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公开(公告)号：US20230137800A1
公开(公告)日：2023-05-04
申请号：US18090918
申请日：2022-12-29
Inventor： Xuhui PENG , Kerui XI , Tingting CUI , Feng QIN , Jie ZHANG
IPC: H01L21/48 , H01L21/56 , H01L23/498 , H01L23/00
Abstract: A semiconductor package includes a semiconductor element, a wiring structure, an encapsulation structure, and a solder ball. The semiconductor element includes a plurality of pins. A side of the wiring structure is electrically connected to the plurality of pins of the semiconductor element. The wiring structure includes at least two first wiring layers. A first insulating layer is disposed between adjacent two first wiring layers of the at least two first wiring layers. The first insulating layer includes a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The encapsulation structure at least partially surrounds the semiconductor element. The solder ball is located on a side of the wiring structure away from the semiconductor element. The solder ball is electrically connected to the at least two first wiring layers.
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公开(公告)号：US20220285852A1
公开(公告)日：2022-09-08
申请号：US17361356
申请日：2021-06-29
Inventor： Kerui XI , Xuhui PENG , Feng QIN , Tingting CUI , Baiquan LIN
Abstract: Provided are an antenna, a phase shifter, and a communication device. The antenna includes a first metal electrode, a second metal electrode, and a photo-sensitive layer. The first metal electrode and the second metal electrode are respectively located on two opposite sides of the photo-sensitive layer. The first metal electrode includes multiple transmission electrodes. The multiple transmission electrodes are configured to transmit electrical signals. The photo-sensitive layer includes at least one photo-sensitive unit and the at least one photo-sensitive unit overlaps the transmission electrodes. The antenna provides more possibilities for large-scale commercialization.
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公开(公告)号：US20220084973A1
公开(公告)日：2022-03-17
申请号：US17451621
申请日：2021-10-20
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
Inventor： Kerui XI , Feng QIN , Jine LIU , Xiaohe LI , Tingting CUI
Abstract: Chip package structure is provided. The chip package structure includes: a chip, the chip including metal pins; an organic polymer material layer, the organic polymer material layer being located on a side of the metal pins away from the chip, the organic polymer material layer including a first via hole, and the organic polymer material layer including a first surface away from the chip; metal parts, at least a portion of the metal parts being located in the first via hole, the metal parts and metal pins being electrically connected, the metal parts including a second surface away from the chip, and the second surface and the first surface being flush to each other; and an encapsulating layer, the encapsulating layer being located on a side of the metal parts away from the organic polymer material layer.
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公开(公告)号：US20220270555A1
公开(公告)日：2022-08-25
申请号：US17733534
申请日：2022-04-29
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
Inventor： Kerui XI , Xiaohe LI , Feng QIN , Jine LIU , Tingting CUI , Baiquan LIN
IPC: G09G3/34 , B01L3/00 , G01N27/22 , H01L27/12 , H03K17/687
Abstract: A panel and its drive method are provided. The panel includes: a substrate, an array layer and an electrode array layer, where the array layer is on a side of the substrate; the electrode array layer is on a side of the array layer away from the substrate; and the array layer includes an active layer, a gate metal layer and a source/drain metal layer; the substrate includes a plurality of drive units arranged in an array, a plurality of scan line groups and a plurality of data line groups; the scan line group includes first scan lines and second scan lines adjacent to the first scan lines, extending in a first direction; and the data line group includes first data lines and second data lines adjacent to the first data lines, extending in a second direction.
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公开(公告)号：US20210402879A1
公开(公告)日：2021-12-30
申请号：US17016776
申请日：2020-09-10
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
Abstract: Provided are a display panel and a vehicle. The display device includes a knob and a main display panel; the knob includes a first magnetic adhering piece; the display device further includes a second magnetic adhering structure, and the second magnetic adhering structure is disposed on a non-light exiting side of the main display panel; the second magnetic adhering structure includes a plurality of first magnetic adhering regions, and at least two first magnetic adhering regions are not overlapped; when the knob is magnetically adhered to any one of the plurality of first magnetic adhering regions, the knob is disposed on a light exiting side of the main display panel.
