,  Sukgyu Hahm

IPC: G02F1/1335 ,  G02B5/30 ,  G03F7/00 ,  G02F1/1333

CPC classification number: G02F1/133528 ,  G02B5/3058 ,  G02F1/13336 ,  G02F2001/133548 ,  G03F7/0002

Abstract: A pattern structure includes a plurality of pattern structure units arranged on a same plane, where each of the plurality of pattern structure units includes a plurality of microstructures defined on a surface thereof and having a width of less than about 1 micrometer (μm); and a connection layer disposed between the plurality of pattern structure units and having a width of less than about 10 μm, where the connection layer connects the plurality of pattern structure units to each other.

公开(公告)号：US09434093B2

公开(公告)日：2016-09-06

申请号：US14557712

申请日：2014-12-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sukgyu Hahm ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Sunghoon Lee ,  Hongseok Lee ,  Jaeseung Chung

IPC: B29C33/38 ,  G03F7/00 ,  B29K101/10 ,  B29L31/00 ,  B29C33/42

CPC classification number: B29C33/3878 ,  B29C33/424 ,  B29C2033/426 ,  B29K2101/10 ,  B29L2031/757 ,  G03F7/00 ,  G03F7/0002

Abstract: A method of manufacturing a master mold includes forming a plurality of replica resin layers using a mold; forming a replica template by bonding the plurality of replica resin layers on a template; forming a replica mold layer having a pattern corresponding to a pattern of the plurality of replica resin layers using the replica template; forming a flexible stamp having a pattern formed on a surface thereof using the replica mold layer; transferring the pattern formed on the surface of the flexible stamp to a mold resin; and forming a large area master mold by etching a surface of a substrate based on a pattern shape of the mold resin.

Abstract translation: 制造母模的方法包括使用模具形成多个复制树脂层; 通过将多个复制树脂层粘合在模板上来形成复制模板; 使用复制模板形成具有与多个复制树脂层的图案对应的图案的复制模具层; 使用复制模具层形成具有在其表面上形成的图案的柔性印模; 将形成在柔性印模的表面上的图案转印到模制树脂上; 并且通过基于模制树脂的图案形状蚀刻基板的表面来形成大面积的母模。

公开(公告)号：US20150321415A1

公开(公告)日：2015-11-12

申请号：US14633272

申请日：2015-02-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghoon Lee ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Hongseok Lee ,  Jaeseung Chung ,  Sukgyu Hahm

IPC: B29C59/02 ,  G02B5/30 ,  G02B1/12

CPC classification number: B29C59/026 ,  B29K2025/06 ,  B29K2033/12 ,  G02B1/12 ,  G02B5/3058 ,  G02B5/3066 ,  G02B2207/101 ,  G03F7/0002 ,  Y10T428/2457

Abstract: A patterning method using an imprint mold, to form an imprinted pattern structure, includes providing a resist layer from which the pattern structure will be formed, performing a first imprint process on a first area of the resist layer by using the imprint mold to form a first pattern of the pattern structure through deformation of the resist layer in the first area, and performing a second imprint process on a second area of the resist layer by using the imprint mold to form a second pattern of the pattern structure through deformation of the resist layer in the second area. The first and second areas are overlapped with each other in a third area of the resist layer, and the performing the second imprint process deforms a first portion of the first pattern in the third area to form the second pattern

Abstract translation: 使用压印模具形成压印图案结构的图案化方法包括提供抗蚀剂层，从其形成图案结构，通过使用压印模具在抗蚀剂层的第一区域上进行第一压印处理，以形成 通过使第一区域中的抗蚀剂层变形而形成图案结构的第一图案，并且通过使用压印模具在抗蚀剂层的第二区域上进行第二压印处理，以通过抗蚀剂的变形形成图案结构的第二图案 在第二个区域。 第一和第二区域在抗蚀剂层的第三区域中彼此重叠，并且执行第二压印处理使第三区域中的第一图案的第一部分变形以形成第二图案

公开(公告)号：US20150314323A1

公开(公告)日：2015-11-05

申请号：US14557602

申请日：2014-12-02

Applicant: Samsung Display Co., Ltd. ,  Samsung Electronics Co., Ltd.

Inventor： Joonyong Park ,  Dongouk Kim ,  Bongsu Shin ,  Daeyoung Lee ,  Sunghoon Lee ,  Jaeseung Chung ,  Gugrae Jo ,  Sukgyu Hahm

IPC: B05D3/00 ,  B05C5/02

CPC classification number: G03F7/00 ,  B05C5/02 ,  B05D1/42 ,  B05D3/007 ,  B05D3/067 ,  B82Y40/00 ,  G03F7/0002

Abstract: An imprinting apparatus includes: a coating unit which coats a substrate with ink including a photocurable resin in a diluent; a pressing unit which presses the ink with an imprint stamp including an uneven pattern; and a light source which irradiates light to the ink, which is in a pressed state, and cures the photocurable resin. The coating unit, the pressing unit and the light source move relative to the substrate in a processing direction. The coating unit is located ahead of the pressing unit in the processing direction.

Abstract translation: 一种压印设备包括：涂覆单元，其在包含稀释剂中的可光固化树脂的油墨上涂布基材; 压印单元，其用包含不均匀图案的印记印模来压印墨; 以及向处于压制状态的墨照射光的光源，并且固化光固化性树脂。 涂布单元，按压单元和光源在处理方向上相对于基板移动。 涂装单元位于按压单元的加工方向前方。