公开(公告)号：US07414848B2

公开(公告)日：2008-08-19

申请号：US11626188

申请日：2007-01-23

申请人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

发明人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  F28D15/00

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28F1/12 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a plurality of first fins extending inwardly from first faces of the heat conducting portions and located between the heat conducting portions, and a plurality of second fins extending outwardly from second faces of the heat conducting portions. Two heat pipes connect the base and the two heat sinks. Each heat pipe includes a first section thermally engaged with the base, and two second sections extending from the base and thermally engaged with the heat conducting portion of a corresponding heat sink. The second sections are located outside a hub and below fan blades of an impeller of a fan mounted on the heat sinks.

摘要翻译： 散热装置包括一个底座和两个通过铝挤压形成的散热片，并位于基座上。 每个散热器包括导热部分。 两个散热器包括从导热部分的第一面向内延伸并位于导热部分之间的多个第一散热片和从导热部分的第二面向外延伸的多个第二散热片。 两根热管连接底座和两个散热片。 每个热管包括与基座热接合的第一部分和从基部延伸并与相应散热器的导热部分热接合的两个第二部分。 第二部分位于轮毂外部，并位于安装在散热器上的风扇的叶轮的风扇叶片下方。

公开(公告)号：US20080174964A1

公开(公告)日：2008-07-24

申请号：US11626188

申请日：2007-01-23

申请人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

发明人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28F1/12 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a plurality of first fins extending inwardly from first faces of the heat conducting portions and located between the heat conducting portions, and a plurality of second fins extending outwardly from second faces of the heat conducting portions. Two heat pipes connect the base and the two heat sinks. Each heat pipe includes a first section thermally engaged with the base, and two second sections extending from the base and thermally engaged with the heat conducting portion of a corresponding heat sink. The second sections are located outside a hub and below fan blades of an impeller of a fan mounted on the heat sinks.

摘要翻译： 散热装置包括一个底座和两个通过铝挤压形成的散热片，并位于基座上。 每个散热器包括导热部分。 两个散热器包括从导热部分的第一面向内延伸并位于导热部分之间的多个第一散热片和从导热部分的第二面向外延伸的多个第二散热片。 两根热管连接底座和两个散热片。 每个热管包括与基座热接合的第一部分和从基部延伸并与相应散热器的导热部分热接合的两个第二部分。 第二部分位于轮毂外部，并位于安装在散热器上的风扇的叶轮的风扇叶片下方。

公开(公告)号：US08579017B2

公开(公告)日：2013-11-12

申请号：US12620500

申请日：2009-11-17

申请人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： H01L23/427 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink.

摘要翻译： 示例性散热装置包括连接板，第一散热器，第二散热器和第二平坦化热管。 第一散热器包括安装在连接板的底部上的基板和插入连接板中并接触基板的多个圆柱形销。 第二散热器包括散热器和从散热器一体延伸的多个矩形固体翅片。 散热器接合连接板。 热管将第一散热器的基板和第二散热器的第二散热器热连接。

公开(公告)号：US08579016B2

公开(公告)日：2013-11-12

申请号：US12688794

申请日：2010-01-15

申请人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： F28D15/02

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.

摘要翻译： 散发由安装在印刷电路板上的电子元件产生的热的示例性散热装置包括支撑件，导热基座，第一翅片组件和热管。 导热基座牢固地附接到支撑件的底侧并与电子元件热接触。 第一翅片组件牢固地附接到支撑件的顶侧。 热管包括夹在支撑件和导热基座之间的蒸发器，以及延伸穿过支撑件并在第一翅片组件中延伸的冷凝器。

公开(公告)号：US08004843B2

公开(公告)日：2011-08-23

申请号：US12565712

申请日：2009-09-23

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.

摘要翻译： 散热装置用于散发由安装在印刷电路板上并具有不同高度的多个电子部件产生的热量。 散热装置包括连接构件和安装在连接构件上并位于上述一个电子部件上的第一基座。 多个连接构件延伸穿过印刷电路板并与第一基座接合以在印刷电路板上的电子部件之一上组装第一基座。 第一基座和电子部件之间的距离可通过调节连接部件来调节，以使第一基座与电子部件之一紧密接触。

公开(公告)号：US07990719B2

公开(公告)日：2011-08-02

申请号：US12610388

申请日：2009-11-02

申请人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H05K7/20154

摘要： A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.