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Patent Agency Ranking
公开(公告)号：US20210351042A1
公开(公告)日：2021-11-11
申请号：US16913020
申请日：2020-06-26
Inventor： Xuhui PENG , Kerui XI , Tingting CUI , Feng QIN , Jie ZHANG
IPC: H01L21/48 , H01L23/498 , H01L23/00 , H01L21/56
Abstract: A semiconductor package and a method of forming the semiconductor package are provided. The method includes providing a first substrate, forming a wiring structure containing at least two first wiring layers, disposing a first insulating layer between adjacent two first wiring layers, and patterning the first insulating layer to form a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The method also includes providing at least one semiconductor element each including a plurality of pins. In addition, the method includes disposing the plurality of pins of the each semiconductor element on a side of the wiring structure away from the first substrate. Further, the method includes encapsulating the at least one semiconductor element, and placing a ball on a side of the wiring structure away from the at least one semiconductor element.
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17.发明申请公开(公告)号：US20210334494A1
公开(公告)日：2021-10-28
申请号：US16910840
申请日：2020-06-24
Inventor： Kerui XI , Tingting CUI , Feng QIN , Xuhui PENG , Linzhi WANG
Abstract: Fingerprint recognition circuit, fingerprint recognition structure, fingerprint recognition device, display panel, and display device are provided. The circuit includes: a fingerprint recognition driving transistor; a first capacitor; a driving signal input terminal; and a sensing signal output terminal. The first capacitor has a terminal electrically connected to a gate of the fingerprint recognition driving transistor and another terminal electrically connected to a ground. The driving signal input terminal is electrically connected to an input terminal of the fingerprint recognition driving transistor. An output terminal of the fingerprint recognition driving transistor is electrically connected to the sensing signal output terminal.
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公开(公告)号：US20210280525A1
公开(公告)日：2021-09-09
申请号：US17330236
申请日：2021-05-25
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
Inventor： Kerui XI , Feng QIN , Jine LIU , Xiaohe LI , Tingting CUI
IPC: H01L23/538 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/544 , H01L23/00
Abstract: Packaging method for forming the panel-level chip device is provided. The panel-level chip device includes a plurality of first bare chips disposed on a supporting base, and a plurality of first connection pillars. The panel-level chip device also includes a first encapsulation layer, and a first redistribution layer. The first redistribution layer includes a plurality of first redistribution elements and a plurality of second redistribution elements. Further, the panel-level chip device includes a solder ball group including a plurality of first solder balls. First connection pillars having a same electrical signal are electrically connected to each other by a first redistribution element. Each of remaining first connection pillars is electrically connected to one second redistribution element. The one second redistribution element is further electrically connected to a first solder ball of the plurality of first solder balls.
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公开(公告)号：US20200328159A1
公开(公告)日：2020-10-15
申请号：US16457290
申请日：2019-06-28
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
Inventor： Kerui XI , Feng QIN , Jine LIU , Xiaohe LI , Tingting CUI
IPC: H01L23/538 , H01L23/31 , H01L23/544 , H01L23/00 , H01L21/48 , H01L21/56
Abstract: A panel-level chip device and a packaging method for forming the panel-level chip device are provided. The panel-level chip device includes a plurality of first bare chips disposed on a supporting base, and a plurality of first connection pillars. The panel-level chip device also includes a first encapsulation layer, and a first redistribution layer. The first redistribution layer includes a plurality of first redistribution elements and a plurality of second redistribution elements. Further, the panel-level chip device includes a solder ball group including a plurality of first solder balls. First connection pillars having a same electrical signal are electrically connected to each other by a first redistribution element. Each of remaining first connection pillars is electrically connected to one second redistribution element. The one second redistribution element is further electrically connected to a first solder ball of the plurality of first solder balls.
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公开(公告)号：US20200316591A1
公开(公告)日：2020-10-08
申请号：US16457939
申请日：2019-06-29
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
Inventor： Kerui XI , Xiaohe LI , Feng QIN , Jine LIU , Tingting CUI , Baiquan LIN
IPC: B01L3/00 , H01L27/12 , H03K17/687 , G01N27/22 , G09G3/34
Abstract: A drive circuit and its drive method, and a panel and its drive method are provided. The drive circuit includes a step-up unit, a plurality of signal input terminals and a signal output terminal. The step-up unit includes a first module, a second module and a first capacitor. The first module is configured to transmit a signal of a third signal input terminal to a first electrode of the first capacitor. The second module is configured to transmit a signal of a fourth signal input terminal to a second electrode of the first capacitor at a first time period which generates a voltage difference between two electrodes of the first capacitor, and to transmit the signal of the fourth signal input terminal to the second electrode of the first capacitor at a second time period which further increases a signal of the first electrode of the first capacitor.
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