公开(公告)号：US20130173059A1

公开(公告)日：2013-07-04

申请号：US13527160

申请日：2012-06-19

申请人： Seok Won Lee ,  Woo Sung Yang

发明人： Seok Won Lee ,  Woo Sung Yang

IPC分类号： G05B15/00

CPC分类号： B25J9/1633 ,  G05B2219/40305

摘要： A system for controlling driving of a wearable robot may include a drive unit for operating a drive joint of the robot, a measurement unit for measuring an actual angle and an actual angular velocity of the drive joint in the robot, a sensing unit for determining a human torque applied by a wearing user to the drive joint, and a control unit for determining a target angular velocity of the robot by applying the determined human torque to an admittance model and for determining a required torque that may be input to the drive unit of the robot by applying an optimal control gain to a difference between the target angular velocity and the actual angular velocity of the robot.

摘要翻译： 用于控制可穿戴机器人的驱动的系统可以包括用于操作机器人的驱动接头的驱动单元，用于测量机器人中的驱动接头的实际角度和实际角速度的测量单元，用于确定 佩戴用户对驱动关节施加的人力矩;以及控制单元，用于通过将确定的人力矩施加到导纳模型来确定机器人的目标角速度，并且用于确定可以输入到驱动单元的驱动单元的所需扭矩 机器人通过对目标角速度和机器人的实际角速度之间的差施加最佳控制增益。

公开(公告)号：US20110057297A1

公开(公告)日：2011-03-10

申请号：US12875382

申请日：2010-09-03

申请人： Jung-Do Lee ,  Jongkook Kim ,  Seok Won Lee ,  Jaesik Lee ,  Hohyeuk Im ,  Su-min Park

发明人： Jung-Do Lee ,  Jongkook Kim ,  Seok Won Lee ,  Jaesik Lee ,  Hohyeuk Im ,  Su-min Park

IPC分类号： H01L23/544

CPC分类号： H01L21/78 ,  H01L23/562 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating layer is disposed over the semiconductor substrate. A guard ring is disposed in the insulating layer in the scribe lane region. The guard ring surrounds at least a portion of the main chip region. The guard ring has a brittleness greater than a brittleness of the insulating layer.

摘要翻译： 提供了一种半导体芯片。 半导体芯片包括包括主芯片区域和围绕主芯片区域的划线通道区域的半导体衬底。 绝缘层设置在半导体衬底上。 保护环设置在划线区域的绝缘层中。 防护环围绕主芯片区域的至少一部分。 保护环的脆性大于绝缘层的脆性。

公开(公告)号：US5920052A

公开(公告)日：1999-07-06

申请号：US998659

申请日：1997-12-29

申请人： Seok Won Lee

发明人： Seok Won Lee

IPC分类号： H02B13/035 ,  H01H33/66

CPC分类号： H02B13/0352

摘要： A multi-circuit switch gear includes a main body filled with an insulation gas, main bushings mounted on a front portion of the main body, a plurality of three-phase input/output units connected to the main bushings, multi-position switching devices disposed inside the main body for switching between a turn-on state, a turn-off state, and an earthed stated, automatic contact devices disposed at a front surface portion of the main body, earth bushings mounted on the respective side portions of the input/output units, moldcone connection members coupled to the earth bushings, and earth terminals connected to the moldcone connection members. The multi-circuit switch gear allows a current discharge operation to occur in the insulation gas provided in the main body during the earthing operation, thereby increasing workers' safety and facilitating an insulation test via the connection members with regard to the underground insulation cable.

摘要翻译： 多回路开关装置包括填充有绝缘气体的主体，安装在主体前部的主衬套，与主衬套连接的多个三相输入/输出单元，多位置切换装置 在主体内部，用于在导通状态，关断状态和设置在主体的前表面部分处的接地的自动接触装置之间切换，安装在输入/输出端的各个侧部的接地套管， 输出单元，耦合到接地套管的模具连接构件，以及连接到模具连接构件的接地端子。 多路开关装置允许在接地操作期间在设置在主体中的绝缘气体中发生电流放电操作，从而增加工人的安全性并且通过连接构件对地下绝缘电缆进行绝缘测试。