METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
    12.
    发明申请
    METHOD FOR FABRICATING SEMICONDUCTOR DEVICE 失效
    制造半导体器件的方法

    公开(公告)号:US20100219473A1

    公开(公告)日:2010-09-02

    申请号:US12495578

    申请日:2009-06-30

    Applicant: Sang Soo LEE

    Inventor: Sang Soo LEE

    CPC classification number: H01L27/1203 H01L21/743

    Abstract: Disclosed herein is a fabrication method of a semiconductor device to order to increase an operation liability of the semiconductor device. A method for fabricating a semiconductor device comprises forming a buried-type wordline in an active region defined on a SOI substrate, forming a silicon connection region for connecting an upper silicon layer to a lower silicon layer between neighboring buried type wordlines, and recovering the upper silicon layer on the silicon connection region.

    Abstract translation: 这里公开了半导体器件的制造方法,以增加半导体器件的操作负担。 一种制造半导体器件的方法,包括:在SOI衬底上形成的有源区中形成掩埋型字线,形成用于将上硅层连接到相邻掩埋型字线之间的下硅层的硅连接区域, 硅层上的硅连接区域。

    SHUTTLECOCK AUTOMATIC COLLECTING AND SUPPLYING APPARATUS

    公开(公告)号:US20170136337A1

    公开(公告)日:2017-05-18

    申请号:US15312964

    申请日:2014-09-04

    Applicant: Sang Soo LEE

    Inventor: Sang Soo LEE

    Abstract: An automatic shuttlecock collecting and supplying apparatus including: a shuttlecock storage hopper that has a exit hole at the end of the bottom and having the bottom inclined toward the exit hole; a launching tube unit that temporarily keeps one shuttlecock and includes at least two rotary launching tubes; a launching unit that launches shuttlecocks in the launching tubes forward by striking the shuttlecocks; a shuttlecock supply unit that is disposed behind the launching tubes and supplies shuttlecocks into an aligned launching tube; and a conveyer unit that connects the exit hole and the shuttlecock supply unit to convey the shuttlecocks in the shuttlecock storage unit to the shuttlecock supply unit.

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    14.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20120091554A1

    公开(公告)日:2012-04-19

    申请号:US12982600

    申请日:2010-12-30

    Applicant: Sang Soo LEE

    Inventor: Sang Soo LEE

    Abstract: A method for manufacturing a semiconductor device comprises: etching a semiconductor substrate to form a trench that defines an active region of a line type; burying an insulating film in the trench; and removing a portion of the active region of a line type to form a separated active region. The method improves the process for forming an active region using a Spacer patterning Technology (SPT), thereby preventing characteristic defects of the device and improving the operating characteristic.

    Abstract translation: 一种制造半导体器件的方法包括:蚀刻半导体衬底以形成限定线型有源区的沟槽; 在沟槽中埋设绝缘膜; 以及去除线型有源区域的一部分以形成分离的有源区。 该方法改进了使用间隔图案化技术(SPT)形成有源区的工艺,从而防止了器件的特征缺陷并提高了工作特性。

Patent Agency Ranking