Abstract:
Methods for driving a plurality of MEMS devices in an apparatus are described. A voltage pulse is applied to an electrode or a structure portion of a MEMS device. The electrode is on the substrate underneath the structure portion. At least two MEMS devices of the plurality of MEMS devices have different threshold voltages, and the threshold voltage is the minimum voltage required to move the structure portion. A bias voltage is applied to whichever of the electrode or the structure portion of the MEMS device does not have the voltage pulse applied thereto. The bias voltage and the voltage pulse are capable of moving the structure portion of the MEMS device that has the higher threshold voltage of the different threshold voltages.
Abstract:
A spatial light modulator includes a mirror plate comprising a reflective upper surface, a lower surface having a conductive surface portion, and a substrate portion having a first cavity having an opening on the lower surface, a second cavity in the substrate portion, and a membrane over the second cavity. The modulator includes a substrate comprising an upper surface, a hinge support post in connection with the upper surface, a hinge component supported by the hinge support post and in connection with the mirror plate to facilitate a rotation of the mirror plate, and an upright landing tip in connection with the upper surface of the substrate. The hinge component is extends into the first cavity. The upright landing tip is configured to contact the membrane over the second cavity in the substrate portion of the mirror plate to stop the rotation of the mirror plate at a predetermined orientation.
Abstract:
A method for fabricating a micro structure includes disposing a sacrificial material in a recess formed in a lower layer and forming a layer of compensatory material on the sacrificial material in the recess. The compensatory material is higher than the upper surface of the lower layer. A first portion of the compensatory material is removed to form a substantially flat surface on the sacrificial material. The substantially flat surface is substantially co-planar with the upper surface of the lower layer. An upper layer is formed on the lower layer and the substantially flat surface.
Abstract:
A display system includes a transparent tapered plate comprising a first face, a second face, and a third face. The first face is substantially smaller than the second face and the third face. The display system also includes a row of tiltable mirror plates each comprising a reflective surface. Each of the mirror plates is configured to tilt to an “on” position to reflect incident light in an “on” direction or to tilt to an “off” position to reflect incident light in an “off” direction. An optical scanning system is configured to control the direction of the light reflected by the mirror plates in the “on” direction. The row of the tiltable mirror plates, optical scanning system and the tapered plate are configured to allow the light reflected by the row of mirror plates in the “on” direction to enter the tapered plate at the first face, be reflected by the second face, and produce a line of image pixels on the third face. The optical scanning system is configured to scan the line of image pixels across the third face to produce a display image.
Abstract:
A micro mirror device includes a hinge supported by a substrate and a mirror plate tiltable around the hinge. The hinge is configured to produce an elastic restoring force on the mirror plate when the mirror plate is tilted away from an un-tilted position. The micro mirror device also includes a controller that can produce an electrostatic force to overcome the elastic restoring force to tilt the mirror plate from the un-tilted position to an “on” position or an “off” position. The electrostatic force can counter the elastic restoring force to hold the mirror plate at the “on” position or the “off” position.
Abstract:
A semiconductor device includes a substrate comprising a first surface having a [111] orientation and a second surface having a second orientation and a plurality of III-V compound layers on the substrate, wherein the plurality of III-V compound layers are configured to emit light when an electric current is produced in one or more of the plurality of III-V compound layers.
Abstract:
A method of fabricating a micro structure includes depositing amorphous silicon over a substrate having an electric circuit at a temperature below 550° C. to form a first structure portion, wherein at least part of the first structure portion is configured to receive an electrical signal from the electric circuit.
Abstract:
A wafer containing a plurality of electro-optical devices, each device being enclosed in chamber that has a translucent cover. An X-Y matrix of pairs of interconnections on the wafer are connected to the circuitry of the electro-optical devices for addressing the electro-optical devices. The pairs of interconnections extend outside of the chambers enclosing the devices to testing areas on the periphery of the wafer. Testing is done by signals applied through the interconnections while simultaneously exposing the devices to light through the translucent covers.
Abstract:
An encapsulated device includes a micro device on a substrate, a cover bonded to the substrate thereby forming a chamber to encapsulate the micro device, and a desiccant material on the cover and in the chamber. An anti-stiction material is absorbed in the desiccant material.
Abstract:
Devices and methods for forming a spatial light modulator with high contrast are described. Light absorbing materials are used within a chamber that houses a spatial light modulator. The light absorbing materials absorb reflected light that is not intended for forming a part of a display image. The light absorbing material can form an aperture layer, wherein light to form the display image is transmitted through an opening in the aperture layer. An array of spatial light modulators can be within the housing and dummy spatial light modulators may be formed to enable easy alignment of the array with the opening in the aperture layer.