摘要翻译： 散热装置用于散发电子系统中安装在印刷电路板上的电子元件产生的热量。 电子元件具有不同的高度。 所述散热装置包括连接板，安装在所述连接板上的至少两个弹性部件和散热器，所述散热器具有安装在所述连接板上且位于所述电子部件之一上方的基板。 多个接合构件延伸穿过印刷电路板并与衬底接合以将衬底附着在印刷电路板上的一个电子部件上。 基板和连接板之间的距离可通过调节连接部件来调节，以使基板与一个电子部件紧密接触。

公开(公告)号：US20080024986A1

公开(公告)日：2008-01-31

申请号：US11309345

申请日：2006-07-28

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen ,  Zhan Wu

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen ,  Zhan Wu

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.

摘要翻译： 夹具包括主体，致动构件，第一钩板和第二钩板。 主体包括支撑部分和从支撑部分的相对侧延伸的一对间隔开的臂。 致动构件包括支撑在支撑部上的凸轮。 第一钩板可拆卸地联接到主体的臂的远端。 第二钩板延伸穿过支撑部分并且枢转地联接到致动构件的凸轮。 致动构件可相对于第二钩板在锁定位置和解锁位置之间转动。

公开(公告)号：US08430153B2

公开(公告)日：2013-04-30

申请号：US12643931

申请日：2009-12-21

申请人： Shou-Biao Xu ,  Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Shou-Biao Xu ,  Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： F28F7/00 ,  F28D15/00

CPC分类号： H01L23/427 ,  F28D15/0233 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions.

摘要翻译： 散热装置包括基座，安装在基座上并经由两个第一热管连接到基座的第一散热器和位于第一散热器的侧面的第二散热器，并经由 第二热管。 第一个散热片包括两个散热片组。 其中一个翅片组堆叠在另一个翅片组上。 每个翅片组包括从翅片组的中心沿着水平方向沿翅片组的周边径向扩散的多个翅片。

公开(公告)号：US07606030B2

公开(公告)日：2009-10-20

申请号：US11955308

申请日：2007-12-12

申请人： Shi-Wen Zhou ,  Chun-Chi Chen ,  Guo Chen

发明人： Shi-Wen Zhou ,  Chun-Chi Chen ,  Guo Chen

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a spreader, a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate, a heat pipe thermally connecting the heat sink and the spreader together, a plurality of fasteners each including a fixture having a head at a top thereof, a spring encircling the fixture and a gasket wired on the fixtures. The fixtures extend through the base plate of the heat sink and the spreader, the gaskets are respectively compressed between the heads and the base plate, edge of the base plate of the heat sink is joined with the housing of the computer, and cooperates with the housing to form a hermetic encapsulation which encloses the heat-generating electronic component.

摘要翻译： 一种散热装置，包括一个散热器，一个散热器，包括一个基板和从该基板顶表面向上延伸的多个外部散热片，一个将散热片和吊具热连接在一起的热管，每个 包括在其顶部具有头部的固定装置，围绕固定装置的弹簧和连接在固定装置上的垫圈。 固定装置延伸穿过散热器的基板和吊具，垫片分别在头部和基板之间被压缩，散热片的底板的边缘与计算机的外壳相连接，并与 壳体以形成封闭发热电子部件的气密封装。

公开(公告)号：US07443677B1

公开(公告)日：2008-10-28

申请号：US11776862

申请日：2007-07-12

申请人： Shi-Wen Zhou ,  Chun-Chi Chen ,  Guo Chen

发明人： Shi-Wen Zhou ,  Chun-Chi Chen ,  Guo Chen

IPC分类号： H05K7/20 ,  H01L23/36

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device comprises a first heat sink (10) for thermally contacting with an electronic device, a second heat sink (20) mounted on the first heat sink, heat pipes (40) connecting with both the first and second heat sinks. The heat pipes surround an entire periphery of the first heat sink and a part of the second heat sink. Each heat pipe comprises an evaporating portion (42), a first condensing portion (46) and a second condensing portion (44). The first and second condensing portions extend from two opposite ends of the evaporating portion respectively. The evaporating portion is positioned adjacent to the electronic device and the two condensing portions extend inwardly and bend in opposite directions to each other. The first condensing portion extends through the first heat sink and the second condensing portion extends through the second heat sink.

摘要翻译： 散热装置包括用于与电子装置热接触的第一散热器（10），安装在第一散热器上的第二散热器（20），与第一和第二散热片两者连接的热管（40）。 热管围绕第一散热器的整个周边和第二散热器的一部分。 每个热管包括蒸发部分（42），第一冷凝部分（46）和第二冷凝部分（44）。 第一和第二冷凝部分别从蒸发部分的相对两端延伸。 蒸发部分位于电子装置附近，两个冷凝部分向内延伸并且彼此相反的方向弯曲。 第一冷凝部分延伸穿过第一散热器，第二冷凝部分延伸穿过第二散热器。