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公开(公告)号:US11302396B2
公开(公告)日:2022-04-12
申请号:US16862167
申请日:2020-04-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Taehong Kwon , Youngsun Min , Daeseok Byeon , Kyunghwa Yun
Abstract: A memory device includes a memory cell array, a row decoder connected to the memory cell array by a plurality of string selection lines, a plurality of word lines, and a plurality of ground selection lines, and a common source line driver connected to the memory cell array by a common source line. The memory cell array is located in an upper chip, at least a portion of the row decoder is located in a lower chip, at least a portion of the common source line driver is located in the upper chip, and a plurality of upper bonding pads of the upper chip are connected to a plurality of lower bonding pads of the lower chip to connect the upper chip to the lower chip.
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12.
公开(公告)号:US11237955B2
公开(公告)日:2022-02-01
申请号:US17007501
申请日:2020-08-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Taehyo Kim , Daeseok Byeon , Taehong Kwon , Chanho Kim , Taeyun Lee
IPC: G11C16/34 , G06F12/02 , G06F12/123 , G06F12/0811 , G11C11/4091 , G11C11/408 , G11C11/4074 , G06F12/14
Abstract: A memory device comprises a memory cell region including a first metal pad, and a peripheral circuit region including a second metal pad and vertically connected to the memory cell region by the first metal pad and the second metal pad, wherein the memory cell region includes a first memory area having first memory cells storing N-bit data and a second memory area having second memory cells storing M-bit data, where ‘M’ and ‘N’ are natural numbers and M is greater than N, and the peripheral circuit region includes a controller configured to read data stored in the first memory area using a first read operation, read data stored in the second memory area using a second read operation different from the first read operation, and selectively store data in one of the first memory area and the second memory area based on a frequency of use (FOU) of the data.
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